IN2014DN03368A - - Google Patents

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Publication number
IN2014DN03368A
IN2014DN03368A IN3368DEN2014A IN2014DN03368A IN 2014DN03368 A IN2014DN03368 A IN 2014DN03368A IN 3368DEN2014 A IN3368DEN2014 A IN 3368DEN2014A IN 2014DN03368 A IN2014DN03368 A IN 2014DN03368A
Authority
IN
India
Prior art keywords
less
deposit
satisfied
mass
particle size
Prior art date
Application number
Other languages
English (en)
Inventor
Kazunari Maki
Hiroyuki Mori
Original Assignee
Mitsubishi Materials Corp
Mitsubishi Shindo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp, Mitsubishi Shindo Kk filed Critical Mitsubishi Materials Corp
Publication of IN2014DN03368A publication Critical patent/IN2014DN03368A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Metal Rolling (AREA)
  • Powder Metallurgy (AREA)
IN3368DEN2014 2012-01-06 2013-01-04 IN2014DN03368A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012001177 2012-01-06
JP2012203517 2012-09-14
PCT/JP2013/050004 WO2013103149A1 (ja) 2012-01-06 2013-01-04 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用銅合金の製造方法、電子・電気機器用導電部品および端子

Publications (1)

Publication Number Publication Date
IN2014DN03368A true IN2014DN03368A (ja) 2015-06-26

Family

ID=48745206

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3368DEN2014 IN2014DN03368A (ja) 2012-01-06 2013-01-04

Country Status (11)

Country Link
US (1) US8951369B2 (ja)
EP (2) EP2801630B1 (ja)
JP (1) JP5303678B1 (ja)
KR (1) KR101437307B1 (ja)
CN (2) CN103502489B (ja)
AU (1) AU2013207042B2 (ja)
CA (1) CA2852084A1 (ja)
IN (1) IN2014DN03368A (ja)
MX (1) MX352545B (ja)
TW (1) TWI452154B (ja)
WO (1) WO2013103149A1 (ja)

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* Cited by examiner, † Cited by third party
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JP5303678B1 (ja) 2012-01-06 2013-10-02 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP5572753B2 (ja) * 2012-12-26 2014-08-13 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5417523B1 (ja) * 2012-12-28 2014-02-19 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5572754B2 (ja) 2012-12-28 2014-08-13 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5417539B1 (ja) 2013-01-28 2014-02-19 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5501495B1 (ja) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5604549B2 (ja) * 2013-03-18 2014-10-08 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
KR20160030113A (ko) * 2013-07-10 2016-03-16 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 박판, 전자·전기 기기용 도전 부품 및 단자
CN105339513B (zh) * 2013-07-10 2017-06-09 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金薄板、电子电气设备用导电元件及端子
KR101700566B1 (ko) * 2013-09-26 2017-01-26 미쓰비시 신도 가부시키가이샤 구리합금 및 구리합금판
JP6218325B2 (ja) * 2014-02-27 2017-10-25 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP5783293B1 (ja) 2014-04-22 2015-09-24 三菱マテリアル株式会社 円筒型スパッタリングターゲット用素材
EP3136433B1 (en) * 2014-04-25 2019-02-13 Mitsubishi Materials Corporation Power module substrate unit and power module
US9791390B2 (en) 2015-01-22 2017-10-17 EDAX, Incorporated Devices and systems for spatial averaging of electron backscatter diffraction patterns
JP2018070916A (ja) * 2016-10-26 2018-05-10 株式会社神戸製鋼所 銅合金
CN109338151B (zh) * 2018-12-14 2021-07-20 宁波博威合金材料股份有限公司 一种电子电气设备用铜合金及用途
US11926889B2 (en) 2019-08-06 2024-03-12 Mitsubishi Materials Corporation Copper alloy plate, copper alloy plate with plating film, and methods for producing these
JP7014211B2 (ja) 2019-09-27 2022-02-01 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7347402B2 (ja) * 2020-11-25 2023-09-20 ウシオ電機株式会社 回転式ホイルトラップおよび光源装置
CN115233031B (zh) * 2021-09-07 2022-12-30 大连理工大学 一种高性能铜合金及其制备方法

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JPS52124503A (en) 1976-04-09 1977-10-19 Hitachi Zosen Corp Composite boiler
JPH0533087A (ja) 1991-07-31 1993-02-09 Furukawa Electric Co Ltd:The 小型導電性部材用銅合金
JPH06184679A (ja) 1992-12-18 1994-07-05 Mitsui Mining & Smelting Co Ltd 電気部品用銅合金
US6695934B1 (en) 1997-09-16 2004-02-24 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
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JP4186095B2 (ja) 2000-04-27 2008-11-26 Ｄｏｗａホールディングス株式会社 コネクタ用銅合金とその製造法
JP2002003966A (ja) 2000-06-20 2002-01-09 Furukawa Electric Co Ltd:The 半田接合性に優れる電子電気機器用銅合金
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JP2005029826A (ja) * 2003-07-10 2005-02-03 Hitachi Cable Ltd 電子部品用銅合金箔の製造方法
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JP5050226B2 (ja) 2005-03-31 2012-10-17 Ｄｏｗａメタルテック株式会社 銅合金材料の製造法
JP4804266B2 (ja) 2005-08-24 2011-11-02 Ｊｘ日鉱日石金属株式会社 電気電子機器用Ｃｕ−Ｚｎ−Ｓｎ合金及びその製造方法
EP2426224B1 (en) * 2006-05-26 2015-09-16 Kabushiki Kaisha Kobe Seiko Sho Copper alloy with high strength, high electrical conductivity, and excellent bendability
JP5466879B2 (ja) 2009-05-19 2014-04-09 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5468423B2 (ja) 2010-03-10 2014-04-09 株式会社神戸製鋼所 高強度高耐熱性銅合金材
JP5539055B2 (ja) * 2010-06-18 2014-07-02 株式会社Ｓｈカッパープロダクツ 電気・電子部品用銅合金材、及びその製造方法
TWI539013B (zh) 2010-08-27 2016-06-21 Furukawa Electric Co Ltd Copper alloy sheet and method of manufacturing the same
JP5088425B2 (ja) * 2011-01-13 2012-12-05 三菱マテリアル株式会社 電子・電気機器用銅合金、銅合金薄板および導電部材
JP5834528B2 (ja) 2011-06-22 2015-12-24 三菱マテリアル株式会社 電気・電子機器用銅合金
JP5303678B1 (ja) 2012-01-06 2013-10-02 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子

Also Published As

Publication number Publication date
AU2013207042A2 (en) 2014-09-11
EP3284835A2 (en) 2018-02-21
CN105154713A (zh) 2015-12-16
EP3284835A3 (en) 2018-02-28
AU2013207042B2 (en) 2016-07-21
MX2014006312A (es) 2014-06-23
CA2852084A1 (en) 2013-07-11
EP2801630A4 (en) 2015-10-07
KR20130128465A (ko) 2013-11-26
EP2801630A1 (en) 2014-11-12
AU2013207042A1 (en) 2014-05-29
TWI452154B (zh) 2014-09-11
MX352545B (es) 2017-11-29
CN103502489A (zh) 2014-01-08
US8951369B2 (en) 2015-02-10
TW201343937A (zh) 2013-11-01
CN103502489B (zh) 2015-11-25
KR101437307B1 (ko) 2014-09-03
WO2013103149A1 (ja) 2013-07-11
US20140087606A1 (en) 2014-03-27
EP2801630B1 (en) 2017-11-01
JP5303678B1 (ja) 2013-10-02
JP2014074220A (ja) 2014-04-24

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