GB1284781A - Depositing layers by cathode sputtering - Google Patents

Depositing layers by cathode sputtering

Info

Publication number
GB1284781A
GB1284781A GB5070969A GB5070969A GB1284781A GB 1284781 A GB1284781 A GB 1284781A GB 5070969 A GB5070969 A GB 5070969A GB 5070969 A GB5070969 A GB 5070969A GB 1284781 A GB1284781 A GB 1284781A
Authority
GB
United Kingdom
Prior art keywords
electrode
sputtered
oct
argon
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5070969A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1284781A publication Critical patent/GB1284781A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1284781 Sputtering apparatus PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 15 Oct 1969 [15 Oct 1968(3)] 50709/69. Heading C7F A sputtering apparatus comprises a cathode target electrode 16, an electrode 23 carrying e. g. glass substrates 28, 29, and guard rings 30, 22. The electrode 23 may be rotated and adjusted vertically by a shaft 24. Both electrodes may be cooled by circulating fluid. The target electrode may have sectors of e.g. three different materials. A central fixing member 31 may be made of aluminium which does not sputter readily. Silicon may be sputtered in an argon-ammonia mixture to give silicon nitride or a mixture of argon and oxygen may be used with Zn alone or Cu, Ni, and Fe to give a ternary composition of their oxides. Other mixtures that may be deposited are Fe-Ni-Zn, and Cu-Ni-Co-Mn. Ceramics may also be sputtered e.g. ferrites, garnets, thiospinels, and cermets. The electrodes 16, 23 may be at different potentials, and may have a bias voltage relative to their guard rings. The coating may be subsequently heated.
GB5070969A 1968-10-15 1969-10-15 Depositing layers by cathode sputtering Expired GB1284781A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR170008 1968-10-15
FR170009 1968-10-15
FR170007 1968-10-15

Publications (1)

Publication Number Publication Date
GB1284781A true GB1284781A (en) 1972-08-09

Family

ID=27244897

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5070969A Expired GB1284781A (en) 1968-10-15 1969-10-15 Depositing layers by cathode sputtering

Country Status (3)

Country Link
DE (1) DE1951735A1 (en)
FR (3) FR1594667A (en)
GB (1) GB1284781A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058560A2 (en) * 1981-02-18 1982-08-25 Hitachi, Ltd. Sputtering apparatus
GB2228948A (en) * 1989-02-28 1990-09-12 British Aerospace Fabrication of thin films from a composite target
GB2345919A (en) * 1999-01-20 2000-07-26 Marconi Caswell Ltd Depositing material
EP1448806A1 (en) * 2001-11-03 2004-08-25 Intevac, Inc. Method and apparatus for multi-target sputtering field of the invention

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011103B2 (en) * 1981-02-23 1985-03-23 レオニド パフロヴイツチ サブレフ Consumable cathode for electric arc metal evaporation equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058560A2 (en) * 1981-02-18 1982-08-25 Hitachi, Ltd. Sputtering apparatus
EP0058560A3 (en) * 1981-02-18 1982-12-01 Hitachi, Ltd. Sputtering apparatus
GB2228948A (en) * 1989-02-28 1990-09-12 British Aerospace Fabrication of thin films from a composite target
GB2345919A (en) * 1999-01-20 2000-07-26 Marconi Caswell Ltd Depositing material
EP1448806A1 (en) * 2001-11-03 2004-08-25 Intevac, Inc. Method and apparatus for multi-target sputtering field of the invention
EP1448806A4 (en) * 2001-11-03 2006-11-08 Intevac Inc Method and apparatus for multi-target sputtering field of the invention

Also Published As

Publication number Publication date
DE1951735A1 (en) 1970-04-30
FR1594668A (en) 1970-06-08
FR1603217A (en) 1971-03-22
FR1594667A (en) 1970-06-08

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees