IT1173906B - Apparecchiatura e metodo per polverizzazione catodica a magnetron - Google Patents

Apparecchiatura e metodo per polverizzazione catodica a magnetron

Info

Publication number
IT1173906B
IT1173906B IT20158/84A IT2015884A IT1173906B IT 1173906 B IT1173906 B IT 1173906B IT 20158/84 A IT20158/84 A IT 20158/84A IT 2015884 A IT2015884 A IT 2015884A IT 1173906 B IT1173906 B IT 1173906B
Authority
IT
Italy
Prior art keywords
cathode
central
cathodes
central cathode
cylindrical
Prior art date
Application number
IT20158/84A
Other languages
English (en)
Other versions
IT8420158A0 (it
Inventor
Harold E Mckelvey
Original Assignee
Shatterproof Glass Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shatterproof Glass Corp filed Critical Shatterproof Glass Corp
Publication of IT8420158A0 publication Critical patent/IT8420158A0/it
Application granted granted Critical
Publication of IT1173906B publication Critical patent/IT1173906B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Physical Water Treatments (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Microwave Tubes (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
IT20158/84A 1983-03-21 1984-03-20 Apparecchiatura e metodo per polverizzazione catodica a magnetron IT1173906B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/477,069 US4417968A (en) 1983-03-21 1983-03-21 Magnetron cathode sputtering apparatus

Publications (2)

Publication Number Publication Date
IT8420158A0 IT8420158A0 (it) 1984-03-20
IT1173906B true IT1173906B (it) 1987-06-24

Family

ID=23894398

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20158/84A IT1173906B (it) 1983-03-21 1984-03-20 Apparecchiatura e metodo per polverizzazione catodica a magnetron

Country Status (11)

Country Link
US (1) US4417968A (it)
EP (1) EP0119631B1 (it)
JP (1) JPS59179785A (it)
AT (1) ATE40575T1 (it)
AU (1) AU567918B2 (it)
CA (1) CA1225364A (it)
DE (1) DE3476563D1 (it)
DK (1) DK160154C (it)
FI (1) FI76123C (it)
IT (1) IT1173906B (it)
NO (1) NO163414C (it)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011103B2 (ja) * 1981-02-23 1985-03-23 レオニド パフロヴイツチ サブレフ 電弧金属蒸発装置用の消耗性陰極
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4466877A (en) * 1983-10-11 1984-08-21 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
KR910000508B1 (ko) * 1984-08-31 1991-01-26 니찌덴 아넬바 가부시끼가이샤 동적자계를 이용한 방전 반응장치
US5215639A (en) * 1984-10-09 1993-06-01 Genus, Inc. Composite sputtering target structures and process for producing such structures
US4597847A (en) * 1984-10-09 1986-07-01 Iodep, Inc. Non-magnetic sputtering target
DE3503398A1 (de) * 1985-02-01 1986-08-07 W.C. Heraeus Gmbh, 6450 Hanau Sputteranlage zum reaktiven beschichten eines substrates mit hartstoffen
US4647361A (en) * 1985-09-03 1987-03-03 International Business Machines Corporation Sputtering apparatus
US4701251A (en) * 1986-02-03 1987-10-20 Bvt Limited Apparatus for sputter coating discs
US4738761A (en) * 1986-10-06 1988-04-19 Microelectronics Center Of North Carolina Shared current loop, multiple field apparatus and process for plasma processing
US4834860A (en) * 1987-07-01 1989-05-30 The Boc Group, Inc. Magnetron sputtering targets
US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5047131A (en) * 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds
US5045166A (en) * 1990-05-21 1991-09-03 Mcnc Magnetron method and apparatus for producing high density ionic gas discharge
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
BR9205911A (pt) * 1991-04-19 1994-12-27 Surface Solutions Inc Aparelho de sublimação catódica, e processo para depositar película delgada sobre superfície de objeto dentro de um aparelho de sublimação catódica
DE4126236C2 (de) * 1991-08-08 2000-01-05 Leybold Ag Rotierende Magnetron-Kathode und Verwendung einer rotierenden Magnetron-Kathode
US5338422A (en) * 1992-09-29 1994-08-16 The Boc Group, Inc. Device and method for depositing metal oxide films
US5286361A (en) * 1992-10-19 1994-02-15 Regents Of The University Of California Magnetically attached sputter targets
WO1994016118A1 (en) * 1993-01-15 1994-07-21 The Boc Group, Inc. Cylindrical magnetron shield structure
US5414588A (en) * 1993-09-20 1995-05-09 The Regents Of The University Of California High performance capacitors using nano-structure multilayer materials fabrication
US5571393A (en) * 1994-08-24 1996-11-05 Viratec Thin Films, Inc. Magnet housing for a sputtering cathode
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
US5882810A (en) * 1996-03-08 1999-03-16 The Dow Chemicalcompany Active layer for membrane electrode assembly
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
DE10221112B4 (de) * 2002-05-03 2008-04-03 Fhr Anlagenbau Gmbh Verfahren zur Herstellung eines metallisch glänzenden Schichtsystems auf einem Substrat und Verwendung des Verfahrens
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
EP1594153B1 (de) * 2004-05-05 2010-02-24 Applied Materials GmbH & Co. KG Beschichtungsvorrichtung mit grossflächiger Anordnung von drehbaren Magnetronkathoden
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
US8092657B2 (en) * 2005-06-30 2012-01-10 Bekaert Advanced Coatings Module for coating both sides of a substrate in a single pass
MX2008005318A (es) * 2005-10-24 2008-09-26 Soleras Ltd Incorporacion de catodo fijo u objetivo de rotacion en combinacion con un montaje magnetico en movimiento y aplicaciones del mismo.
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US8236152B2 (en) * 2006-11-24 2012-08-07 Ascentool International Ltd. Deposition system
TWI377264B (en) * 2007-02-05 2012-11-21 Hon Hai Prec Ind Co Ltd Sputtering device
EP2091067A1 (en) * 2008-02-14 2009-08-19 Applied Materials, Inc. Apparatus for treating a substrate
US8083911B2 (en) * 2008-02-14 2011-12-27 Applied Materials, Inc. Apparatus for treating a substrate
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
CZ304905B6 (cs) 2009-11-23 2015-01-14 Shm, S.R.O. Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu
TW201137144A (en) * 2010-04-29 2011-11-01 Hon Hai Prec Ind Co Ltd Sputtering device and cleaning method for sputtering target
TW201139712A (en) * 2010-05-12 2011-11-16 Hon Hai Prec Ind Co Ltd Sputtering device
CN102296273B (zh) * 2010-06-24 2013-06-05 上海子创镀膜技术有限公司 一种真空磁控溅射镀膜用旋转阴极驱动系统
TW201217568A (en) * 2010-10-26 2012-05-01 Hon Hai Prec Ind Co Ltd Deposition device
TWI480403B (zh) * 2010-10-26 2015-04-11 Hon Hai Prec Ind Co Ltd 鍍膜裝置
US20130032476A1 (en) * 2011-08-04 2013-02-07 Sputtering Components, Inc. Rotary cathodes for magnetron sputtering system
US9543127B2 (en) 2012-04-16 2017-01-10 The Timken Company Method and table assembly for applying coatings to spherical components
EP2746424B1 (de) * 2012-12-21 2018-10-17 Oerlikon Surface Solutions AG, Pfäffikon Verdampfungsquelle
CN103290382B (zh) * 2013-05-15 2015-09-09 宁波韵升股份有限公司 一种真空镀膜机行星式工件架
CN112281127A (zh) * 2020-10-30 2021-01-29 湘潭宏大真空技术股份有限公司 用于磁控溅射镀膜机的承载装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2476592A (en) * 1944-12-13 1949-07-19 Fruth Hal Frederick Cathodic deposition apparatus
GB1147318A (en) * 1968-02-22 1969-04-02 Standard Telephones Cables Ltd Improvements in r.f. cathodic sputtering systems
US3897325A (en) * 1972-10-20 1975-07-29 Nippon Electric Varian Ltd Low temperature sputtering device
JPS49125285A (it) * 1973-04-06 1974-11-30
US3901784A (en) * 1973-11-15 1975-08-26 United Aircraft Corp Cylindrical rf sputtering apparatus
MX145314A (es) * 1975-12-17 1982-01-27 Coulter Systems Corp Mejoras a un aparato chisporroteador para producir pelicula electrofotografica
US4126530A (en) * 1977-08-04 1978-11-21 Telic Corporation Method and apparatus for sputter cleaning and bias sputtering
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPS6037188B2 (ja) * 1981-08-27 1985-08-24 三菱マテリアル株式会社 スパツタリング装置

Also Published As

Publication number Publication date
CA1225364A (en) 1987-08-11
DK98484A (da) 1984-09-22
FI841119A (fi) 1984-09-22
NO841073L (no) 1984-09-24
ATE40575T1 (de) 1989-02-15
EP0119631B1 (en) 1989-02-01
EP0119631A3 (en) 1986-03-12
DK160154B (da) 1991-02-04
FI76123B (fi) 1988-05-31
JPS59179785A (ja) 1984-10-12
AU567918B2 (en) 1987-12-10
AU2515684A (en) 1984-09-27
US4417968A (en) 1983-11-29
NO163414B (no) 1990-02-12
IT8420158A0 (it) 1984-03-20
DK98484D0 (da) 1984-02-24
FI76123C (fi) 1988-09-09
DE3476563D1 (de) 1989-03-09
NO163414C (no) 1990-05-23
EP0119631A2 (en) 1984-09-26
DK160154C (da) 1991-07-08
FI841119A0 (fi) 1984-03-20

Similar Documents

Publication Publication Date Title
IT1173906B (it) Apparecchiatura e metodo per polverizzazione catodica a magnetron
DE3864652D1 (de) Vorrichtung nach dem karussell-prinzip zum beschichten von substraten.
GB1406509A (en) Coating of workpieces
TW315980U (en) Dual cylindrical target magnetron with multiple anodes
GB1466790A (en) Deposition of layers in a vacuum
MY112448A (en) Use of multiple anodes in a magnetron for improving the uniformity of its plasma
DE3063058D1 (en) Vacuum deposition system and method
EP0134559A3 (en) Cathodic sputtering apparatus
ES8303552A1 (es) Perfeccionamientos en un aparato para la sublimacion catodica de peliculas delgadas de un material de recubrimiento sobre substratos.
IL72125A0 (en) Decorative carbon coating,its manufacture and articles coated therewith
EP0328257A3 (en) Magnetron sputtering apparatus and process
GR1002594B (el) Συστηματα εμβαπτισεως δισκιων για συσκευες επικαλυψης δισκιων με ζελατινη.
GB1492164A (en) Method of forming iron oxide films
DE3852500D1 (de) Physikalische dampfniederschlag-doppelbeschichtungsvorrichtung und verfahren.
CA2354925A1 (en) Apparatus and method for coating substrates
DE3772706D1 (de) Anlage zur vakuum-auflagerung durch reaktive kathodenzerstaeubung auf eine glasplatte.
GB1391842A (en) Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel
AU8918291A (en) Magnetron sputter coating method and apparatus with rotating magnet cathode
EP0301604A3 (en) Apparatus for coating a substrate by plasma-chemical vapour deposition or cathodic sputtering, and process using the apparatus
GB1147318A (en) Improvements in r.f. cathodic sputtering systems
GB2155044A (en) Method for the deposition of a coating
JPS6428371A (en) Substrate turning mechanism
EP0154814A3 (en) Substrates coated by plasma enhanced chemical vapor deposition, apparatus and process for their production
JPS56169770A (en) Ionic plating device
JPS57160113A (en) High speed sputtering apparatus for ferromagnetic body

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19980327