IT1257386B - Supporto rivestito con diamante. - Google Patents

Supporto rivestito con diamante.

Info

Publication number
IT1257386B
IT1257386B ITTO920613A ITTO920613A IT1257386B IT 1257386 B IT1257386 B IT 1257386B IT TO920613 A ITTO920613 A IT TO920613A IT TO920613 A ITTO920613 A IT TO920613A IT 1257386 B IT1257386 B IT 1257386B
Authority
IT
Italy
Prior art keywords
diamond
support coated
support
substrates
container
Prior art date
Application number
ITTO920613A
Other languages
English (en)
Italian (it)
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of ITTO920613A0 publication Critical patent/ITTO920613A0/it
Publication of ITTO920613A1 publication Critical patent/ITTO920613A1/it
Application granted granted Critical
Publication of IT1257386B publication Critical patent/IT1257386B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
ITTO920613A 1991-07-23 1992-07-17 Supporto rivestito con diamante. IT1257386B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73479491A 1991-07-23 1991-07-23

Publications (3)

Publication Number Publication Date
ITTO920613A0 ITTO920613A0 (it) 1992-07-17
ITTO920613A1 ITTO920613A1 (it) 1994-01-17
IT1257386B true IT1257386B (it) 1996-01-15

Family

ID=24953096

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO920613A IT1257386B (it) 1991-07-23 1992-07-17 Supporto rivestito con diamante.

Country Status (6)

Country Link
JP (1) JPH05198664A (de)
KR (1) KR930003300A (de)
DE (1) DE4223326A1 (de)
FR (1) FR2679524A1 (de)
GB (1) GB2257986A (de)
IT (1) IT1257386B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4300205A1 (de) * 1993-01-07 1994-07-14 Deutsche Bundespost Telekom Probenhalterung in Kassettenform
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
JP3282584B2 (ja) * 1998-06-02 2002-05-13 信越ポリマー株式会社 精密部材用収納容器
JP2002046793A (ja) * 2000-04-26 2002-02-12 Asahi Glass Co Ltd 光学部材用収納ケース
DE10149037A1 (de) * 2001-10-05 2003-04-24 Infineon Technologies Ag Waferhorde und Verfahren
DE10215283B4 (de) * 2002-04-05 2004-06-03 Astec Halbleitertechnologie Gmbh Vorrichtung zur Aufnahme von Substraten
JP4616086B2 (ja) * 2005-06-14 2011-01-19 東芝物流株式会社 パネル状物品の収納トレイ
DE102010041230A1 (de) * 2010-09-23 2012-03-29 Evonik Degussa Gmbh Verwendung von Diamond Like Carbon Schichten bei der Aufbringung metallionenfreier Halbleitertinten
CN111270218B (zh) * 2020-01-23 2021-07-06 电子科技大学 化学气相沉积碳修饰片状FeSiAl合金的制备方法
EP3929969B1 (de) * 2020-06-22 2023-12-06 Siltronic AG Verfahren zum herstellen eines prozessbehälters für halbleiterwerkstücke und prozessbehälter
EP4068343A1 (de) 2021-04-01 2022-10-05 Siltronic AG Vorrichtung zum transport von halbleiterscheiben

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514743B1 (fr) * 1981-10-21 1986-05-09 Rca Corp Pellicule amorphe a base de carbone, du type diamant, et son procede de fabrication
US4872554A (en) * 1987-07-02 1989-10-10 Fluoroware, Inc. Reinforced carrier with embedded rigid insert
JPH01201095A (ja) * 1988-02-04 1989-08-14 Idemitsu Petrochem Co Ltd ダイヤモンド状炭素膜とその製造方法
JPH01259172A (ja) * 1988-04-09 1989-10-16 Idemitsu Petrochem Co Ltd 粉砕機
JPH02186656A (ja) * 1989-01-13 1990-07-20 Hitachi Ltd 低発塵装置
JP2816864B2 (ja) * 1989-07-07 1998-10-27 大塚化学株式会社 搬送用ウエーハバスケット及び収納ケース

Also Published As

Publication number Publication date
GB2257986A (en) 1993-01-27
JPH05198664A (ja) 1993-08-06
KR930003300A (ko) 1993-02-24
GB9214697D0 (en) 1992-08-19
DE4223326A1 (de) 1993-01-28
FR2679524A1 (fr) 1993-01-29
ITTO920613A1 (it) 1994-01-17
ITTO920613A0 (it) 1992-07-17

Similar Documents

Publication Publication Date Title
EP0680078A3 (de) Oberflächenbehandlung für Halbleitersubstrat.
IT8026866A0 (it) Sistema per il rivestimento di substrati sottili (wafer) a semiconduttori.
DE69017287D1 (de) Durchsichtiges Substrat.
DE68916207D1 (de) Diamantbeschichtetes Werkzeug, Substrate dafür und Verfahren zu dessen Herstellung.
EP0585186A3 (de) Halbleiter-Schutzgehäuse für optische Bausteine.
EP0588260A3 (de) Diamant-Halbleiteranordnung.
DE69101818D1 (de) Halbleitersubstrat-Ätzgerät.
DE3883873D1 (de) Trägerelement für Halbleiterapparat.
DE69132826T2 (de) Heizgerät für Halbleiterwafers oder Substrate
IT1257386B (it) Supporto rivestito con diamante.
DE69111487D1 (de) Beschichtete Substrate.
DE68905882D1 (de) Wasserloesliche antimikrobielle substrate.
DE69205204D1 (de) Nassätzverfahren bei rotierenden Halbleitersubstraten.
DE69400142D1 (de) Trägerkassette für Siliziumscheiben
EP0597302A3 (de) Verfahren zum Ätzen eines Silizium-Substrats.
EP0632499A3 (de) Substrat für Halbleitervorrichtung.
DE69008953D1 (de) Schwärzbares Substrat.
EP0012911A3 (en) Device for the precise alignment of planar workpieces, e.g. semiconductor wafers
EP0635852A3 (de) Keramik-Halbleiterbauelement.
IT1224262B (it) Procedimento per la metallizzazione chimica di substrati tessili
ITRM930318A1 (it) Dispositivo di ritegno del pezzo di punta per pattino di supporto di un nastro abrasivo.
DE69103748D1 (de) Trägerkassette für Halbleiterscheiben.
DE68918799D1 (de) Verbindungshalbleitersubstrat.
DE69116033D1 (de) Reaktor zur Behandlung von Halbleiterscheiben.
IT1226701B (it) Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet.

Legal Events

Date Code Title Description
0001 Granted