GB1173506A - Metallic Frame Member for Fabrication of Semiconductor Devices. - Google Patents

Metallic Frame Member for Fabrication of Semiconductor Devices.

Info

Publication number
GB1173506A
GB1173506A GB8225/67A GB822567A GB1173506A GB 1173506 A GB1173506 A GB 1173506A GB 8225/67 A GB8225/67 A GB 8225/67A GB 822567 A GB822567 A GB 822567A GB 1173506 A GB1173506 A GB 1173506A
Authority
GB
United Kingdom
Prior art keywords
strip
lead
mounting
semi
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8225/67A
Inventor
Eugene Edward Segerson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB1173506A publication Critical patent/GB1173506A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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Abstract

1,173,506. Semi-conductor devices. MOTOROLA Inc. 21 Feb., 1967 [16 March, 1966], No. 8225/67. Heading H1K. A metal strip, e.g. of gold-plated nickel, for use in the manufacture of a plurality of multilead semi-conductor devices consists of two spaced parallel bands, e.g. 14 in Fig. 1, extending the full length of the strip, a plurality of spaced parallel lead connecting portions 16 integral with the bands and perpendicular thereto defining the lateral extremities of a single device, lead spacers 17 between the lead connecting portions, and a number of leads 19 extending outwardly therefrom, each associated with an electrode section 21 extending inwardly. The inward ends of electrodes 21 apart from one, 23, used as a mounting for the semi-conductor body, are arranged in parallel lines on opposite sides of the mounting. This arrangement facilitates thermocompression bonding of wires to the electrodes by machine and subsequent trimming of the bonded wires. In the embodiment indexing holes 29 are provided in the strip to enable it to be accurately located during mounting of an integrated circuit silicon body, attachment of lead wires, and encapsulation in epoxy or silicone resin, which is effected in a transfer mould. After encapsulation the device assembly is severed from the strip, the individual electrodes separated by a shearing operation and those not required are cut off. In a modified arrangement electrode assemblies of two bodies to be disposed in a common encapsulation are provided side by side in each section of the strip. In another arrangement (Fig. 9, not shown) each strip section includes the electrode assemblies of three bodies arranged in line along the strip on a common mounting, which may if desired be divided subsequently. In yet another arrangement (Fig. 7, not shown) the lead spacers are in the form of rings with the leads and electrode sections extending therefrom in a generally radial direction. In all eases the strip may be formed by stamping, etching or machining and the leads coined to facilitate insertion in conventional sockets. Instead of an integrated circuit a ceramic or laminated plastic plate carrying individual diode and transistor bodies and other circuit elements may be mounted in the package.
GB8225/67A 1966-03-16 1967-02-21 Metallic Frame Member for Fabrication of Semiconductor Devices. Expired GB1173506A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53475266A 1966-03-16 1966-03-16

Publications (1)

Publication Number Publication Date
GB1173506A true GB1173506A (en) 1969-12-10

Family

ID=24131381

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8225/67A Expired GB1173506A (en) 1966-03-16 1967-02-21 Metallic Frame Member for Fabrication of Semiconductor Devices.

Country Status (5)

Country Link
JP (1) JPS5110066B1 (en)
DE (1) DE1614134B2 (en)
FR (1) FR1513919A (en)
GB (1) GB1173506A (en)
NL (1) NL154871C (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (en) * 1969-10-06 1971-03-16 Grisby Barton Inc RELAY ASSEMBLY
NL7018378A (en) * 1970-12-17 1972-06-20
DE3040676A1 (en) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Semiconductor devices made using metal lead frame strip - where leads are coated with tin prior to assembling semiconductor chips into strip
DE3942843A1 (en) * 1989-12-23 1991-06-27 Itt Ind Gmbh Deutsche Encapsulated monolithic integrated circuit - uses low resistance connections between lead frame and chip
DE4031051C2 (en) * 1989-11-14 1997-05-07 Siemens Ag Module with at least one semiconductor switching element and a control circuit
DE19604614A1 (en) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Encapsulated electronic control device e.g. for motor vehicles

Also Published As

Publication number Publication date
NL154871B (en) 1977-10-17
DE1614134B2 (en) 1980-02-21
JPS5110066B1 (en) 1976-04-01
NL154871C (en) 1982-09-16
DE1614134A1 (en) 1970-07-09
FR1513919A (en) 1968-02-16
NL6703978A (en) 1967-09-18

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