JP2015109262A - Substrate terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate terminal capable of reducing cost of manufacture by simplifying a structure.SOLUTION: A substrate terminal 1 includes: a pair of terminal parts 3 which are disposed while opposing each other at a predetermined interval therebetween and can be electrically connected with a lead terminal 21 of an electronic component 20 that is inserted from a rear side into a through hole 13 and protrudes on a front side, while receiving and holding the lead terminal 21 within the predetermined interval therebetween; a pair of substrate packaging parts 2 which are connected to lower end portions of the pair of terminal parts 3, respectively, and joined onto a printed circuit board 10 at positions in the vicinity of the through hole 13; and an adsorbed part 4 which is formed by linking upper end portions of the pair of terminal parts 3 and includes a planar portion 4a on its top face.

Description

The present invention relates to a board terminal that is mounted on a circuit board and electrically connects a circuit component such as an electronic component and the circuit board.

Conventionally, an electronic component such as a semiconductor device (IC) is electrically connected to a printed circuit board (circuit board) so that the electronic component can be mounted, and an external terminal (lead portion) of the electronic component.
There is known a socket terminal for connecting a terminal by a contact terminal provided inside (see, for example, Patent Document 1). Such a socket terminal is mounted by being soldered to the printed circuit board through a through hole formed so as to penetrate a predetermined position of the printed circuit board. The socket terminal mounted on the printed circuit board in this way, when the external terminal of the electronic component is inserted into the socket terminal, the contact terminal of the socket terminal is in elastic contact with the external terminal of the electronic component, and both are conducted, Information can be transmitted between the electronic component and the printed circuit board via the socket terminal.

When mounting the socket terminal as described above on the printed board, the working efficiency of the mounting work on the printed board is increased by automatic mounting using an automatic mounting machine. This automatic mounting is performed by placing the socket terminal at a desired position on the printed circuit board and soldering it in a state where the socket terminal is sucked and held by the automatic mounting machine. Thus, in automatic mounting, since it is necessary to suck and hold the socket terminal on the automatic mounting machine, a suction jig such as a suction pad is attached to the upper part of the socket terminal, and the automatic mounting machine is attached via this suction jig. Adsorption is performed, and after the socket terminal is mounted on the printed circuit board, it is necessary to remove the adsorption jig from the socket terminal.

However, since automatic mounting using such a suction jig requires a troublesome work process such as attachment / detachment of the suction jig, the work efficiency of mounting the socket terminal to the printed circuit board is improved. Therefore, it is desirable that automatic mounting on a printed circuit board is possible without using a suction jig. Therefore, a substrate terminal that can be automatically mounted without using a suction jig has been proposed (see, for example, Patent Document 2).

JP 2000-36344 A JP 2007-299663 A

However, in the conventional board terminal as described above, it is necessary to form a metal plate into a predetermined shape by pressing such as punching and bending due to a structure having a three-dimensionally complicated shape. There is a problem that wasteful materials (carriers and the like) are generated, the manufacturing process is complicated, and the manufacturing cost of the terminal for the board is increased.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate terminal that can reduce the manufacturing cost with a simple structure.

In order to achieve the above object, the board terminal according to the first aspect of the present invention is surface-mounted on one surface of a circuit board (for example, the printed board 10 in the embodiment), and penetrated through the circuit board. A board terminal connectable to a circuit component (for example, the electronic component 20 in the embodiment) disposed on the other surface of the circuit board through a hole (for example, the through hole 13 in the embodiment), and having a predetermined interval The lead terminals of the circuit components that are arranged to face each other and are inserted into the through hole from the other surface side and project to the one surface side are received and sandwiched within the predetermined interval, A pair of electrically connectable terminal portions and a pair of lower end portions of the pair of terminal portions that are joined to the circuit board at a position in the vicinity of the through hole on the one surface. A plate mounting portion, the formed by connecting the upper ends of the pair of terminal portions, and includes a target suction portion having a flat portion on the upper surface.

In the board terminal according to the first aspect of the present invention, the lower surfaces of the pair of board mounting portions extend on the same plane, the lower surfaces are joined to the circuit board, and the board mounting portion serves as the circuit board. It is preferable that the flat portion of the attracted portion is provided so as to extend substantially parallel to the same plane.

A circuit board component according to a second aspect of the present invention is a circuit component that is surface-mounted on one surface of a circuit board and disposed on the other surface of the circuit board through a through-hole penetrating through the circuit board. Connectable board terminals, which are arranged to face each other at a predetermined interval, and are inserted into the through-holes from the other surface side, and lead terminals of the circuit component parts projecting to the one surface side A pair of terminal portions that can be received and sandwiched within a predetermined interval and electrically connected to the lead terminal, and lower ends of the pair of terminal portions are connected to each other, and the bottom surface of the through hole on the one surface A board mounting portion that is joined to the circuit board at a position near the top of the circuit board, and an attracted portion that is connected to the upper end portion of one of the pair of terminal portions and that extends horizontally and has a flat portion on the upper surface. Is done.

In the substrate terminal according to the second aspect of the present invention described above, the lower surface of the substrate mounting portion is bonded to the circuit board, and the substrate mounting portion is bonded to the circuit substrate. It is preferable that the flat portion of the suction portion is provided so as to extend substantially parallel to the lower surface of the substrate mounting portion.

In the substrate terminal according to the first and second aspects of the present invention, the substrate mounting portion and the terminal portion are formed by bending a metal strip extending in a predetermined direction along a fold line substantially orthogonal to the predetermined direction. And the adsorbed part are preferably formed.

Further, in the substrate terminals according to the first and second aspects of the present invention described above, the pair of terminal portions are formed so as to be elastically deformable in the facing direction with their projections facing each other and from the other surface side. It is preferable to elastically hold the lead terminals of the circuit components that are inserted into the through-holes and protrude to one surface side.

The substrate terminal according to the first aspect of the present invention has a simple structure in which, for example, a metal plate or the like is bent to form the substrate mounting portion, the terminal portion, and the attracted portion continuously and integrally. In addition, while ensuring connection reliability and realizing automatic mounting by direct adsorption, it is possible to reduce manufacturing costs by reducing raw materials and manufacturing processes. In addition, in the terminal for a board according to the present invention, the free end of the terminal part as in the conventional product is formed in an open state by a configuration in which each end part of the terminal part is connected to both the board mounting part and the attracted part. Compared to the case where it is done, the deformation (opening) of the terminal part is suppressed to prevent the spring property from being deteriorated by repeated use, so its durability is improved and stable connection reliability is ensured over a long period of time. Is possible.

In the substrate terminal according to the second aspect of the present invention, since the substrate mounting portion is formed by connecting the lower end portions of the pair of terminal portions, a lead terminal is inserted between the pair of terminal portions arranged to face each other. And
When the pair of terminal portions are spread and come into contact with the lead terminals, a reaction force corresponding to the contact pressure is received by the board mounting portion. For this reason, the reaction force corresponding to the contact pressure does not act on the joint portion between the board mounting portion and the circuit board, so that the joint strength between the board mounting portion and the circuit board that can withstand the reaction force is not required. It can be configured.

It is a front view (partial sectional view) showing the state where the board terminal concerning a 1st embodiment was mounted in the printed circuit board. The said board | substrate terminal is shown, (a) is a front view, (b) is a side view. The printed circuit board is shown, (a) is a plan view showing a state before the board terminals are mounted, and (b) is a plan view showing a state after the board terminals are mounted. The board terminal mounted in the said printed circuit board is shown, (a) is a front view (partial sectional view) which shows the state before mounting | wearing with an electronic component, (b) shows the state after mounting | wearing with an electronic component. It is a front view (partial sectional view). The board | substrate terminal which concerns on 2nd Embodiment is shown, (a) is a front view, (b) is a side view, (c) is a top view, (d) is a bottom view. It is sectional drawing which shows the terminal for board | substrates concerning 2nd Embodiment mounted in the printed circuit board from the VI-VI direction in FIG.5 (d).

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. First, the substrate terminal 1 according to the first embodiment is shown in FIGS. 1 to 4. First, the configuration of the substrate terminal 1 will be described with reference to FIG. This board terminal 1 is printed circuit board (circuit board) 1
A lead terminal 21 of an electronic component (circuit component) 20 that is mounted on the front surface side of 0 and mounted on the back surface side of the printed circuit board 10 is received through the through hole 13, and the wiring pattern 12 between the electronic component 20 and the printed circuit board 10 is received. Are electrically connected to each other. In the following,
For convenience of explanation, as shown by the arrows, as the mounting state of the board terminal 1 to the printed circuit board 10, with the posture in which the printed circuit board 10 is disposed horizontally, the front and back direction of the printed circuit board 10 is the vertical direction,
In the following description, the width direction of the board terminal 1 is defined as the front-rear direction, and the symmetrical direction of the board terminal 1 is defined as the left-right direction.

First, the printed circuit board 10 includes a flat substrate 11 made of an insulating material such as an epoxy resin, and a conductor wiring pattern 12 is formed on the surface of the substrate 11.
An electronic component 20 is attached to the back side. The printed board 10 has a through hole 13 penetrating vertically so as to open to the wiring pattern 12. A terminal mounting land 14 is formed in a portion surrounding the through hole 13 on the front surface side of the printed board 10 to form a part of the wiring pattern 12 and to solder-connect the connection terminal 1 to the wiring pattern 12.

Examples of the electronic component 20 include an LED, a sensor, a coil, an IC package, and a daughter board. However, the electronic component 20 is not particularly limited as long as it is a circuit component having the lead terminal 21. Also,
The number of lead terminals 21 in the electronic component 20 is not particularly limited, and the board terminals 1 may be mounted on the printed board 10 by the number of lead terminals 21.

The board terminal 1 includes a pair of board mounting portions 2 and 2 joined to the terminal mounting land 14 of the printed circuit board 10 and a pair of oppositely extending bent upwards from the inner end of each board mounting portion 2. The terminal portions 3 and 3 and the attracted portion 4 which is bent inward from the upper end portion of each terminal portion 3 and connects the pair of terminal portions 3 and 3 are integrally formed. The board terminal 1 has a width of 1.6 [
mm] and 0.2 [mm] long strip-like conductive material (metal material such as phosphor bronze or beryllium copper) cut to a length matching the overall length of the substrate terminal 1 As a substrate,
The metal band plate is formed by bending the shape shown in the figure along a fold line orthogonal to the longitudinal direction. Further, the substrate terminal 1 has a structure in which a nickel plating with a thickness of about several μm is applied to its surface as a base, and a tin plating with a thickness of about several μm is applied as a finish.

The board mounting portion 2 is formed in a substantially rectangular flat plate shape, and is soldered to a terminal mounting land 14 on the printed board 10 to which cream solder has been applied in advance, whereby the board terminal 1 is connected to the printed board 10. It can be surface-mounted at a desired position on the top.

The terminal portion 3 includes a lower terminal portion 3a that extends obliquely upward and inward from the inner end portion of the board mounting portion 2, and an upper terminal portion 3b that extends obliquely upward and outward from the upper end portion of the lower terminal portion 3a. Thus, a contact portion 3c is formed at a connection portion between the lower terminal portion 3a and the upper terminal portion 3b. The contact portion 3c is a portion that contacts the lead terminal 21 of the electronic component 20. The terminal portion 3 can be oscillated and displaced by being elastically bent and deformed in the thickness direction with the connecting portion between the terminal portion 3 and the board mounting portion 2 as a support end portion. The interval between the pair of contact portions 3c, 3c is formed slightly smaller than the lead terminal 21 of the electronic component 20. When the lead terminal 21 is inserted between the pair of terminal portions 3, 3, each terminal portion Based on the elastic force (restoring force) 3, the pair of contact portions 3 c, 3 c can be elastically contacted with the lead terminal 21 sandwiched from both sides. The pair of lower terminal portions 3a and 3a are formed in a substantially letter-shaped shape (broadened toward the end) when viewed from the front, whereby the lead terminal 21 of the electronic component 20 passes between the pair of contact portions 3c and 3c. It is possible to guide smoothly.

The sucked portion 4 has a flat surface 4a that is substantially horizontal when the board terminal 1 is mounted on the printed board 10, and has a shape that can be directly sucked by an automatic mounting machine (not shown). ing. Therefore, in a state where the attracted part 4 is directly attracted to the automatic mounting machine without using a suction jig or the like,
It is possible to surface-mount the substrate terminal 1 by aligning it with a desired or arbitrary position on the printed circuit board 10.

Next, the operation of the substrate terminal 1 will be described. As shown in FIG. 3, the board terminal 1 is solder-bonded and mounted on a terminal mounting land 14 to which cream solder has been applied in advance on a printed board 10. In order to perform solder bonding, first, the board mounting portion 2 of the board terminal 1 is positioned on the terminal mounting land 14 of the printed circuit board 10 in a state where the sucked portion 4 of the board terminal 1 is sucked to the automatic mounting machine. The board terminal 1 is placed on the printed board 10. In this state, the entire board terminal 1 is heated to melt the solder, whereby the board terminal 1 is bonded and mounted on the printed board 10. In a state where the board terminal 1 is mounted on the printed board 10, the central axis of the through hole 13 and the central axis of the board terminal 1 substantially coincide.

Subsequently, as shown in FIG. 4, the lead terminal 21 of the electronic component 20 can be attached to the board terminal 1 mounted on the printed board 10 from the back side of the printed board 10 through the through hole 13. is there. In the electronic component 20, the lead portion 21 is inserted into the through hole 13 from the back side of the printed circuit board 10, and is further passed between the pair of board mounting portions 2 and 2, and protrudes to the front surface side of the printed circuit board 10. It is attached to the board terminal 1 in a state.

At this time, as described above, the facing distance between the pair of contact portions 3c, 3c is formed slightly smaller than the lead terminal 21 of the electronic component 20, so that the lead terminal 21 of the electronic component 20 is paired with the pair of contact portions 3c. , 3c is inserted between the pair of contact portions 3c, 3c by the lead terminal 21.
Are spread in the direction of separating from each other (left and right outward). On the other hand, the terminal part 3 is the terminal part 3.
And the board mounting part 2 can be elastically bent and oscillated with the connecting part as a support end part, and the lead terminals 21 can be moved in the same direction by a restoring force in a direction in which the pair of contact parts 3c and 3c approach each other. Therefore, the lead terminal 21 is elastically sandwiched between the pair of contact portions 3c and 3c, is held in contact with the pressed state, and is electrically connected. Therefore, the lead terminal 21 of the electronic component 20 is not easily removed from the board terminal 1. In this way, the electronic component 20 is electrically connected to the wiring pattern 12 of the printed board 10 via the board terminal 1.

As described above, in the substrate terminal 1 according to the first embodiment, for example, a metal strip having a predetermined length is bent to form the substrate mounting portion 2, the terminal portion 3, and the attracted portion 4 continuously and integrally. As it is a simple structure that does not require press processing (punching) like conventional products, it can be manufactured only by forming processing, ensuring connection reliability and automatic mounting by direct adsorption, Manufacturing costs can be reduced by reducing raw materials and manufacturing processes. Further, in the substrate terminal 1 according to the present embodiment, each end portion (fixed end, free end) of the terminal portion 3 is connected to both the substrate mounting portion 2 and the attracted portion 4, thereby providing a conventional product. Compared with the case where the free end of such a terminal portion is formed in a released state, the rigidity of the entire terminal 1 for the board is ensured, and the deformation (opening) of the terminal portion is suppressed to reduce the spring property due to repeated use. Therefore, the durability is improved, and stable connection reliability can be ensured over a long period of time.

Next, a substrate terminal 50 according to a second embodiment will be described with reference to FIGS. In the substrate terminal 1 according to the first embodiment described above, the upper ends of the terminal portions 3 and 3 are adsorbed portions 4.
Therefore, the contact pressure with the lead terminal 21 is easily secured. However, on the other hand, by inserting the lead terminal 21, the reaction force according to the contact pressure (
The force acting toward the left and right outside so as to widen the facing distance between the terminal portions 3 and 3 acts on the board mounting portion 2, so that it can withstand the reaction force at the joint between the printed board 10 and the board mounting portion 2. Sufficient joint strength to obtain is required. On the other hand, the board terminal 50 according to the second embodiment to be described below is configured such that the reaction force does not act on the joint (board mounting part). Hereinafter, the board terminal 50 will be described with reference to FIGS. 5 and 6.
For convenience of explanation, description will be made by defining front and rear, left and right and up and down directions as indicated by arrows in FIGS.

The board terminal 50 is formed by using a conductive metal strip in the same manner as the board terminal 1 described above, and is mounted on the front side of the printed board 10 and mounted on the back side of the printed board 10. 20 (lead terminal 21) and printed circuit board 10 (wiring pattern 12) are used for electrical connection (details will be described later). In the following, description common to the above-described substrate terminal 1 will be omitted, and the description will focus on a configuration different from the substrate terminal 1.

First, the configuration of the board terminal 50 will be described. As shown in FIG. 5A, the board terminal 50 is formed in a flat plate shape and joined to the terminal mounting land 14 of the printed board 10, and the right side end of the board mounting part 52. A first terminal portion 53 formed to be connected and bent and extended upward; a second terminal portion 54 formed to be connected to the left end portion of the substrate mounting portion 52 and bent and extended upward; and a first terminal The portion 53 is connected to the upper end portion of the portion 53 and is bent and formed to extend to the left.

As shown in FIG. 5D, the board mounting portion 52 includes a mounting main body portion 52a formed in a substantially rectangular flat plate shape, and carrier connecting portions 52b, 5 extending front and rear from the front and rear end portions of the mounting main body portion 52a.
2b. In the center of the mounting main body 52a, the lead terminal 2 of the electronic component 20 is provided.
Lead terminal insertion hole 52c having a size (opening area) through which 1 can be inserted and penetrating in the vertical direction
Is formed. The board mounting portion 52 has a left-right width corresponding to the left-right width of the terminal mounting land 14 (see FIG. 3) and a front-rear width corresponding to the front-rear width of the terminal mounting land 14. As will be described later, the lead terminal 21 of the electronic component 20 mounted on the back side of the printed circuit board 10 is inserted into the board terminal 50 through the lead terminal insertion hole 52c.

As shown in FIG. 5A, the first terminal portion 53 includes a lower terminal portion 53a extending obliquely leftward from the right end portion of the board mounting portion 52 and an obliquely rightward extending from the upper end portion of the lower terminal portion 53a. An upper terminal portion 53b extending upward is formed, and a contact portion 53c serving as a portion in contact with the lead terminal 21 is formed at a connection portion between the lower terminal portion 53a and the upper terminal portion 53b.

The attracted portion 55 is formed to extend to the left connected to the upper end portion of the first terminal portion 53 (upper terminal portion 53b), and has a flat surface 55a that can be attracted by an automatic mounting machine on the upper surface side. doing. The attracted portion 55 is formed so as to be substantially parallel to the substrate mounting portion 52 (so that the flat surface 55a is substantially parallel to the lower surface of the substrate mounting portion 52).

As shown in FIG. 5A, the second terminal portion 54 includes a lower terminal portion 54a that extends obliquely upward to the right from the left end portion of the board mounting portion 52, and an obliquely left portion from the upper end portion of the lower terminal portion 54a. The upper terminal portion 5 that extends upward and has a length that is about half of the upper terminal portion 53 b that forms the first terminal portion 53.
4b, and a contact portion 54c serving as a portion in contact with the lead terminal 21 is formed at a connection portion between the lower terminal portion 54a and the upper terminal portion 54b.

Thus, the 1st terminal part 53 and the 2nd terminal part 54 are separated without the mutual upper part being connected, and are formed in the cantilever support shape. Therefore, the first terminal portion 53 can be oscillated and displaced by being elastically bent and deformed in the left-right direction with the connection portion between the first terminal portion 53 and the board mounting portion 52 as a support end portion. The portion 54 can be oscillated and displaced by elastically bending and deforming in the left-right direction with the connecting portion between the second terminal portion 54 and the board mounting portion 52 as a support end. The first
The contact portion 53c of the terminal portion 53 and the contact portion 54c of the second terminal portion 54 are opposed to each other in the left-right direction, and the distance between the opposed portions (the interval indicated by A in FIG. 5A) is the left-right width of the lead terminal 21. It is formed somewhat smaller than.

Next, the operation of the thus configured substrate terminal 50 will be described with additional reference to FIG.

Before describing the operation of the board terminal 50, a procedure for mounting the board terminal 50 on the printed board 10 and a procedure for mounting the electronic component 20 on the printed board 10 on which the board terminal 50 is mounted will be described. When mounting the board terminals 50, first, cream solder is applied to the terminal mounting lands 14 formed on the surface side of the printed board 10. And the to-be-adsorbed part 55 is attracted | sucked with an automatic mounting machine, the board | substrate terminal 50 is conveyed, and the board | substrate mounting part 5 of the board | substrate terminal 50 is shown.
2 is placed on the terminal mounting land 14, and the board terminal 50 is mounted on the printed board 10. In this state, the entire printed circuit board 10 on which the board terminals 50 are mounted is heated to melt the cream solder, whereby the board mounting portion 52 is soldered to the terminal mounting lands 14 and the board terminals 50 are printed. It is mounted on the substrate 10. When the board terminal 50 is mounted on the printed circuit board 10, the central axis of the through hole 13 and the central axis of the board terminal 50 (the central axis C shown in FIG. 5A) substantially coincide with each other. Yes.

Subsequently, the electronic component 20 is mounted on the back side of the printed board 10 on which the board terminals 50 are mounted on the front side in this manner. At this time, as shown in FIG.
The lead terminal 21 is inserted upward into the board terminal 50 through the through hole 13 and the lead terminal insertion hole 52 c of the board mounting portion 52. As described above, since the facing distance A between the contact portion 53c and the contact portion 54c is somewhat smaller than the left-right width of the lead terminal 21, the lead terminal 21 inserted into the board terminal 50 has contact portions 53c, 54c. To the left and right outer sides (pushing the facing distance A wide), thereby contacting the contact portions 53c and 54c.
It is sandwiched between them. In this way, the contact parts 53c and 54c come into contact with the lead terminal 21 so as to be elastically sandwiched from both the left and right sides, and the electronic component 20 (lead terminal 21) and the printed circuit board 10 (wiring pattern 12) are electrically connected. Connected.

Thus, the force that acts when the lead terminal 21 is elastically held between the contact portions 53c and 54c will be described in more detail. Since the first terminal portion 53 and the second terminal portion 54 are separated in the upper part of the board terminal 50, the lead terminal 21 is inserted between the contact portions 53c and 54c, and the first terminal portion 53 and the second terminal portion. When a force is applied to the left and right outer sides, the first terminal portion 53 and the second terminal portion 54 are bent and deformed with the connection portion with the board mounting portion 52 as a support end portion. As a result, the contact portion 53 c contacts the lead terminal 21 with a contact pressure (restoring force) corresponding to the amount of bending deformation of the first terminal portion 53, and the contact portion 54 c is in contact with the second terminal portion 5.
4 is brought into contact with the lead terminal 21 with a contact pressure (restoring force) corresponding to the amount of bending deformation. At this time, a reaction force corresponding to the contact pressure of the contact parts 53c and 54c acts on the board mounting part 52, and this board mounting part 52 is formed by being connected to the lower ends of the first terminal part 53 and the second terminal part 54. Thus, the reaction force is received by the board mounting portion 52. For this reason, since the reaction force according to the contact pressure does not act on the joint portion between the board mounting portion 52 and the terminal mounting land 14, the joint portion between the board mounting portion 52 and the terminal mounting land 14 is used as the reaction force. It is possible to adopt a configuration that does not require a bonding strength that can withstand the above.

The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and can be improved as appropriate without departing from the gist of the present invention.

In the above-described embodiment, the terminal portions of the board terminals 1 and 50 are described by exemplifying the case where the terminal portions are bent in a substantially square shape with the convex portion facing inward when viewed from the front. However, the present invention is limited to this configuration. For example, it may be formed in an arc shape with a convex inward.

Further, the width dimension and the thickness dimension of the board terminal 1 shown in the above-described embodiment are merely examples, and are not necessarily limited to such dimensions, and are matched to the printed board or electronic component to be used. Can be changed as appropriate.

Moreover, although the above-mentioned embodiment illustrated and demonstrated the structure which connected the lead terminal and board | substrate terminal of the electronic component through the through hole (through-hole by which the inner wall was plated), it connected the front and back of a printed circuit board. If it is a through-hole, it will not specifically limit.

In addition, examples of the printed circuit board on which the board terminals 1 and 50 of the present embodiment are surface-mounted include, for example, a single-sided board in which wiring pattern printing is performed only on one side, and a double-sided board in which wiring pattern printing is performed on both sides Any of a multilayer substrate in which an intermediate layer is formed midway in the thickness direction, a flexible substrate having flexibility capable of bending deformation, and the like may be used.

Further, in the above-described embodiment, the case where the metal strip is subjected to forming processing to form the substrate terminal has been described as an example, but naturally, the metal thin plate is subjected to press processing (punching processing, bending processing). Can also be formed.

DESCRIPTION OF SYMBOLS 1 Board terminal 2 Board mounting part 3 Terminal part 3a Lower terminal part 3b Upper terminal part 3c Contact part 4 Adsorbed part 4a Flat surface (flat part)
10 Printed circuit board (circuit board)
11 Substrate 12 Wiring pattern 13 Through hole (through hole)
14 Land for mounting terminals 20 Electronic parts (circuit components)
21 Lead terminal

Claims (6)

A circuit board terminal that is surface-mounted on one surface of the circuit board and is connectable to a circuit component disposed on the other surface of the circuit board through a through-hole penetrating the circuit board.
The lead terminals of the circuit components that are arranged to face each other at a predetermined interval and are inserted into the through hole from the other surface side and project to the one surface side are received and sandwiched within the predetermined interval, A pair of terminal portions electrically connectable to the lead terminals;
A pair of board mounting parts connected to the lower ends of the pair of terminal parts, respectively, and joined on the circuit board at a position near the through hole on the one surface;
A substrate terminal comprising: an adsorbed portion formed by connecting upper ends of the pair of terminal portions and having a planar portion on an upper surface thereof. The bottom surfaces of the pair of board mounting portions extend on the same plane, and the bottom surface is joined to the circuit board so that the board mounting portion is joined to the circuit board,
The board terminal according to claim 1, wherein the planar portion of the attracted portion is provided to extend substantially parallel to the same plane. A circuit board terminal that is surface-mounted on one surface of the circuit board and is connectable to a circuit component disposed on the other surface of the circuit board through a through-hole penetrating the circuit board.
The lead terminals of the circuit components that are arranged to face each other at a predetermined interval and are inserted into the through hole from the other surface side and project to the one surface side are received and sandwiched within the predetermined interval, A pair of terminal portions electrically connectable to the lead terminals;
A board mounting portion formed by connecting lower ends of the pair of terminal portions, the lower surface of which is joined to the circuit board at a position near the through hole on the one surface;
A substrate terminal comprising: an adsorbed portion connected to an upper end portion of one of the pair of terminal portions and extending horizontally and having a flat portion on an upper surface. The lower surface of the board mounting part is joined to the circuit board, and the board mounting part is joined to the circuit board,
The substrate terminal according to claim 3, wherein the flat portion of the attracted portion is provided so as to extend substantially parallel to a lower surface of the substrate mounting portion. 2. The board mounting portion, the terminal portion, and the attracted portion are formed by bending a metal strip extending in a predetermined direction along a fold line substantially orthogonal to the predetermined direction. The terminal for a board | substrate as described in any one of -4. The pair of terminal portions are formed so as to be elastically deformable in the opposing direction with their projections facing each other, and inserted into the through hole from the other surface side and projecting to the one surface side The board terminal according to any one of claims 1 to 5, wherein a lead terminal of a component is elastically clamped.

Images