IT943262B - Procedimento e dispositivo per fab bricare dispositivi semiconduttori e prodotti ottenuti col procedimen to - Google Patents

Procedimento e dispositivo per fab bricare dispositivi semiconduttori e prodotti ottenuti col procedimen to

Info

Publication number
IT943262B
IT943262B IT71091/71A IT7109171A IT943262B IT 943262 B IT943262 B IT 943262B IT 71091/71 A IT71091/71 A IT 71091/71A IT 7109171 A IT7109171 A IT 7109171A IT 943262 B IT943262 B IT 943262B
Authority
IT
Italy
Prior art keywords
procedure
bricare
fab
products obtained
semiconductive devices
Prior art date
Application number
IT71091/71A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT943262B publication Critical patent/IT943262B/it

Links

Classifications

    • H10W70/048—
    • H10W70/427—
    • H10W72/5449—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
IT71091/71A 1970-12-17 1971-12-14 Procedimento e dispositivo per fab bricare dispositivi semiconduttori e prodotti ottenuti col procedimen to IT943262B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7018378A NL7018378A (enExample) 1970-12-17 1970-12-17

Publications (1)

Publication Number Publication Date
IT943262B true IT943262B (it) 1973-04-02

Family

ID=19811818

Family Applications (1)

Application Number Title Priority Date Filing Date
IT71091/71A IT943262B (it) 1970-12-17 1971-12-14 Procedimento e dispositivo per fab bricare dispositivi semiconduttori e prodotti ottenuti col procedimen to

Country Status (8)

Country Link
US (1) US3842492A (enExample)
JP (1) JPS5135349B1 (enExample)
CA (1) CA933673A (enExample)
DE (1) DE2159530C3 (enExample)
FR (1) FR2118154B1 (enExample)
GB (1) GB1372216A (enExample)
IT (1) IT943262B (enExample)
NL (1) NL7018378A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2259133C3 (de) * 1972-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer Halbleiteranordnung und Anwendung des Verfahrens
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
FR2498377A1 (fr) * 1981-01-16 1982-07-23 Thomson Csf Mat Tel Procede de fabrication de dispositifs semiconducteurs sur bande metallique
US4380042A (en) * 1981-02-23 1983-04-12 Angelucci Sr Thomas L Printed circuit lead carrier tape
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ
EP0102988B1 (en) * 1982-03-08 1988-09-21 Motorola, Inc. Integrated circuit lead frame
JPS58154241A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置及びその製法
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
US4603927A (en) * 1984-07-12 1986-08-05 Rogers Corporation Surface mounted bussing device
JPS6132452A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd リ−ドフレ−ムとそれを用いた電子装置
DE3430849A1 (de) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Verfahren zur raeumlichen ausweitung der elektrischen verbindung zwischen den anschlusskontakten hochintegrierter elektronischer bauelemente und den kontaktstellen einer elektrischen anschlussvorrichtung auf einem bauelementetraeger
JPS61192542A (ja) * 1985-02-21 1986-08-27 Nifco Inc 溶着方法
JPS6281738A (ja) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd リ−ドフレ−ムおよびそれを用いた半導体装置
EP0242962A1 (en) * 1986-04-25 1987-10-28 Inmos Corporation Offset pad semiconductor lead frame
US5466967A (en) * 1988-10-10 1995-11-14 Lsi Logic Products Gmbh Lead frame for a multiplicity of terminals
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
US6107676A (en) * 1997-03-21 2000-08-22 Rohm Co., Ltd. Leadframe and a method of manufacturing a semiconductor device by use of it
JP6437406B2 (ja) * 2015-09-15 2018-12-12 東芝メモリ株式会社 半導体装置の製造方法、半導体装置、およびリードフレーム
JP2017168703A (ja) * 2016-03-17 2017-09-21 東芝メモリ株式会社 半導体装置の製造方法および半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3391426A (en) * 1965-10-22 1968-07-09 Motorola Inc Molding apparatus
US3482419A (en) * 1966-01-03 1969-12-09 Texas Instruments Inc Process for fabricating hermetic glass seals
GB1173506A (en) * 1966-03-16 1969-12-10 Motorola Inc Metallic Frame Member for Fabrication of Semiconductor Devices.
DE1539692A1 (de) * 1966-06-23 1969-10-16 Blume & Redecker Gmbh Umklebevorrichtung fuer Spulen
DE1564867C3 (de) * 1966-06-30 1975-04-10 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen
FR1504726A (fr) * 1966-10-25 1967-12-08 Radiotechnique Coprim Rtc Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3689336A (en) * 1971-01-04 1972-09-05 Sylvania Electric Prod Fabrication of packages for integrated circuits

Also Published As

Publication number Publication date
JPS5135349B1 (enExample) 1976-10-01
FR2118154A1 (enExample) 1972-07-28
DE2159530B2 (de) 1980-05-29
CA933673A (en) 1973-09-11
NL7018378A (enExample) 1972-06-20
DE2159530C3 (de) 1981-02-05
FR2118154B1 (enExample) 1976-06-04
GB1372216A (en) 1974-10-30
DE2159530A1 (de) 1972-07-13
US3842492A (en) 1974-10-22

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