IN2014CN04267A - - Google Patents
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- Publication number
- IN2014CN04267A IN2014CN04267A IN4267CHN2014A IN2014CN04267A IN 2014CN04267 A IN2014CN04267 A IN 2014CN04267A IN 4267CHN2014 A IN4267CHN2014 A IN 4267CHN2014A IN 2014CN04267 A IN2014CN04267 A IN 2014CN04267A
- Authority
- IN
- India
- Prior art keywords
- inorganic
- compound
- coating liquid
- coating
- thin film
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 2
- 229940043430 calcium compound Drugs 0.000 abstract 1
- 150000001674 calcium compounds Chemical class 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
- 150000002472 indium compounds Chemical class 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 150000003438 strontium compounds Chemical class 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/86—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO
- H10D62/862—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO being Group II-VI materials comprising three or more elements, e.g. CdZnTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011261991A JP5929132B2 (ja) | 2011-11-30 | 2011-11-30 | 金属酸化物薄膜形成用塗布液、金属酸化物薄膜の製造方法、及び電界効果型トランジスタの製造方法 |
| PCT/JP2012/081426 WO2013081167A1 (en) | 2011-11-30 | 2012-11-28 | Coating liquid for forming metal oxide thin film, metal oxide thin film, field-effect transistor, and method for manufacturing field-effect transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014CN04267A true IN2014CN04267A (enrdf_load_stackoverflow) | 2015-07-31 |
Family
ID=48535613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN4267CHN2014 IN2014CN04267A (enrdf_load_stackoverflow) | 2011-11-30 | 2012-11-28 |
Country Status (8)
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6454974B2 (ja) | 2013-03-29 | 2019-01-23 | 株式会社リコー | 金属酸化物膜形成用塗布液、金属酸化物膜の製造方法、及び電界効果型トランジスタの製造方法 |
| CN105408244B (zh) * | 2013-08-07 | 2019-04-12 | 株式会社尼康 | 金属氧化物膜的制造方法和晶体管的制造方法 |
| JP6180908B2 (ja) * | 2013-12-06 | 2017-08-16 | 富士フイルム株式会社 | 金属酸化物半導体膜、薄膜トランジスタ、表示装置、イメージセンサ及びｘ線センサ |
| JP6672611B2 (ja) | 2014-07-03 | 2020-03-25 | 株式会社リコー | エレクトロクロミック化合物、エレクトロクロミック組成物及び表示素子及び調光素子 |
| TWI560781B (en) * | 2014-09-10 | 2016-12-01 | Au Optronics Corp | Method for fabricating thin film transistor and apparatus thereof |
| GB201418610D0 (en) * | 2014-10-20 | 2014-12-03 | Cambridge Entpr Ltd | Transistor devices |
| CN104934444B (zh) * | 2015-05-11 | 2018-01-02 | 深圳市华星光电技术有限公司 | 共平面型氧化物半导体tft基板结构及其制作方法 |
| EP3125296B1 (en) | 2015-07-30 | 2020-06-10 | Ricoh Company, Ltd. | Field-effect transistor, display element, image display device, and system |
| JP6828293B2 (ja) | 2015-09-15 | 2021-02-10 | 株式会社リコー | ｎ型酸化物半導体膜形成用塗布液、ｎ型酸化物半導体膜の製造方法、及び電界効果型トランジスタの製造方法 |
| US10269293B2 (en) * | 2015-10-23 | 2019-04-23 | Ricoh Company, Ltd. | Field-effect transistor (FET) having gate oxide insulating layer including SI and alkaline earth elements, and display element, image display and system including FET |
| JP6607013B2 (ja) | 2015-12-08 | 2019-11-20 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| US10600916B2 (en) | 2015-12-08 | 2020-03-24 | Ricoh Company, Ltd. | Field-effect transistor, display element, image display device, and system |
| US10170635B2 (en) | 2015-12-09 | 2019-01-01 | Ricoh Company, Ltd. | Semiconductor device, display device, display apparatus, and system |
| JP6907512B2 (ja) * | 2015-12-15 | 2021-07-21 | 株式会社リコー | 電界効果型トランジスタの製造方法 |
| JP6701835B2 (ja) | 2016-03-11 | 2020-05-27 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| JP6848405B2 (ja) * | 2016-12-07 | 2021-03-24 | 株式会社リコー | 電界効果型トランジスタの製造方法 |
| CN107546262A (zh) * | 2017-07-17 | 2018-01-05 | 华南理工大学 | 一种基于锶铟氧化物的薄膜晶体管及其制备方法 |
| EP3544047A3 (en) | 2018-03-19 | 2019-11-20 | Ricoh Company, Ltd. | Coating liquid for forming oxide, method for producing oxide film, and method for producing field-effect transistor |
| CN111370495B (zh) * | 2018-12-26 | 2022-05-03 | Tcl科技集团股份有限公司 | 薄膜晶体管有源层墨水及一种薄膜晶体管的制备方法 |
| JP7326795B2 (ja) | 2019-03-20 | 2023-08-16 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| CN113314614A (zh) * | 2021-05-28 | 2021-08-27 | 电子科技大学 | 基于纳米压印法的氧化物薄膜晶体管器件及其制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0696619A (ja) | 1992-09-14 | 1994-04-08 | Matsushita Electric Ind Co Ltd | 透明導電膜形成用組成物とその形成方法 |
| JPH07320541A (ja) | 1994-05-19 | 1995-12-08 | Matsushita Electric Ind Co Ltd | 透明導電膜形成用組成物および透明導電膜の製造方法 |
| JP2001234343A (ja) | 2000-02-17 | 2001-08-31 | Asahi Denka Kogyo Kk | 金属化合物溶液及びこれを用いた薄膜の製造方法 |
| US7442408B2 (en) * | 2002-03-26 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Methods for ink-jet printing circuitry |
| US7062848B2 (en) * | 2003-09-18 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Printable compositions having anisometric nanostructures for use in printed electronics |
| US8101943B2 (en) | 2005-04-27 | 2012-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP4969141B2 (ja) | 2005-04-27 | 2012-07-04 | 株式会社半導体エネルギー研究所 | 記憶素子、半導体装置、及び記憶素子の作製方法 |
| US20090090914A1 (en) * | 2005-11-18 | 2009-04-09 | Koki Yano | Semiconductor thin film, method for producing the same, and thin film transistor |
| KR101206661B1 (ko) * | 2006-06-02 | 2012-11-30 | 삼성전자주식회사 | 동일 계열의 소재로 형성된 반도체층 및 소스/드레인전극을 포함하는 유기 전자 소자 |
| KR101390022B1 (ko) * | 2007-02-16 | 2014-04-29 | 삼성전자주식회사 | 질소를 포함하는 헤테로아로마틱계 리간드/전이금속착화합물, 이를 포함하는 버퍼층 및 상기 버퍼층을포함하는 유기박막 트랜지스터 |
| JP2009120873A (ja) | 2007-11-12 | 2009-06-04 | Dainippon Printing Co Ltd | 金属酸化物膜の製造方法 |
| WO2009081862A1 (ja) * | 2007-12-26 | 2009-07-02 | Konica Minolta Holdings, Inc. | 金属酸化物半導体およびその製造方法、半導体素子、薄膜トランジスタ |
| JP2009177149A (ja) | 2007-12-26 | 2009-08-06 | Konica Minolta Holdings Inc | 金属酸化物半導体とその製造方法および薄膜トランジスタ |
| US20100072435A1 (en) * | 2008-09-20 | 2010-03-25 | Konica Minolta Holdings, Inc. | Production method of metal oxide precursor layer, production method of metal oxide layer, and electronic device |
| JP5277832B2 (ja) | 2008-09-24 | 2013-08-28 | 大日本印刷株式会社 | 積層体の製造方法 |
| US20100163861A1 (en) * | 2008-12-29 | 2010-07-01 | Motorola, Inc. | Method and apparatus for optically transparent transistor |
| JP2010258057A (ja) * | 2009-04-22 | 2010-11-11 | Konica Minolta Holdings Inc | 金属酸化物半導体、その製造方法、及びそれを用いた薄膜トランジスタ |
| KR20110056127A (ko) * | 2009-11-20 | 2011-05-26 | 삼성전자주식회사 | 트랜지스터용 반도체 제조 방법 및 트랜지스터의 제조 방법 |
| JP6064314B2 (ja) | 2010-11-29 | 2017-01-25 | 株式会社リコー | 金属酸化物薄膜形成用塗布液、金属酸化物薄膜の製造方法、及び電界効果型トランジスタの製造方法 |
-
2011
- 2011-11-30 JP JP2011261991A patent/JP5929132B2/ja active Active
-
2012
- 2012-11-28 IN IN4267CHN2014 patent/IN2014CN04267A/en unknown
- 2012-11-28 EP EP12852690.2A patent/EP2786405B1/en active Active
- 2012-11-28 WO PCT/JP2012/081426 patent/WO2013081167A1/en active Application Filing
- 2012-11-28 KR KR1020147017669A patent/KR101697412B1/ko active Active
- 2012-11-28 CN CN201280068540.2A patent/CN104081510A/zh active Pending
- 2012-11-28 CN CN201710363619.2A patent/CN107403716A/zh active Pending
- 2012-11-28 US US14/361,150 patent/US9418842B2/en active Active
- 2012-11-29 TW TW101144794A patent/TWI559540B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201327831A (zh) | 2013-07-01 |
| TWI559540B (zh) | 2016-11-21 |
| US20140299877A1 (en) | 2014-10-09 |
| KR20140097475A (ko) | 2014-08-06 |
| CN107403716A (zh) | 2017-11-28 |
| KR101697412B1 (ko) | 2017-01-17 |
| JP5929132B2 (ja) | 2016-06-01 |
| EP2786405A1 (en) | 2014-10-08 |
| JP2013115328A (ja) | 2013-06-10 |
| EP2786405A4 (en) | 2015-04-08 |
| EP2786405B1 (en) | 2017-03-29 |
| CN104081510A (zh) | 2014-10-01 |
| US9418842B2 (en) | 2016-08-16 |
| WO2013081167A1 (en) | 2013-06-06 |
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