WO2003081641B1 - Support clip - Google Patents

Support clip

Info

Publication number
WO2003081641B1
WO2003081641B1 PCT/US2003/008533 US0308533W WO03081641B1 WO 2003081641 B1 WO2003081641 B1 WO 2003081641B1 US 0308533 W US0308533 W US 0308533W WO 03081641 B1 WO03081641 B1 WO 03081641B1
Authority
WO
WIPO (PCT)
Prior art keywords
feet
assembly
clip
support
edge
Prior art date
Application number
PCT/US2003/008533
Other languages
French (fr)
Other versions
WO2003081641A2 (en
WO2003081641A3 (en
Inventor
Francis Edward Fisher
Terence Edward Lovett
Original Assignee
Aavid Thermalloy Llc
Francis Edward Fisher
Terence Edward Lovett
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0206681A external-priority patent/GB0206681D0/en
Priority claimed from GB0212083A external-priority patent/GB0212083D0/en
Application filed by Aavid Thermalloy Llc, Francis Edward Fisher, Terence Edward Lovett filed Critical Aavid Thermalloy Llc
Priority to US10/508,435 priority Critical patent/US20050160568A1/en
Priority to AU2003225893A priority patent/AU2003225893A1/en
Priority to EP03745153A priority patent/EP1495487A2/en
Publication of WO2003081641A2 publication Critical patent/WO2003081641A2/en
Publication of WO2003081641A3 publication Critical patent/WO2003081641A3/en
Publication of WO2003081641B1 publication Critical patent/WO2003081641B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44641—Clasp, clip, support-clamp, or required component thereof having gripping member formed from, biased by, or mounted on resilient member
    • Y10T24/44744—Clasp, clip, support-clamp, or required component thereof having gripping member formed from, biased by, or mounted on resilient member with position locking-means for engaging faces
    • Y10T24/44752—Integral locking-means

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A clip for mounting a component such as a heat sink to a support such a printed circuit board, in particular to stabilize the position of the component until the clip can be soldered to the support, includes a securing portion having a pair of feet received in the support and a supporting portion having a pair of arms received in the component in an interference fit. According to a preferred embodiment, the feet are separated by a slit and are formed into parallel planes so that the feet can overlap when compressed toward each other during insertion into a hole in a printed circuit board, and have outward facing barbs which engage the printed circuit board.

Claims

AMENDED CLAIMS[received by the International Bureau on 30 July 2004 (30.07.04); original claims 1-26 replaced by amended claims 1-46 (7 pages)]
1. A clip for mounting a component to a support, said clip comprising: a securing portion comprising a main section and a foot adapted for mounting to said support; and a supporting portion extending laterally from the securing portion and adapted to be received in the component in an interference fit,* wherein, said supporting portion comprises a pair of arms which can be compressed toward each other to achieve said interference fit.
2. A clip as in claim 1 wherein said arms are provided with outward facing barbs which engage said component .
3. A clip as in claim 1 further comprising a pair of side walls which extend laterally from said main section.
4. A clip as in claim 3 wherein said foot comprises a pair of feet which extend from said sidewalls.
5. A clip as in claim 1 wherein said main section has an edge from which said foot extends, said edge being provided with arcuate undercuts adjacent to said foot .
6. A clip as in claim 1 wherein said main section has an edge from which said foot extends, said edge being positioned to space said component above the support when the assembly is mounted to a support with said edge abutting the support. 19
7. A clip as in claim 1 wherein said foot comprises a pair of feet which are spaced apart.
8. A clip as in claim 1 wherein said foot comprises a pair of feet and wherein said main section has an edge from which said feet extends said feet being separated by a slit and formed into different planes, whereby said feet can overlap at said slit when compressed toward each other.
9. A clip as in claim 8 wherein, said slit terminates at an aperture in said securing section.
10. A clip as in claim 8 wherein said feet are formed with outward facing barbs which can engage a support.
11. A clip as in claim 1 wherein said clip is stamped and formed from a single piece of sheet metal,
12. An assembly for mounting to as support, said assembly comprising; a component having a keyway; and a clip having a securing portion and a supporting portion, said securing portion comprising a main section and a foot adapted for mounting to said support, said supporting portion extending laterally from the securing portion and being received in the keyway in an interference fit, wherein said supporting portion comprises a pair of arms which are compressed toward each other to achieve said interference fit. 20
13. An assembly as in claim 12 wherein said arms are provided with outward facing barbs which engage said component.
14. An assembly as in claim 12 further comprising a pair of side walls which extend laterally from said main section and abut against said component.
15. An assembly as in claim 15 wherein said foot extends from said sidewalls.
16. An assembly as in claim 12 wherein said main section has an edge from which said foot extends, said edge being provided with arcuate undercuts adjacent to said foot.
17. An assembly as in claim 12 wherein said foot comprises a pair of feet and wherein said main section has an edge from which said feet extend, said edge being positioned to space said component above the support when the assembly is mounted to a support with said edge abutting the support.
18. An assembly as in claim 12 wherein said foot comprises a pair of feet which are spaced apart.
19. An assembly as in claim 17 wherein said main section has an edge from which said feet extend, said feet being separated by a slit and formed into different planes, whereby said feet can overlap at said slit when compressed toward each other,
20. An assembly as in claim 19 wherein said slit terminates at an aperture in said securing section. 21
21. An assembly as in claim 19 wherein said feet are formed with outward facing barbs which can engage a support.
22 An assembly as in claim 12 wherein said clip is stamped and formed from a single piece of sheet metal .
23. An assembly as in claim 12 wherein said component is an extruded heat sink.
24. An assembly as in claim 12 comprising two of said clips fixed to said component.
25. A clip for mounting a component to a support, said clip comprising: a securing portion comprising a main section and a foot adapted for mounting to said support; and a supporting portion extending laterally from the securing portion and adapted to be received in the component in an interference fit; wherein said foot comprises a pair of feet and wherein said main section has an edge from which said feet extend, said feet being separated by a slit and formed into different planes, whereby said feet can overlap at said slit when compressed toward each other, and wherein said slit terminates at an aperture in said securing section.
26. A clip as in claim 25 wherein said supporting portion comprises a pair of arms which can be compressed toward each other to achieve said interference fit. 22
27. A clip as in claim 26 wherein said arms are provided with outward facing barbs which engage said component .
28. A clip as in claim 25 further comprising a pair of side walls which extend laterally from said main section.
29. A clip as in claim 28 wherein said foot comprises a pair of feet which extend from said sidewalls.
30. A clip as in claim 25 wherein said main section has an edge from which said foot extends, said edge being provided with arcuate undercuts adjacent to said foot.
31. A clip as in claim 25 wherein said main section has an edge from which said foot, extends, said edge being positioned to space said component above the support when the assembly is mounted to a support with said edge abutting the support.
32. A clip as in claim 25 wherein, said foot comprises a pair of feet which are spaced apart.
33. A clip as in claim 25 wherein said feet are formed with outward facing barbs which can engage a support.
34. A clip as in claim 25 wherein said clip is stamped and formed from a single piece of sheet metal. 23
35, An assembly for mounting to as support, said assembly comprising: a component having a keyway; and a clip having a securing portion and a supporting portion^ said securing portion comprising a main section and a pair of feet adapted for mounting to said support, said supporting portion extending laterally from the securing portion and being received in the keyway in an interference fit; wherein said main section has an edge from which said feet extend, said feet being separated by a slit and formed into different planes, whereby said feet can overlap at said slit when compressed toward each other; and wherein said slit terminates at an aperture in said securing section,
36. An assembly as in claim 35 wherein said supporting portion comprises a pair of arms which are compressed toward each other to achieve said interference fit.
37. An assembly as in claim 36 wherein said arms are provided with outward facing barbs which engage said component.
38, An assembly as in claim 35 further comprising a pair of side walls which extend laterally from said main section and abut against said component.
39. An assembly as in claim 38 wherein said foot extends from said sidewalls.
40. An assembly as in claim 35 wherein said main section has an edge from which said foot extends, 24
said edge being provided with arcuate undercuts adjacent to said foot.
41. An assembly as in claim 35 wherein said foot comprises a pair of feet and wherein said main section has an edge from i-diich said feet extend, said edge being positioned to space said component above the support when the assembly is mounted to a support with said edge abutting the support.
42. An assembly as in claim 35 wherein said foot comprises a pair of feet which are spaced apart.
43. An assembly as in claim 35 wherein said feet are formed with outward facing barbs which can engage a support .
44. An assembly as in claim 35 wherein said clip is stamped and formed from a single piece of sheet metal .
45. An assembly as in claim 35 wherein said component is an extruded heat sink.
46. An assembly as in claim 35 comprising two of said clips fixed to said component.
PCT/US2003/008533 2002-03-21 2003-03-20 Support clip WO2003081641A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/508,435 US20050160568A1 (en) 2002-03-21 2003-03-20 Support clip
AU2003225893A AU2003225893A1 (en) 2002-03-21 2003-03-20 Support clip
EP03745153A EP1495487A2 (en) 2002-03-21 2003-03-20 Support clip

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0206681A GB0206681D0 (en) 2002-03-21 2002-03-21 Support clip
GB0206681.9 2002-03-21
GB0212083.0 2002-05-25
GB0212083A GB0212083D0 (en) 2002-05-25 2002-05-25 Support clip

Publications (3)

Publication Number Publication Date
WO2003081641A2 WO2003081641A2 (en) 2003-10-02
WO2003081641A3 WO2003081641A3 (en) 2004-07-29
WO2003081641B1 true WO2003081641B1 (en) 2004-09-23

Family

ID=28456022

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/008533 WO2003081641A2 (en) 2002-03-21 2003-03-20 Support clip

Country Status (5)

Country Link
US (1) US20050160568A1 (en)
EP (1) EP1495487A2 (en)
AU (1) AU2003225893A1 (en)
TW (1) TW200304767A (en)
WO (1) WO2003081641A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM243893U (en) * 2002-12-20 2004-09-11 Hon Hai Prec Ind Co Ltd Heat sink clip
ITMI20130520A1 (en) 2013-04-05 2014-10-06 St Microelectronics Srl CONSTRUCTION OF A HEAT SINK THROUGH WELDING

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183030A (en) * 1963-05-24 1965-05-11 Schlueter Ernest Fastening clip
SE401653B (en) * 1972-06-21 1978-05-22 Springfix Befestigungstechnik MOUNTING CLAMP FOR MOLDINGS WITH T-SHAPE ROCK
DE2915460B2 (en) * 1978-04-25 1981-01-15 Extrados Co. Ltd., Toronto, Ontario (Kanada) palette
US4509839A (en) * 1983-06-16 1985-04-09 Imc Magnetics Corp. Heat dissipator for semiconductor devices
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components
US5594624A (en) * 1994-04-05 1997-01-14 Thermalloy, Inc. Strap spring for heat sink clip assembly
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies
JPH11513841A (en) * 1995-10-13 1999-11-24 サーマロイ，インコーポレイテッド Solderable transistor clips and heat sinks
US5947191A (en) * 1997-05-07 1999-09-07 International Business Machines Electronics module heat sink with quick mounting pins
US5876084A (en) * 1997-07-15 1999-03-02 Prince Corporation Panel mounting clip
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks
US6160704A (en) * 1998-12-17 2000-12-12 Intelligent Motion Systems Integral heat-sink and motor assembly for printed circuit boards
US6252773B1 (en) * 1999-04-23 2001-06-26 Lucent Technologies, Inc Heat sink attachment apparatus and method
US6301113B1 (en) * 1999-05-07 2001-10-09 Psc Computer Products, Inc. Retainer clip for heat sink for electronic components
US6125037A (en) * 1999-08-30 2000-09-26 Sun Microsystems, Inc. Self-locking heat sink assembly and method
US6222734B1 (en) * 1999-11-29 2001-04-24 Intel Corporation Clamping heat sinks to circuit boards over processors
TW468940U (en) * 2000-04-14 2001-12-11 Foxconn Prec Components Co Ltd Joggles of thermal dissipative device**941
TW491488U (en) * 2000-07-28 2002-06-11 Foxconn Prec Components Co Ltd Heat sink buckle device
US6513205B1 (en) * 2000-09-15 2003-02-04 Acme United Corporation Multi-product holding and retaining system
US6430049B1 (en) * 2000-12-22 2002-08-06 Foxconn Precision Components Co., Ltd. Clip for heat sink
US20030061688A1 (en) * 2001-09-28 2003-04-03 Rodriguez Maria Del Carmen Ergonomic binder clip

Also Published As

Publication number Publication date
US20050160568A1 (en) 2005-07-28
TW200304767A (en) 2003-10-01
EP1495487A2 (en) 2005-01-12
WO2003081641A2 (en) 2003-10-02
AU2003225893A8 (en) 2003-10-08
WO2003081641A3 (en) 2004-07-29
AU2003225893A1 (en) 2003-10-08

Similar Documents

Publication Publication Date Title
US5978232A (en) Computer body with a fixing device
WO2008082533A3 (en) Low profile surface mount poke-in connector
US7451536B2 (en) Lance-tab mounting method
JPH0613116A (en) Electric-connecter holding device
US5899771A (en) Device for fixing an electrical connector to a printed circuit board
WO2003021112A3 (en) Fixing clamp for anchoring a component in the hole of a support plate
CA2552089A1 (en) Circuit board mounting bracket
WO2003081641B1 (en) Support clip
CA2403037A1 (en) Room lamp fixing structure
KR100269562B1 (en) Contact element for electrical contact of printed circuit to a front module rail of a module support structure
EP0930814A3 (en) Component mounting arrangement, clip and assembly
CA2117873A1 (en) Boardlock Clip
JP2866638B2 (en) Assembly carrier
CA2357649A1 (en) Printed circuit board mounting clip and system
JP4690578B2 (en) Electronic equipment ground pattern connection bracket and board mounting structure
JP4481805B2 (en) Metal clip
KR200358958Y1 (en) Luminaire easy to install ballast circuit board.
EP1156710A3 (en) Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component
WO1997041716B1 (en) Surface-mounted attachment means and use thereof
JPH0455422Y2 (en)
JP3898917B2 (en) Board mounting bracket
KR200146567Y1 (en) Module fixing structural member
JPH02253698A (en) Shielding case for printed board
JPH0718497U (en) Shield case
KR200213108Y1 (en) Heatsink assembling structure for printed circuit board

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 10508435

Country of ref document: US

B Later publication of amended claims

Effective date: 20040730

WWE Wipo information: entry into national phase

Ref document number: 2003745153

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003745153

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP