DE3580953D1 - Entladungsvorrichtung. - Google Patents
Entladungsvorrichtung.Info
- Publication number
- DE3580953D1 DE3580953D1 DE8585306186T DE3580953T DE3580953D1 DE 3580953 D1 DE3580953 D1 DE 3580953D1 DE 8585306186 T DE8585306186 T DE 8585306186T DE 3580953 T DE3580953 T DE 3580953T DE 3580953 D1 DE3580953 D1 DE 3580953D1
- Authority
- DE
- Germany
- Prior art keywords
- unloading device
- unloading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/34—Details, e.g. electrodes, nozzles
- H05H1/40—Details, e.g. electrodes, nozzles using applied magnetic fields, e.g. for focusing or rotating the arc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/517—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/28—Cooling arrangements
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59182183A JPS6159822A (ja) | 1984-08-31 | 1984-08-31 | 交番磁界を用いた放電反応装置 |
JP59207530A JPS6186942A (ja) | 1984-10-03 | 1984-10-03 | 回転磁界を用いた放電反応装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3580953D1 true DE3580953D1 (de) | 1991-01-31 |
Family
ID=26501074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585306186T Expired - Lifetime DE3580953D1 (de) | 1984-08-31 | 1985-08-30 | Entladungsvorrichtung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4829215A (de) |
EP (1) | EP0173583B1 (de) |
KR (1) | KR910000508B1 (de) |
DE (1) | DE3580953D1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910000508B1 (ko) * | 1984-08-31 | 1991-01-26 | 니찌덴 아넬바 가부시끼가이샤 | 동적자계를 이용한 방전 반응장치 |
US4661233A (en) * | 1985-07-05 | 1987-04-28 | Westinghouse Electric Corp. | Cathode/ground shield arrangement in a sputter coating apparatus |
US4668338A (en) * | 1985-12-30 | 1987-05-26 | Applied Materials, Inc. | Magnetron-enhanced plasma etching process |
US4842683A (en) * | 1986-12-19 | 1989-06-27 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
ATE151199T1 (de) * | 1986-12-19 | 1997-04-15 | Applied Materials Inc | Plasmaätzvorrichtung mit magnetfeldverstärkung |
US5215619A (en) * | 1986-12-19 | 1993-06-01 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
EP0565212A2 (de) * | 1986-12-19 | 1993-10-13 | Applied Materials, Inc. | Iodine-Ätzverfahren für Silizium und Silizide |
DE3810197A1 (de) * | 1987-03-27 | 1988-10-13 | Mitsubishi Electric Corp | Plasma-bearbeitungseinrichtung |
SE461761B (sv) * | 1988-05-03 | 1990-03-19 | Fiz Tekh Inst Ioffe | Elektrisk ljusbaaganordning |
KR910002310A (ko) * | 1988-06-29 | 1991-01-31 | 미다 가쓰시게 | 플라즈마 처리장치 |
JPH0223613A (ja) * | 1988-07-12 | 1990-01-25 | Tokyo Ohka Kogyo Co Ltd | プラズマ反応装置 |
US5556501A (en) * | 1989-10-03 | 1996-09-17 | Applied Materials, Inc. | Silicon scavenger in an inductively coupled RF plasma reactor |
US6068784A (en) * | 1989-10-03 | 2000-05-30 | Applied Materials, Inc. | Process used in an RF coupled plasma reactor |
KR930004713B1 (ko) * | 1990-06-18 | 1993-06-03 | 삼성전자 주식회사 | 변조방식을 이용한 플라즈마 발생장치 및 방법 |
US6444137B1 (en) | 1990-07-31 | 2002-09-03 | Applied Materials, Inc. | Method for processing substrates using gaseous silicon scavenger |
US5707486A (en) * | 1990-07-31 | 1998-01-13 | Applied Materials, Inc. | Plasma reactor using UHF/VHF and RF triode source, and process |
US5274306A (en) * | 1990-08-31 | 1993-12-28 | Kaufman & Robinson, Inc. | Capacitively coupled radiofrequency plasma source |
US5089442A (en) * | 1990-09-20 | 1992-02-18 | At&T Bell Laboratories | Silicon dioxide deposition method using a magnetic field and both sputter deposition and plasma-enhanced cvd |
US5147520A (en) * | 1991-02-15 | 1992-09-15 | Mcnc | Apparatus and method for controlling processing uniformity in a magnetron |
EP0585229B1 (de) * | 1991-05-21 | 1995-09-06 | Materials Research Corporation | Sanftaetz-einheit fuer modulare bearbeitungsanlagen und ecr-plasmaerzeuger fuer eine solche einheit |
US5888414A (en) * | 1991-06-27 | 1999-03-30 | Applied Materials, Inc. | Plasma reactor and processes using RF inductive coupling and scavenger temperature control |
JP3170319B2 (ja) * | 1991-08-20 | 2001-05-28 | 東京エレクトロン株式会社 | マグネトロンプラズマ処理装置 |
US5182496A (en) * | 1992-04-07 | 1993-01-26 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for forming an agile plasma mirror effective as a microwave reflector |
DE69324849T2 (de) * | 1992-04-16 | 1999-09-23 | Mitsubishi Heavy Ind Ltd | Verfahren und Vorrichtung zur Plasma-unterstützten chemischen Dampfphasen-Abscheidung |
KR0179663B1 (ko) * | 1992-06-26 | 1999-05-15 | 이노우에 아끼라 | 플라즈마 처리장치 |
US5534108A (en) * | 1993-05-28 | 1996-07-09 | Applied Materials, Inc. | Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor |
TW303480B (en) | 1996-01-24 | 1997-04-21 | Applied Materials Inc | Magnetically confined plasma reactor for processing a semiconductor wafer |
DE19644150A1 (de) * | 1996-10-24 | 1998-04-30 | Roland Dr Gesche | Magnetfeldunterstütztes Reinigen, Entfetten und Aktivieren mit Niederdruck-Gasentladungen |
US6113731A (en) * | 1997-01-02 | 2000-09-05 | Applied Materials, Inc. | Magnetically-enhanced plasma chamber with non-uniform magnetic field |
US6342131B1 (en) | 1998-04-17 | 2002-01-29 | Kabushiki Kaisha Toshiba | Method of depositing a multilayer thin film by means of magnetron sputtering which controls the magnetic field |
US6579421B1 (en) | 1999-01-07 | 2003-06-17 | Applied Materials, Inc. | Transverse magnetic field for ionized sputter deposition |
US6239543B1 (en) * | 1999-08-23 | 2001-05-29 | American International Technologies, Inc. | Electron beam plasma formation for surface chemistry |
US8617351B2 (en) * | 2002-07-09 | 2013-12-31 | Applied Materials, Inc. | Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction |
US20070048882A1 (en) * | 2000-03-17 | 2007-03-01 | Applied Materials, Inc. | Method to reduce plasma-induced charging damage |
US8048806B2 (en) * | 2000-03-17 | 2011-11-01 | Applied Materials, Inc. | Methods to avoid unstable plasma states during a process transition |
KR100458779B1 (ko) * | 2000-03-27 | 2004-12-03 | 미츠비시 쥬고교 가부시키가이샤 | 금속막의 제작방법 및 그 제작장치 |
US6863835B1 (en) | 2000-04-25 | 2005-03-08 | James D. Carducci | Magnetic barrier for plasma in chamber exhaust |
US7374636B2 (en) * | 2001-07-06 | 2008-05-20 | Applied Materials, Inc. | Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor |
JP4009087B2 (ja) * | 2001-07-06 | 2007-11-14 | アプライド マテリアルズ インコーポレイテッド | 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法 |
AU2003219715A1 (en) * | 2002-02-05 | 2003-09-02 | Cambridge Scientific, Inc. | Bioresorbable osteoconductive compositions for bone regeneration |
TWI283899B (en) * | 2002-07-09 | 2007-07-11 | Applied Materials Inc | Capacitively coupled plasma reactor with magnetic plasma control |
US7458335B1 (en) | 2002-10-10 | 2008-12-02 | Applied Materials, Inc. | Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils |
US7422654B2 (en) * | 2003-02-14 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
JP4584572B2 (ja) * | 2003-12-22 | 2010-11-24 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置および処理方法 |
US8773020B2 (en) | 2010-10-22 | 2014-07-08 | Applied Materials, Inc. | Apparatus for forming a magnetic field and methods of use thereof |
US9269546B2 (en) | 2010-10-22 | 2016-02-23 | Applied Materials, Inc. | Plasma reactor with electron beam plasma source having a uniform magnetic field |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3283205A (en) * | 1961-06-01 | 1966-11-01 | Bolt Harold E De | Shifting arc plasma system |
CH551498A (de) * | 1972-05-09 | 1974-07-15 | Balzers Patent Beteilig Ag | Anordnung zur aufstaeubung von stoffen auf unterlagen mittels einer elektrischen niederspannungsentladung. |
US3961103A (en) * | 1972-07-12 | 1976-06-01 | Space Sciences, Inc. | Film deposition |
US4233109A (en) * | 1976-01-16 | 1980-11-11 | Zaidan Hojin Handotai Kenkyu Shinkokai | Dry etching method |
DE2707144A1 (de) * | 1976-02-19 | 1977-08-25 | Sloan Technology Corp | Kathodenzerstaeubungsvorrichtung |
DE2800852C2 (de) * | 1978-01-10 | 1983-07-14 | Jurij Akimovič Moskva Dmitriev | Einrichtung zum Ionenplasma-Beschichten |
DE3070700D1 (en) * | 1980-08-08 | 1985-07-04 | Battelle Development Corp | Cylindrical magnetron sputtering cathode |
US4422916A (en) * | 1981-02-12 | 1983-12-27 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
IN160089B (de) * | 1982-07-14 | 1987-06-27 | Standard Oil Co Ohio | |
US4444643A (en) * | 1982-09-03 | 1984-04-24 | Gartek Systems, Inc. | Planar magnetron sputtering device |
AT376460B (de) * | 1982-09-17 | 1984-11-26 | Kljuchko Gennady V | Plasmalichtbogeneinrichtung zum auftragen von ueberzuegen |
US4417968A (en) * | 1983-03-21 | 1983-11-29 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4443318A (en) * | 1983-08-17 | 1984-04-17 | Shatterproof Glass Corporation | Cathodic sputtering apparatus |
KR910000508B1 (ko) * | 1984-08-31 | 1991-01-26 | 니찌덴 아넬바 가부시끼가이샤 | 동적자계를 이용한 방전 반응장치 |
-
1985
- 1985-08-30 KR KR1019850006330A patent/KR910000508B1/ko not_active IP Right Cessation
- 1985-08-30 EP EP85306186A patent/EP0173583B1/de not_active Expired - Lifetime
- 1985-08-30 DE DE8585306186T patent/DE3580953D1/de not_active Expired - Lifetime
-
1987
- 1987-10-20 US US07/110,622 patent/US4829215A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR910000508B1 (ko) | 1991-01-26 |
EP0173583A1 (de) | 1986-03-05 |
EP0173583B1 (de) | 1990-12-19 |
KR870002746A (ko) | 1987-04-06 |
US4829215A (en) | 1989-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |