JP4489618B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4489618B2 JP4489618B2 JP2005070788A JP2005070788A JP4489618B2 JP 4489618 B2 JP4489618 B2 JP 4489618B2 JP 2005070788 A JP2005070788 A JP 2005070788A JP 2005070788 A JP2005070788 A JP 2005070788A JP 4489618 B2 JP4489618 B2 JP 4489618B2
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31633—Deposition of carbon doped silicon oxide, e.g. SiOC
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
Description
×100 (1)
図4に、SiOC膜のテープテストの結果をまとめる。テープテストには、Si−CH3/Si−O結合比が2.30%、2.40%、2.50%、2.55%および2.90%の5つのSiOC膜を用いた。テープ荷重は220g/cmであり、測定には半導体基板上にSiOC膜(厚さ500nm)、TEOS膜(厚さ50nm)、Ta/TaN積層膜(厚さ100nm)、Cu膜(厚さ600〜700nm)を下層から順に堆積した積層構造の試料を用いた。
2 素子分離部
3 pウェル
4 nウェル
5 ゲート絶縁膜
6 ゲート電極
7 キャップ絶縁膜
8 サイドウォール
9 n型半導体領域
10 p型半導体領域
11 層間絶縁膜
12 接続孔
13 プラグ
14 ストッパ絶縁膜
15 配線層間膜
15a SiOC膜
15b TEOS膜
16 配線溝
17 バリアメタル層
18 銅膜
19 配線
20 キャップ絶縁膜
21 ビア層間膜
22 ストッパ絶縁膜
23 配線層間膜
24 接続孔
25 配線溝
26 バリアメタル層
27 銅膜
28 配線
29 ダイシング装置
30 ダイシングテーブル
31 円形刃
32 チップ
33 ダイシングテープ
34 フレーム
Claims (7)
- 金属材料からなる単層または多層の配線を半導体基板上に形成する半導体装置の製造方法であって、
前記半導体基板上に層間膜としてSiOC膜を形成する工程と、
前記SiOC膜上にTEOS膜を形成する工程と、
前記SiOC膜およびTEOS膜の所定の領域に配線溝を形成する工程と、
前記配線溝内および前記配線溝の外の前記TEOS膜上に前記金属材料を堆積する工程と、
前記配線溝以外の前記TEOS膜上の前記金属材料をCMP法により研磨して除去する工程と、を有し、
前記SiOC膜は、FT−IRから求まる前記SiOC膜のSi−CH3結合とSi−O結合との結合比が2.05〜2.49%の範囲であることを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、前記SiOC膜の比誘電率は3以下であることを特徴とする半導体装置の製造方法。
- 請求項1記載の半導体装置の製造方法において、前記SiOC膜の硬度は2.8Gpa以上であることを特徴とする半導体装置の製造方法。
- 請求項1記載の半導体装置の製造方法において、前記SiOC膜の弾性率は18Gpa以上であることを特徴とする半導体装置の製造方法。
- 請求項1記載の半導体装置の製造方法において、前記SiOC膜はプラズマCVD法により形成されることを特徴とする半導体装置の製造方法。
- 請求項5記載の半導体装置の製造方法において、前記SiOC膜は、圧力400〜600Pa、DMDMOS流量200〜350sccm、He流量100〜200sccm、RFパワー3000〜4000W、基板温度350〜400℃の成膜条件により形成されることを特徴とする半導体装置の製造方法。
- 請求項1記載の半導体装置の製造方法において、前記配線は、銅を主導体層とするダマシン配線であることを特徴とする半導体装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2005070788A JP4489618B2 (ja) | 2005-03-14 | 2005-03-14 | 半導体装置の製造方法 |
US11/374,075 US7718269B2 (en) | 2005-03-14 | 2006-03-14 | Semiconductor manufacturing method for inter-layer insulating film |
US12/781,812 US8158266B2 (en) | 2005-03-14 | 2010-05-17 | Semiconductor manufacturing method for inter-layer insulating film |
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JP2005070788A JP4489618B2 (ja) | 2005-03-14 | 2005-03-14 | 半導体装置の製造方法 |
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JP2006253557A JP2006253557A (ja) | 2006-09-21 |
JP4489618B2 true JP4489618B2 (ja) | 2010-06-23 |
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JP (1) | JP4489618B2 (ja) |
Families Citing this family (15)
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US7485570B2 (en) * | 2002-10-30 | 2009-02-03 | Fujitsu Limited | Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
JP4338495B2 (ja) * | 2002-10-30 | 2009-10-07 | 富士通マイクロエレクトロニクス株式会社 | シリコンオキシカーバイド、半導体装置、および半導体装置の製造方法 |
US20080096331A1 (en) * | 2006-10-04 | 2008-04-24 | Neng-Kuo Chen | Method for fabricating high compressive stress film and strained-silicon transistors |
KR100824637B1 (ko) * | 2007-06-26 | 2008-04-25 | 주식회사 동부하이텍 | Nor 플래쉬 디바이스 및 그의 제조 방법 |
JP5507197B2 (ja) * | 2009-10-23 | 2014-05-28 | スタンレー電気株式会社 | 光半導体素子、光半導体素子の製造方法及び光半導体装置の製造方法 |
US8709551B2 (en) * | 2010-03-25 | 2014-04-29 | Novellus Systems, Inc. | Smooth silicon-containing films |
US8741394B2 (en) | 2010-03-25 | 2014-06-03 | Novellus Systems, Inc. | In-situ deposition of film stacks |
US9028924B2 (en) | 2010-03-25 | 2015-05-12 | Novellus Systems, Inc. | In-situ deposition of film stacks |
KR102025441B1 (ko) | 2012-04-06 | 2019-09-25 | 노벨러스 시스템즈, 인코포레이티드 | 증착 후 소프트 어닐링 |
US9117668B2 (en) | 2012-05-23 | 2015-08-25 | Novellus Systems, Inc. | PECVD deposition of smooth silicon films |
MY171068A (en) * | 2012-07-09 | 2019-09-24 | Shikoku Chem | Copper film-forming agent and method for forming copper film |
US9388491B2 (en) | 2012-07-23 | 2016-07-12 | Novellus Systems, Inc. | Method for deposition of conformal films with catalysis assisted low temperature CVD |
US8895415B1 (en) | 2013-05-31 | 2014-11-25 | Novellus Systems, Inc. | Tensile stressed doped amorphous silicon |
GB201522552D0 (en) * | 2015-12-21 | 2016-02-03 | Spts Technologies Ltd | Method of improving adhesion |
CN105734956B (zh) * | 2016-01-29 | 2017-10-27 | 天津大学 | 一种在碳材料表面制备二氧化硅/硅氧碳复合涂层的方法 |
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US6303523B2 (en) | 1998-02-11 | 2001-10-16 | Applied Materials, Inc. | Plasma processes for depositing low dielectric constant films |
SG98468A1 (en) | 2001-01-17 | 2003-09-19 | Air Prod & Chem | Organosilicon precursors for interlayer dielectric films with low dielectric constants |
US6583048B2 (en) | 2001-01-17 | 2003-06-24 | Air Products And Chemicals, Inc. | Organosilicon precursors for interlayer dielectric films with low dielectric constants |
JP2003124307A (ja) | 2001-10-15 | 2003-04-25 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2004111688A (ja) | 2002-09-19 | 2004-04-08 | Semiconductor Leading Edge Technologies Inc | 半導体装置および半導体装置の製造方法 |
JP4606713B2 (ja) | 2002-10-17 | 2011-01-05 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2004153015A (ja) | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP4338495B2 (ja) | 2002-10-30 | 2009-10-07 | 富士通マイクロエレクトロニクス株式会社 | シリコンオキシカーバイド、半導体装置、および半導体装置の製造方法 |
JP3898133B2 (ja) | 2003-01-14 | 2007-03-28 | Necエレクトロニクス株式会社 | SiCHN膜の成膜方法。 |
US7138158B2 (en) * | 2003-02-28 | 2006-11-21 | Intel Corporation | Forming a dielectric layer using a hydrocarbon-containing precursor |
JP4235066B2 (ja) * | 2003-09-03 | 2009-03-04 | 日本エー・エス・エム株式会社 | 薄膜形成方法 |
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US7718269B2 (en) | 2010-05-18 |
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US8158266B2 (en) | 2012-04-17 |
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