IN2015DN00149A - - Google Patents

Download PDF

Info

Publication number
IN2015DN00149A
IN2015DN00149A IN149DEN2015A IN2015DN00149A IN 2015DN00149 A IN2015DN00149 A IN 2015DN00149A IN 149DEN2015 A IN149DEN2015 A IN 149DEN2015A IN 2015DN00149 A IN2015DN00149 A IN 2015DN00149A
Authority
IN
India
Prior art keywords
carbon atoms
heterocyclic compound
containing heterocyclic
compound
atoms
Prior art date
Application number
Other languages
English (en)
Inventor
Shusaku IIDA
Takayuki Murai
Hirohiko Hirao
Original Assignee
Shikoku Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chem filed Critical Shikoku Chem
Publication of IN2015DN00149A publication Critical patent/IN2015DN00149A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
    • B05D1/305—Curtain coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B05D1/42—Distributing applied liquids or other fluent materials by members moving relatively to surface by non-rotary members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/08—Copper compounds
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
IN149DEN2015 2012-07-09 2013-05-30 IN2015DN00149A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012154124 2012-07-09
PCT/JP2013/065108 WO2014010328A1 (ja) 2012-07-09 2013-05-30 銅被膜形成剤及び銅被膜の形成方法

Publications (1)

Publication Number Publication Date
IN2015DN00149A true IN2015DN00149A (ja) 2015-06-12

Family

ID=49915802

Family Applications (1)

Application Number Title Priority Date Filing Date
IN149DEN2015 IN2015DN00149A (ja) 2012-07-09 2013-05-30

Country Status (10)

Country Link
US (1) US10405422B2 (ja)
EP (1) EP2871260B1 (ja)
JP (1) JP6027613B2 (ja)
KR (1) KR102086501B1 (ja)
CN (1) CN104471108B (ja)
BR (1) BR112015000524B1 (ja)
IN (1) IN2015DN00149A (ja)
MY (1) MY171068A (ja)
TW (1) TWI567231B (ja)
WO (1) WO2014010328A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016079439A (ja) * 2014-10-14 2016-05-16 四国化成工業株式会社 銅被膜形成剤およびその利用
WO2016197234A1 (en) * 2015-06-11 2016-12-15 National Research Council Of Canada Preparation of high conductivity copper films
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
JP6573650B2 (ja) 2017-09-15 2019-09-11 住友化学株式会社 ガス分離方法
JP6573942B2 (ja) * 2017-09-15 2019-09-11 住友化学株式会社 ガス分離方法
KR102124324B1 (ko) * 2018-11-14 2020-06-18 와이엠티 주식회사 도금 적층체 및 인쇄회로기판
JP7427325B2 (ja) * 2019-06-18 2024-02-05 株式会社ディスコ テープ貼着方法
WO2023085246A1 (ja) * 2021-11-11 2023-05-19 コニカミノルタ株式会社 非感光性表面改質剤、積層体、プリント基板及び電子デバイス

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution
US4818255A (en) * 1987-02-10 1989-04-04 Kozo Director-general of Agency of Industrial Science and Technology Iizuka Material for gas separation
KR0137370B1 (ko) 1988-11-07 1998-04-27 니시가와 레이치 구리 도금된 수지 제품의 제조방법
JPH06181387A (ja) 1992-12-15 1994-06-28 Mitsubishi Gas Chem Co Inc 銅膜形成基材の製造法
TW263534B (ja) * 1993-08-11 1995-11-21 Makkusu Kk
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
KR100707818B1 (ko) * 1998-09-14 2007-04-13 이비덴 가부시키가이샤 프린트 배선판 및 그 제조방법
JP3986743B2 (ja) * 2000-10-03 2007-10-03 株式会社日立製作所 配線基板とその製造方法及びそれに用いる無電解銅めっき液
JP4309602B2 (ja) * 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
US6951666B2 (en) 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US6770122B2 (en) * 2001-12-12 2004-08-03 E. I. Du Pont De Nemours And Company Copper deposition using copper formate complexes
WO2004103043A1 (ja) * 2003-05-16 2004-11-25 Harima Chemicals, Inc. 銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法
DE10325243A1 (de) 2003-06-03 2004-12-23 Basf Ag Abscheidung von Kupferschichten auf Substraten
EP1496061B1 (en) 2003-07-03 2008-12-03 Mec Company Ltd. Copper compound and method for producing copper thin film using the same
JP4360981B2 (ja) 2003-07-03 2009-11-11 メック株式会社 銅薄膜の製造方法
JP3952410B2 (ja) * 2004-02-10 2007-08-01 タムラ化研株式会社 金属の表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法
TW200613586A (en) 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
EP1629902A1 (en) * 2004-08-30 2006-03-01 E.I. Dupont De Nemours And Company Method of copper deposition from a supercritical fluid solution containing copper (1) complexes with a neutral ligand
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
JP4489618B2 (ja) * 2005-03-14 2010-06-23 株式会社ルネサステクノロジ 半導体装置の製造方法
US7662981B2 (en) 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
KR20080083790A (ko) * 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
WO2009066658A1 (ja) 2007-11-19 2009-05-28 Nihon Parkerizing Co., Ltd. 金属材料用下地処理剤および金属材料の下地処理方法
JP2009256218A (ja) 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
US8449948B2 (en) * 2009-09-10 2013-05-28 Western Digital (Fremont), Llc Method and system for corrosion protection of layers in a structure of a magnetic recording transducer
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US20110220512A1 (en) * 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
JP5620795B2 (ja) * 2010-11-26 2014-11-05 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
KR101194541B1 (ko) * 2010-12-09 2012-10-26 삼성전기주식회사 주석 또는 주석 합금 도금의 변색 방지제, 및 이를 이용한 회로 기판 및 그 제조방법
JP5615227B2 (ja) * 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用

Also Published As

Publication number Publication date
MY171068A (en) 2019-09-24
WO2014010328A1 (ja) 2014-01-16
JP6027613B2 (ja) 2016-11-16
BR112015000524B1 (pt) 2021-03-30
CN104471108B (zh) 2020-05-05
TWI567231B (zh) 2017-01-21
US20150189748A1 (en) 2015-07-02
EP2871260A1 (en) 2015-05-13
EP2871260A4 (en) 2016-07-06
BR112015000524A2 (ja) 2019-12-31
US10405422B2 (en) 2019-09-03
KR102086501B1 (ko) 2020-03-09
TW201406991A (zh) 2014-02-16
EP2871260B1 (en) 2019-03-06
CN104471108A (zh) 2015-03-25
JPWO2014010328A1 (ja) 2016-06-20
KR20150034168A (ko) 2015-04-02

Similar Documents

Publication Publication Date Title
IN2015DN00149A (ja)
PH12016501375A1 (en) Pyridin-2-amides useful as cb2 agonists
PH12015501083B1 (en) Novel pyridine derivatives
IN2015DN03795A (ja)
PH12015501843A1 (en) Novel pyrazol derivatives
MY179412A (en) Pyridine-2-amides useful as cb2 agonists
MY182328A (en) Pyridine-2-amides useful as cb2 agonists
PH12016500250A1 (en) Novel triazolo [4,5-d] pyrimidine derivatives
PH12015501933A1 (en) Novel pyridine derivatives
MX2013014242A (es) Piridopirazinas como inhibidores novedosos de ptk.
IN2014DN06104A (ja)
PH12015502471A1 (en) Purine derivatives as cb2 receptor agonists
PH12015501175A1 (en) Substituted pyridopyrazines as syk inhibitors
MX2014014468A (es) Compuestos triazolo como inhibidores de fosfodiesterasa 10 (pde10).
PH12015502409A1 (en) Pyrrolo[2,3-d]pyrimidine derivatives as cb2 receptor agonists
MX349373B (es) Nuevos derivados de pirazina.
MX2014008141A (es) Amidas macrociclicas como inhibidores de proteasas.
MX2014013036A (es) 6-piridon-2-carbamoil-azoles y su uso como herbicidas.
IN2014DN10669A (ja)
MX342960B (es) Derivados de cromeno.
MX2015016766A (es) Nuevos derivados de tetrazolona.
PH12015500262A1 (en) Novel pyridine derivatives