GB1350720A - Apparatus for sputtering - Google Patents
Apparatus for sputteringInfo
- Publication number
- GB1350720A GB1350720A GB5246272A GB5246272A GB1350720A GB 1350720 A GB1350720 A GB 1350720A GB 5246272 A GB5246272 A GB 5246272A GB 5246272 A GB5246272 A GB 5246272A GB 1350720 A GB1350720 A GB 1350720A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sputtering
- nov
- sputtered
- heading
- concurrently
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
Abstract
1350720 Sputtering alloys UNITED AIRCRAFT CORP 14 Nov 1972 [19 Nov 1971] 52462/72 Addition to 1339910 Heading C7F In a process for sputtering an alloy from a molten cathode, as described in Specification 1339910, the substrate is first cleaned by giving it a negative bias. Carbon, alumina or refractory metals may be concurrently sputtered from the solid state.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US00200566A US3799862A (en) | 1971-11-19 | 1971-11-19 | Apparatus for sputtering |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1350720A true GB1350720A (en) | 1974-04-24 |
Family
ID=22742254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5246272A Expired GB1350720A (en) | 1971-11-19 | 1972-11-14 | Apparatus for sputtering |
Country Status (3)
Country | Link |
---|---|
US (1) | US3799862A (en) |
DE (1) | DE2254434A1 (en) |
GB (1) | GB1350720A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138027A (en) * | 1983-04-12 | 1984-10-17 | Citizen Watch Co Ltd | A process for plating an article with a gold-based alloy and an alloy therefor |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4019902A (en) * | 1974-06-10 | 1977-04-26 | Xerox Corporation | Photoreceptor fabrication |
US4013463A (en) * | 1975-08-15 | 1977-03-22 | Leder Lewis B | Photoreceptor fabrication utilizing AC ion plating |
CH667621A5 (en) * | 1985-06-04 | 1988-10-31 | Grapha Holding Ag | COLLECTIBLE. |
CA2065581C (en) | 1991-04-22 | 2002-03-12 | Andal Corp. | Plasma enhancement apparatus and method for physical vapor deposition |
US5211824A (en) * | 1991-10-31 | 1993-05-18 | Siemens Solar Industries L.P. | Method and apparatus for sputtering of a liquid |
US5507931A (en) * | 1993-12-30 | 1996-04-16 | Deposition Technologies, Inc. | Sputter deposition process |
JPH07268622A (en) * | 1994-03-01 | 1995-10-17 | Applied Sci & Technol Inc | Microwave plasma sticking source |
US6432281B2 (en) * | 1995-12-20 | 2002-08-13 | Recherche Et Developpement Due Groupe Cockerill Sambre | Process for formation of a coating on a substrate |
BE1009838A3 (en) * | 1995-12-20 | 1997-10-07 | Cockerill Rech & Dev | Method and device for forming a coating on a substrate. |
EP1182272A1 (en) * | 2000-08-23 | 2002-02-27 | Cold Plasma Applications C.P.A. | Process and apparatus for continuous cold plasma deposition of metallic layers |
US20080217162A1 (en) * | 2005-10-13 | 2008-09-11 | Nv Bekaert Sa | Method to Deposit a Coating By Sputtering |
US10858754B2 (en) | 2015-11-25 | 2020-12-08 | United States Of America As Represented By The Administrator Of Nasa | Rhombohedron epitaxial growth with molten target sputtering |
-
1971
- 1971-11-19 US US00200566A patent/US3799862A/en not_active Expired - Lifetime
-
1972
- 1972-11-07 DE DE2254434A patent/DE2254434A1/en active Pending
- 1972-11-14 GB GB5246272A patent/GB1350720A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138027A (en) * | 1983-04-12 | 1984-10-17 | Citizen Watch Co Ltd | A process for plating an article with a gold-based alloy and an alloy therefor |
Also Published As
Publication number | Publication date |
---|---|
DE2254434A1 (en) | 1973-05-24 |
US3799862A (en) | 1974-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |