IT1147903B - Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura - Google Patents

Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura

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Publication number
IT1147903B
IT1147903B IT48005/82A IT4800582A IT1147903B IT 1147903 B IT1147903 B IT 1147903B IT 48005/82 A IT48005/82 A IT 48005/82A IT 4800582 A IT4800582 A IT 4800582A IT 1147903 B IT1147903 B IT 1147903B
Authority
IT
Italy
Prior art keywords
die
package
electrical contact
copper alloy
metallization
Prior art date
Application number
IT48005/82A
Other languages
English (en)
Italian (it)
Other versions
IT8248005A0 (it
Inventor
Dennis R Olsen
Keith G Spanjer
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IT8248005A0 publication Critical patent/IT8248005A0/it
Application granted granted Critical
Publication of IT1147903B publication Critical patent/IT1147903B/it

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    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/045Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT48005/82A 1981-03-23 1982-03-16 Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura IT1147903B (it)

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JP (1) JPS58500463A (ja)
KR (1) KR900001223B1 (ja)
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DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
GB2174063B (en) * 1985-04-22 1988-08-17 Philips Electronic Associated Semiconductor device having a laser printable envelope
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
JPH088446A (ja) * 1995-05-25 1996-01-12 Rohm Co Ltd 個別ダイオード装置
US6821821B2 (en) * 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
US7696611B2 (en) 2004-01-13 2010-04-13 Halliburton Energy Services, Inc. Conductive material compositions, apparatus, systems, and methods

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US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
JPS5120323B2 (ja) * 1972-08-08 1976-06-24
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
IN148328B (ja) * 1977-04-18 1981-01-17 Rca Corp
IT7821073V0 (it) * 1978-03-09 1978-03-09 Ates Componenti Elettron Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
JPS5516425A (en) * 1978-07-21 1980-02-05 Toshiba Corp Semiconductor device
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device

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JPS58500463A (ja) 1983-03-24
JPH0412028B2 (ja) 1992-03-03
EP0074378A1 (en) 1983-03-23
IT8248005A0 (it) 1982-03-16
KR830009650A (ko) 1983-12-22
WO1982003294A1 (en) 1982-09-30
KR900001223B1 (ko) 1990-03-05
EP0074378A4 (en) 1985-04-25

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