GB1406509A - Coating of workpieces - Google Patents

Coating of workpieces

Info

Publication number
GB1406509A
GB1406509A GB3937972A GB3937972A GB1406509A GB 1406509 A GB1406509 A GB 1406509A GB 3937972 A GB3937972 A GB 3937972A GB 3937972 A GB3937972 A GB 3937972A GB 1406509 A GB1406509 A GB 1406509A
Authority
GB
United Kingdom
Prior art keywords
substrates
magazine
sputtering
shields
aug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3937972A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1406509A publication Critical patent/GB1406509A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

1406509 Sputtering apparatus WESTERN ELECTRIC CO Inc 24 Aug 1972 [26 Aug 1971] 39379/72 Heading C7F Substrates 21 of e.g. glass or ceramic are sputtered with e.g. Ta in argon or TaN in argonnitrogen, after loading them in a magazine 30, moving a yoke 32 to bring the magazine to an outgassing position 31B, and then to a position 31C where the substrates are moved upwardly (or in a modification, downwardly) into the sputtering chamber 34 which is maintained at the desired atmosphere. At the same time the previously coated substrates are moved into an empty magazine. To provide an even-coating, shields Fig. 5 (not shown) screen the central part of the substrates for part of the deposition time. The sputtering gas is distributed through ducts 109, and shields or plugs are provided to diffuse the gas. The cathode 117 is a hollow water cooled cylinder. The outer aluminium wall 102 of the sputtering chamber may also be cooled. The substrate holder 36 is rotated about the cathode.
GB3937972A 1971-08-26 1972-08-24 Coating of workpieces Expired GB1406509A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00175247A US3856654A (en) 1971-08-26 1971-08-26 Apparatus for feeding and coating masses of workpieces in a controlled atmosphere

Publications (1)

Publication Number Publication Date
GB1406509A true GB1406509A (en) 1975-09-17

Family

ID=22639550

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3937972A Expired GB1406509A (en) 1971-08-26 1972-08-24 Coating of workpieces

Country Status (11)

Country Link
US (1) US3856654A (en)
JP (1) JPS527439B2 (en)
BE (1) BE787884A (en)
CA (1) CA992910A (en)
DE (1) DE2241634B2 (en)
FR (1) FR2165849B1 (en)
GB (1) GB1406509A (en)
HK (1) HK36276A (en)
IT (1) IT962154B (en)
NL (1) NL155314B (en)
SE (1) SE391739B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137661A (en) * 1979-12-21 1984-10-10 Varian Associates Wafer coating apparatus

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH573985A5 (en) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
JPS5519289Y2 (en) * 1975-01-06 1980-05-08
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US3976555A (en) * 1975-03-20 1976-08-24 Coulter Information Systems, Inc. Method and apparatus for supplying background gas in a sputtering chamber
JPS5218585A (en) * 1975-08-05 1977-02-12 Tadano Tekkosho:Kk Double-acting hydraulic cylinder
US4051010A (en) * 1975-12-18 1977-09-27 Western Electric Company, Inc. Sputtering apparatus
AU507748B2 (en) * 1976-06-10 1980-02-28 University Of Sydney, The Reactive sputtering
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4172021A (en) * 1978-10-13 1979-10-23 Western Electric Company, Inc. Method and glow-suppression devices for transporting a gas across a voltage drop
US4268374A (en) * 1979-08-09 1981-05-19 Bell Telephone Laboratories, Incorporated High capacity sputter-etching apparatus
US4647266A (en) * 1979-12-21 1987-03-03 Varian Associates, Inc. Wafer coating system
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
JPS5797903A (en) * 1980-12-06 1982-06-17 Yunitsuku:Kk Double-acting cylinder
JPS58197262A (en) * 1982-05-13 1983-11-16 Canon Inc Mass production type vacuum apparatus for forming film
JPS5970764A (en) * 1982-10-15 1984-04-21 Ulvac Corp Plasma cvd device
DE3306870A1 (en) * 1983-02-26 1984-08-30 Leybold-Heraeus GmbH, 5000 Köln DEVICE FOR PRODUCING LAYERS WITH ROTATIONALLY SYMMETRIC THICK PROFILE BY CATODENSIONING
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4522697A (en) * 1983-12-22 1985-06-11 Sputtered Films, Inc. Wafer processing machine
US4523985A (en) * 1983-12-22 1985-06-18 Sputtered Films, Inc. Wafer processing machine
US4508612A (en) * 1984-03-07 1985-04-02 International Business Machines Corporation Shield for improved magnetron sputter deposition into surface recesses
US4491509A (en) * 1984-03-09 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for sputtering material onto a substrate
US4534314A (en) * 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
FR2594102B1 (en) * 1986-02-12 1991-04-19 Stein Heurtey AUTOMATED FLEXIBLE INSTALLATION FOR FAST THERMOCHEMICAL TREATMENT
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
US4952294A (en) * 1988-03-15 1990-08-28 Collins George J Apparatus and method for in-situ generation of dangerous polyatomic gases, including polyatomic radicals
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US5059292A (en) * 1989-02-28 1991-10-22 Collins George J Single-chamber apparatus for in-situ generation of dangerous polyatomic gases and radicals from a source material contained within a porous foamed structure
DE59205106D1 (en) * 1991-12-27 1996-02-29 Balzers Hochvakuum Vacuum treatment plant and its uses
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with sputtered terminations and a method of applying sputtered teminations to varistors and the like.
US5565838A (en) * 1992-05-28 1996-10-15 Avx Corporation Varistors with sputtered terminations
DE4235674C2 (en) * 1992-10-22 2000-12-28 Balzers Ag Liechtenstein Chamber for the transport of workpieces in a vacuum atmosphere, chamber combination and method for transporting a workpiece
DE4235677C2 (en) * 1992-10-22 1996-10-31 Balzers Hochvakuum Vacuum chamber, vacuum treatment system with such a chamber and transport processes
DE4235676C2 (en) * 1992-10-22 1997-08-28 Balzers Hochvakuum Vacuum chamber for transporting disk-shaped workpieces in a vacuum system
US5421979A (en) * 1993-08-03 1995-06-06 Photran Corporation Load-lock drum-type coating apparatus
DE4341635C2 (en) * 1993-12-07 2002-07-18 Unaxis Deutschland Holding Vacuum coating system
US5791895A (en) * 1994-02-17 1998-08-11 Novellus Systems, Inc. Apparatus for thermal treatment of thin film wafer
DE19537267C1 (en) * 1994-10-19 1996-07-04 Grc Glass Refining Center Ges Mass prodn. of multi-coloured sputtered coatings
DE19624609B4 (en) * 1996-06-20 2009-04-16 Leybold Optics Gmbh Vacuum treatment system for applying thin layers to substrates, for example to headlight reflectors
DE19626861B4 (en) * 1996-07-04 2009-04-16 Leybold Optics Gmbh Vacuum treatment system for applying thin layers to substrates, for example to headlight reflectors
DE19642852A1 (en) 1996-10-17 1998-04-23 Leybold Systems Gmbh Vacuum treatment system for applying thin layers on three-dimensional, bowl-shaped or prismatic substrates
US6210540B1 (en) * 2000-03-03 2001-04-03 Optical Coating Laboratory, Inc. Method and apparatus for depositing thin films on vertical surfaces
US20020110700A1 (en) * 2001-02-12 2002-08-15 Hein Gerald F. Process for forming decorative films and resulting products
US20100218721A1 (en) * 2007-09-05 2010-09-02 Atomic Energy Council - Institute Of Nuclear Energy Research Hollow-cathode discharge apparatus for plasma-based processing
KR101458909B1 (en) * 2008-04-03 2014-11-07 삼성디스플레이 주식회사 In-line apparatus
CN102080214B (en) * 2009-11-30 2013-06-05 鸿富锦精密工业（深圳）有限公司 Coating device
TW201122148A (en) * 2009-12-24 2011-07-01 Hon Hai Prec Ind Co Ltd Chemical vapor deposition device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340176A (en) * 1965-07-28 1967-09-05 Western Electric Co Vacuum processing machine
NL130959C (en) * 1965-12-17
US3451912A (en) * 1966-07-15 1969-06-24 Ibm Schottky-barrier diode formed by sputter-deposition processes
US3501393A (en) * 1967-05-05 1970-03-17 Litton Systems Inc Apparatus for sputtering wherein the plasma is confined by the target structure
US3528906A (en) * 1967-06-05 1970-09-15 Texas Instruments Inc Rf sputtering method and system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137661A (en) * 1979-12-21 1984-10-10 Varian Associates Wafer coating apparatus
GB2137663A (en) * 1979-12-21 1984-10-10 Varian Associates Wafer moving apparatus
GB2137662A (en) * 1979-12-21 1984-10-10 Varian Associates Substrate processing apparatus

Also Published As

Publication number Publication date
SE391739B (en) 1977-02-28
IT962154B (en) 1973-12-20
CA992910A (en) 1976-07-13
DE2241634B2 (en) 1974-11-21
JPS4831185A (en) 1973-04-24
NL155314B (en) 1977-12-15
US3856654A (en) 1974-12-24
BE787884A (en) 1972-12-18
NL7211410A (en) 1973-02-28
DE2241634A1 (en) 1973-03-01
HK36276A (en) 1976-06-18
JPS527439B2 (en) 1977-03-02
FR2165849B1 (en) 1975-03-07
FR2165849A1 (en) 1973-08-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee