IN2015DN02878A - - Google Patents

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Publication number
IN2015DN02878A
IN2015DN02878A IN2878DEN2015A IN2015DN02878A IN 2015DN02878 A IN2015DN02878 A IN 2015DN02878A IN 2878DEN2015 A IN2878DEN2015 A IN 2878DEN2015A IN 2015DN02878 A IN2015DN02878 A IN 2015DN02878A
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IN
India
Prior art keywords
layer
bonding
circuit layer
circuit
semiconductor element
Prior art date
Application number
Other languages
English (en)
Inventor
Shuji Nishimoto
Yoshiyuki Nagatomo
Toshiyuki Nagase
Original Assignee
Mitsubishi Materials Corp
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Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2015DN02878A publication Critical patent/IN2015DN02878A/en

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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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JP2012224257A JP5664625B2 (ja) 2012-10-09 2012-10-09 半導体装置、セラミックス回路基板及び半導体装置の製造方法
PCT/JP2013/077217 WO2014057902A1 (ja) 2012-10-09 2013-10-07 半導体装置、セラミックス回路基板及び半導体装置の製造方法

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JP5664625B2 (ja) 2015-02-04
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CN104704618A (zh) 2015-06-10
EP2908333A1 (en) 2015-08-19
JP2014078558A (ja) 2014-05-01
US20150255419A1 (en) 2015-09-10
TW201421618A (zh) 2014-06-01
TWI609462B (zh) 2017-12-21
KR102163532B1 (ko) 2020-10-08
WO2014057902A1 (ja) 2014-04-17
EP2908333A4 (en) 2016-06-08
US9401340B2 (en) 2016-07-26

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