WO2009066658A1 - 金属材料用下地処理剤および金属材料の下地処理方法 - Google Patents

金属材料用下地処理剤および金属材料の下地処理方法 Download PDF

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Publication number
WO2009066658A1
WO2009066658A1 PCT/JP2008/070936 JP2008070936W WO2009066658A1 WO 2009066658 A1 WO2009066658 A1 WO 2009066658A1 JP 2008070936 W JP2008070936 W JP 2008070936W WO 2009066658 A1 WO2009066658 A1 WO 2009066658A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
metal material
processing agent
group
base processing
Prior art date
Application number
PCT/JP2008/070936
Other languages
English (en)
French (fr)
Inventor
Masaya Miyazaki
Kazuhiko Mori
Kazuya Nakada
Kuniyoshi Murakami
Original Assignee
Nihon Parkerizing Co., Ltd.
Henkel Ag & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Parkerizing Co., Ltd., Henkel Ag & Co. Kgaa filed Critical Nihon Parkerizing Co., Ltd.
Priority to KR1020107010749A priority Critical patent/KR101167476B1/ko
Priority to CN200880116813XA priority patent/CN101868563B/zh
Priority to JP2009542553A priority patent/JP5167270B2/ja
Publication of WO2009066658A1 publication Critical patent/WO2009066658A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Chemically Coating (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

　本発明は、金属材料表面を粗化することなく金属材料とプリプレグなどの樹脂との接着性、特に高温下での接着性を良好とし、かつ、６価クロム等の環境汚染の原因となる物質を用いず、環境負荷が小さく、低コストな金属材料用下地処理剤、それを用いた生産性に優れ、環境面でも有利な金属材料の下地処理方法、この下地処理方法により得られる下地処理被膜付き金属材料および積層部材を提供することを目的とする。本発明の金属材料用下地処理剤は、１個以上のベンゼン核と、水酸基、カルボキシ基およびアミノ基からなる群から選択され、前記ベンゼン核を構成する炭素原子に直接結合する２個以上の官能基とを有する化合物（Ａ－１）およびチオ尿素誘導体（Ａ－２）からなる群から選ばれる少なくとも１種の化合物（Ａ）と、少なくとも１種のエラストマー（Ｂ）とを含有する。
PCT/JP2008/070936 2007-11-19 2008-11-18 金属材料用下地処理剤および金属材料の下地処理方法 WO2009066658A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107010749A KR101167476B1 (ko) 2007-11-19 2008-11-18 금속재료용 하지처리제 및 금속재료의 하지처리방법
CN200880116813XA CN101868563B (zh) 2007-11-19 2008-11-18 金属材料用基底处理剂和金属材料的基底处理方法
JP2009542553A JP5167270B2 (ja) 2007-11-19 2008-11-18 金属材料用下地処理剤および金属材料の下地処理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007299051 2007-11-19
JP2007-299051 2007-11-19

Publications (1)

Publication Number Publication Date
WO2009066658A1 true WO2009066658A1 (ja) 2009-05-28

Family

ID=40667480

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070936 WO2009066658A1 (ja) 2007-11-19 2008-11-18 金属材料用下地処理剤および金属材料の下地処理方法

Country Status (5)

Country Link
JP (1) JP5167270B2 (ja)
KR (1) KR101167476B1 (ja)
CN (1) CN101868563B (ja)
TW (1) TWI424087B (ja)
WO (1) WO2009066658A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011061899A1 (ja) * 2009-11-17 2011-05-26 日本パーカライジング株式会社 銅材料の下地処理方法および下地処理被膜付き銅材料
US20120237755A1 (en) * 2011-03-14 2012-09-20 Hon Hai Precision Industry Co., Ltd. Stainless steel-and-resin composite and method for making same
JP2012200989A (ja) * 2011-03-25 2012-10-22 Toyota Central R&D Labs Inc 樹脂金属複合材料およびその製造方法
WO2013058390A1 (ja) * 2011-10-21 2013-04-25 株式会社ブリヂストン ゴム組成物及びその製造方法
JP2013087272A (ja) * 2011-10-21 2013-05-13 Bridgestone Corp ゴム組成物及びその製造方法
WO2013157574A1 (ja) * 2012-04-19 2013-10-24 日本パーカライジング株式会社 自己析出型銅用表面処理剤および樹脂皮膜付き銅含有基材の製造方法
JP2013221210A (ja) * 2012-04-19 2013-10-28 Hitachi Ltd 防食処理アルミニウム材及びその製造方法
JP2016222956A (ja) * 2015-05-28 2016-12-28 石原ケミカル株式会社 銅表面処理用の置換ニッケルメッキ浴、当該メッキ浴を用いた銅張り部品の製造方法並びに当該銅張り部品
EP3636802A4 (en) * 2017-05-11 2020-06-03 MEC Company Ltd. FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SURFACE-TREATED METAL MEMBER, AND METHOD FOR PRODUCING METAL-RESIN COMPOSITE
JP2020525642A (ja) * 2017-06-27 2020-08-27 バルク ケミカルズ，インコーポレイティド 無機ノンクロム水性処理組成物および金属表面をコーティングするための方法
CN115770620A (zh) * 2022-11-18 2023-03-10 北京工业大学 一种贵金属衬底的异相化单位点制备方法
CN116056344A (zh) * 2023-03-22 2023-05-02 浙江花园新能源股份有限公司 一种埋入式电阻铜箔的生产工艺及其产品

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KR101134920B1 (ko) * 2011-06-03 2012-04-17 한국기초과학지원연구원 고분자 수지-구리 결합체 및 이의 제조방법
JP2013056441A (ja) * 2011-09-07 2013-03-28 Sumitomo Light Metal Ind Ltd 導電性プレコートアルミニウム合金板
KR101243901B1 (ko) * 2012-03-21 2013-03-20 주식회사 태성포리테크 알루미늄-고분자 수지 접합체 및 이의 제조방법
KR101243282B1 (ko) * 2012-03-21 2013-03-13 주식회사 태성포리테크 구리-고분자 수지 접합체 및 이의 제조방법
CN102718965B (zh) * 2012-06-27 2014-04-09 沈阳理工大学 电化学合成氧化钴/聚苯胺复合材料的电解液
US10405422B2 (en) 2012-07-09 2019-09-03 Shikoku Chemicals Corporation Copper film-forming agent and method for forming copper film
CN105568302A (zh) * 2015-12-31 2016-05-11 芜湖市金宇石化设备有限公司 一种铝材的表面处理工艺
CN105543869A (zh) * 2015-12-31 2016-05-04 芜湖市金宇石化设备有限公司 一种用于铝材表面处理的清洗液
CN105543868A (zh) * 2015-12-31 2016-05-04 芜湖市金宇石化设备有限公司 一种用于铝材表面处理的清洗液的制备方法
US10610458B2 (en) * 2017-09-08 2020-04-07 Ormco Corporation Orthodontic adhesives and methods of using same
CN107645852B (zh) * 2017-09-18 2020-01-14 乐凯特科技铜陵有限公司 一种高频印制电路板用双面铜箔表面处理工艺
US11299654B2 (en) * 2019-08-20 2022-04-12 Roller Bearing Company Of America, Inc. Permanent, self-adhering, self-lubricating, anti-wear composite system
CN110423999A (zh) * 2019-08-30 2019-11-08 深圳市天得一环境科技有限公司 一种不锈钢表面亲水处理方法
CN114845862A (zh) * 2019-12-13 2022-08-02 Ａｇｃ株式会社 带拒水拒油层的物品及带拒水拒油层的物品的制造方法
CN111867275B (zh) * 2020-07-31 2021-08-24 国网河南省电力公司西峡县供电公司 一种提高印刷电路板层间结合力的棕化方法
CN112188765B (zh) * 2020-10-12 2022-05-17 深圳市格仕乐科技有限公司 5g机箱底座生产成型工艺
CN114350241B (zh) * 2022-01-14 2022-07-15 江阴市金巨不锈钢制造有限公司 深海用耐高压抗腐蚀法兰及其加工工艺
CN115304973B (zh) * 2022-09-13 2023-09-26 湖南松井新材料股份有限公司 一种微观腐蚀型尼龙玻纤处理剂及其制备方法和应用

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JP2003073515A (ja) * 2001-09-04 2003-03-12 Marugo Rubber Ind Co Ltd 熱可塑性エラストマー組成物及びその製造方法
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011105989A (ja) * 2009-11-17 2011-06-02 Nippon Parkerizing Co Ltd 銅材料の下地処理方法および下地処理被膜付き銅材料
WO2011061899A1 (ja) * 2009-11-17 2011-05-26 日本パーカライジング株式会社 銅材料の下地処理方法および下地処理被膜付き銅材料
US8784981B2 (en) * 2011-03-14 2014-07-22 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Stainless steel-and-resin composite and method for making same
US20120237755A1 (en) * 2011-03-14 2012-09-20 Hon Hai Precision Industry Co., Ltd. Stainless steel-and-resin composite and method for making same
JP2012200989A (ja) * 2011-03-25 2012-10-22 Toyota Central R&D Labs Inc 樹脂金属複合材料およびその製造方法
WO2013058390A1 (ja) * 2011-10-21 2013-04-25 株式会社ブリヂストン ゴム組成物及びその製造方法
JP2013087272A (ja) * 2011-10-21 2013-05-13 Bridgestone Corp ゴム組成物及びその製造方法
EP2770022A1 (en) * 2011-10-21 2014-08-27 Bridgestone Corporation Rubber composition and manufacturing method for same
EP2770022A4 (en) * 2011-10-21 2015-04-22 Bridgestone Corp RUBBER COMPOSITION AND METHOD FOR MANUFACTURING THE SAME
WO2013157574A1 (ja) * 2012-04-19 2013-10-24 日本パーカライジング株式会社 自己析出型銅用表面処理剤および樹脂皮膜付き銅含有基材の製造方法
JP2013221210A (ja) * 2012-04-19 2013-10-28 Hitachi Ltd 防食処理アルミニウム材及びその製造方法
JP2016222956A (ja) * 2015-05-28 2016-12-28 石原ケミカル株式会社 銅表面処理用の置換ニッケルメッキ浴、当該メッキ浴を用いた銅張り部品の製造方法並びに当該銅張り部品
EP3636802A4 (en) * 2017-05-11 2020-06-03 MEC Company Ltd. FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SURFACE-TREATED METAL MEMBER, AND METHOD FOR PRODUCING METAL-RESIN COMPOSITE
US10883027B2 (en) 2017-05-11 2021-01-05 Mec Company Ltd. Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite
JP2020525642A (ja) * 2017-06-27 2020-08-27 バルク ケミカルズ，インコーポレイティド 無機ノンクロム水性処理組成物および金属表面をコーティングするための方法
CN115770620A (zh) * 2022-11-18 2023-03-10 北京工业大学 一种贵金属衬底的异相化单位点制备方法
CN116056344A (zh) * 2023-03-22 2023-05-02 浙江花园新能源股份有限公司 一种埋入式电阻铜箔的生产工艺及其产品
CN116056344B (zh) * 2023-03-22 2023-09-01 浙江花园新能源股份有限公司 一种埋入式电阻铜箔的生产工艺及其产品

Also Published As

Publication number Publication date
KR20100082854A (ko) 2010-07-20
TWI424087B (zh) 2014-01-21
CN101868563A (zh) 2010-10-20
KR101167476B1 (ko) 2012-07-27
TW200936810A (en) 2009-09-01
CN101868563B (zh) 2012-09-12
JP5167270B2 (ja) 2013-03-21
JPWO2009066658A1 (ja) 2011-04-07

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