IT1049009B - Procedimento perfezionato per la fabbricazione di moduli circuitali ceramici a piu strati - Google Patents

Procedimento perfezionato per la fabbricazione di moduli circuitali ceramici a piu strati

Info

Publication number
IT1049009B
IT1049009B IT28856/75A IT2885675A IT1049009B IT 1049009 B IT1049009 B IT 1049009B IT 28856/75 A IT28856/75 A IT 28856/75A IT 2885675 A IT2885675 A IT 2885675A IT 1049009 B IT1049009 B IT 1049009B
Authority
IT
Italy
Prior art keywords
manufacture
circuit modules
ceramic circuit
layer ceramic
perfected procedure
Prior art date
Application number
IT28856/75A
Other languages
English (en)
Italian (it)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1049009B publication Critical patent/IT1049009B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
    • B61L25/00—Recording or indicating positions or identities of vehicles or trains or setting of track apparatus
    • B61L25/02—Indicating or recording positions or identities of vehicles or trains
    • B61L25/04—Indicating or recording train identities
    • B61L25/045—Indicating or recording train identities using reradiating tags
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
IT28856/75A 1974-12-31 1975-10-31 Procedimento perfezionato per la fabbricazione di moduli circuitali ceramici a piu strati IT1049009B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7443622A FR2296988A1 (fr) 1974-12-31 1974-12-31 Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique

Publications (1)

Publication Number Publication Date
IT1049009B true IT1049009B (it) 1981-01-20

Family

ID=9146935

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28856/75A IT1049009B (it) 1974-12-31 1975-10-31 Procedimento perfezionato per la fabbricazione di moduli circuitali ceramici a piu strati

Country Status (7)

Country Link
US (1) US4024629A (en:Method)
JP (1) JPS5437294B2 (en:Method)
CA (1) CA1043189A (en:Method)
DE (1) DE2558361C2 (en:Method)
FR (1) FR2296988A1 (en:Method)
GB (1) GB1487800A (en:Method)
IT (1) IT1049009B (en:Method)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
US4181387A (en) * 1978-06-21 1980-01-01 Western Electric Company, Inc. Interconnect sockets and assemblies
US4327247A (en) * 1978-10-02 1982-04-27 Shin-Kobe Electric Machinery Co., Ltd. Printed wiring board
US4191789A (en) * 1978-11-02 1980-03-04 Bell Telephone Laboratories, Incorporated Fabrication of bi-level circuits
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Industrial Co Ltd Method of forming through hole connector
US4247981A (en) * 1979-06-18 1981-02-03 Western Electric Company, Inc. Methods of assembling interconnect members with printed circuit boards
US4301192A (en) * 1980-06-02 1981-11-17 Western Electric Co., Inc. Method for coating thru holes in a printed circuit substrate
US4383495A (en) * 1980-06-02 1983-05-17 Western Electric Company, Inc. Apparatus for coating surfaces of a substrate
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
US4434134A (en) 1981-04-10 1984-02-28 International Business Machines Corporation Pinned ceramic substrate
FR2522459A1 (fr) * 1982-02-26 1983-09-02 Serras Paulet Edouard Circuit electrique imprime
DE3214097A1 (de) * 1982-04-16 1983-10-20 ITALTEL Società Italiana Telecomunicazioni S.p.A., 20149 Milano Verfahren, mit dem durchgehende loecher in elektrischen schaltungstraegern leitfaehig gemacht werden
JPS5923548A (ja) * 1982-07-30 1984-02-07 Fujitsu Ltd 半導体装置
DE3245458A1 (de) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von durchkontaktierungen in dickschichttechnik
JPS6047495A (ja) * 1983-08-25 1985-03-14 株式会社日立製作所 セラミツク配線基板
JPS6084711A (ja) * 1983-10-14 1985-05-14 株式会社日立製作所 スル−ホ−ル充填用ペ−スト
GB2176942A (en) * 1983-11-10 1987-01-07 Donald Fort Sullivan Making printed circuit boards
FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
US4544577A (en) * 1984-04-26 1985-10-01 E. F. Johnson Company Process for metallization of dielectric substrate through holes
JPS6112054A (ja) * 1984-06-22 1986-01-20 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パツケ−ジ製造方法
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
US4919970A (en) * 1986-09-15 1990-04-24 International Business Machines Corporation Solder deposition control
JPH0754872B2 (ja) * 1987-06-22 1995-06-07 古河電気工業株式会社 二層印刷回路シ−トの製造方法
US4802741A (en) * 1987-10-09 1989-02-07 Eastman Kodak Company In-depth electrode light valve array devices and improved fabrication method therefor
US4785989A (en) * 1987-11-16 1988-11-22 Gte Products Corporation Clad system for brazing to alumina
US5089881A (en) * 1988-11-03 1992-02-18 Micro Substrates, Inc. Fine-pitch chip carrier
JPH02152105A (ja) * 1988-12-01 1990-06-12 Fujitsu Ltd 導電材料およびその製造方法
US4954313A (en) * 1989-02-03 1990-09-04 Amdahl Corporation Method and apparatus for filling high density vias
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
DE68912932T2 (de) * 1989-05-12 1994-08-11 Ibm Deutschland Glas-Keramik-Gegenstand und Verfahren zu dessen Herstellung.
JPH0480991A (ja) * 1990-07-24 1992-03-13 Cmk Corp プリント配線板の製造方法
US5283104A (en) * 1991-03-20 1994-02-01 International Business Machines Corporation Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
AT398876B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
US5367764A (en) * 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
JP2601128B2 (ja) * 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
US5766670A (en) * 1993-11-17 1998-06-16 Ibm Via fill compositions for direct attach of devices and methods for applying same
JP3015621B2 (ja) * 1993-05-10 2000-03-06 松下電器産業株式会社 導体ペ−スト組成物
TW349984B (en) * 1993-09-13 1999-01-11 Starck H C Gmbh Co Kg Pastes for the coating of substrates, methods for manufacturing them and their use
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5538582A (en) * 1994-09-14 1996-07-23 International Business Machines Corporation Method for forming cavities without using an insert
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5707476A (en) * 1995-09-19 1998-01-13 International Business Machines Corporation Method for forming multiple cavity products
US5707480A (en) * 1995-09-19 1998-01-13 International Business Machines Corporation Apparatus for forming multiple cavity products
US5746874A (en) * 1995-09-29 1998-05-05 International Business Machines Corporation Apparatus and method for forming cavity substrates using flexible preform insert
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
US5915756A (en) * 1996-08-22 1999-06-29 Altera Corporation Method to fill via holes between two conductive layers
US6622603B1 (en) * 1997-03-12 2003-09-23 International Business Machines Corporation Linear via punch
US6288344B1 (en) * 1999-08-20 2001-09-11 Cardiac Pacemakers, Inc. Integrated EMI shield utilizing a hybrid edge
US6352014B1 (en) * 1999-12-15 2002-03-05 International Business Machines Corporation Method for making punches using multi-layer ceramic technology
US6833615B2 (en) * 2000-12-29 2004-12-21 Intel Corporation Via-in-pad with off-center geometry
US6762380B2 (en) * 2001-06-29 2004-07-13 Icorp Membrane switch circuit layout and method for manufacturing
US20050108875A1 (en) * 2003-11-26 2005-05-26 Mathieu Gaetan L. Methods for making vertical electric feed through structures usable to form removable substrate tiles in a wafer test system
US7024763B2 (en) 2003-11-26 2006-04-11 Formfactor, Inc. Methods for making plated through holes usable as interconnection wire or probe attachments
WO2009029804A2 (en) * 2007-08-31 2009-03-05 Reactive Nanotechnologies, Inc. Method for low temperature bonding of electronic components
KR20110049247A (ko) * 2009-11-04 2011-05-12 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101596098B1 (ko) * 2013-11-25 2016-02-29 주식회사 잉크테크 인쇄회로기판의 제조방법
US12020956B2 (en) 2019-05-03 2024-06-25 Therm-X Of California, Inc. High temperature aluminum nitride heater pedestal with multi-zone capability

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1188157B (de) * 1961-04-21 1965-03-04 Litton Industries Inc Verfahren zur Herstellung einer geschichteten, gedruckten Schaltungsplatte
FR1386216A (fr) * 1963-04-25 1965-01-22 Rca Corp Circuits électriques multicouches
US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
US3948706A (en) * 1973-12-13 1976-04-06 International Business Machines Corporation Method for metallizing ceramic green sheets

Also Published As

Publication number Publication date
DE2558361C2 (de) 1982-04-08
JPS5437294B2 (en:Method) 1979-11-14
FR2296988A1 (fr) 1976-07-30
GB1487800A (en) 1977-10-05
JPS5180965A (en:Method) 1976-07-15
DE2558361A1 (de) 1976-07-08
FR2296988B1 (en:Method) 1977-07-08
US4024629A (en) 1977-05-24
CA1043189A (en) 1978-11-28

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