IN2014CH02039A - - Google Patents

Download PDF

Info

Publication number
IN2014CH02039A
IN2014CH02039A IN2039CH2014A IN2014CH02039A IN 2014CH02039 A IN2014CH02039 A IN 2014CH02039A IN 2039CH2014 A IN2039CH2014 A IN 2039CH2014A IN 2014CH02039 A IN2014CH02039 A IN 2014CH02039A
Authority
IN
India
Prior art keywords
semiconductor laser
walled section
pair
holding member
thin
Prior art date
Application number
Other languages
English (en)
Inventor
Hidenori Matsuo
Takashi Sasamuro
Hideki Kondo
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of IN2014CH02039A publication Critical patent/IN2014CH02039A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Lasers (AREA)
IN2039CH2014 2013-04-22 2014-04-21 IN2014CH02039A (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013089501 2013-04-22
JP2013150836 2013-07-19
JP2014082560A JP6311424B2 (ja) 2013-04-22 2014-04-14 光源装置

Publications (1)

Publication Number Publication Date
IN2014CH02039A true IN2014CH02039A (pl) 2015-07-03

Family

ID=50542854

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2039CH2014 IN2014CH02039A (pl) 2013-04-22 2014-04-21

Country Status (5)

Country Link
US (1) US9726329B2 (pl)
EP (2) EP4224644A3 (pl)
JP (1) JP6311424B2 (pl)
CN (1) CN104112982B (pl)
IN (1) IN2014CH02039A (pl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017026663A (ja) 2015-07-16 2017-02-02 セイコーエプソン株式会社 光源装置、照明装置、およびプロジェクター
CN109565147A (zh) * 2016-07-28 2019-04-02 Nec显示器解决方案株式会社 光源装置、投影显示装置以及冷却半导体发光元件的方法
CN113422280B (zh) 2016-09-12 2023-03-31 广埸(厦门)科技有限公司 具有激光阵列照明的系统和装置
US10571788B2 (en) 2017-07-25 2020-02-25 Seiko Epson Corporation Light source device, illumination device, and projector
CN107425411A (zh) * 2017-08-16 2017-12-01 青岛海信电器股份有限公司 激光器组件、激光显示投影仪及激光器组件制作方法
JP7039909B2 (ja) 2017-09-27 2022-03-23 セイコーエプソン株式会社 照明装置およびプロジェクター
US10422514B2 (en) 2017-12-19 2019-09-24 Sharp Kabushiki Kaisha Light source module
CN111123238A (zh) * 2018-10-31 2020-05-08 三赢科技（深圳）有限公司 镜头模组及应用其的电子设备
WO2020135497A1 (en) * 2018-12-26 2020-07-02 Xiamen Chaoxuan Photoelectric Technology Co., Ltd. System and device with laser array illumination
WO2021162047A1 (ja) * 2020-02-13 2021-08-19 日亜化学工業株式会社 発光モジュール
CN113097858B (zh) * 2021-06-10 2021-08-24 深圳市星汉激光科技股份有限公司 一种底板局部减薄的半导体激光器

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500768A (en) * 1993-04-16 1996-03-19 Bruce McCaul Laser diode/lens assembly
JPH08107252A (ja) * 1994-10-06 1996-04-23 Mitsubishi Electric Corp 半導体レーザ装置，及び半導体レーザアレイ装置
JP3616698B2 (ja) 1996-10-11 2005-02-02 新光電気工業株式会社 ヒートシンク付きステムの製造方法
US20020110328A1 (en) * 2001-02-14 2002-08-15 Bischel William K. Multi-channel laser pump source for optical amplifiers
US7280572B2 (en) * 2002-03-25 2007-10-09 Sanyo Electric Co., Ltd. Semiconductor laser beam device
JP2004325929A (ja) * 2003-04-25 2004-11-18 Kyocera Mita Corp 光学走査装置
JP2005167189A (ja) 2003-11-13 2005-06-23 Hitachi Cable Ltd 光−電気変換モジュール及びそれを用いた光トランシーバ
US7196389B2 (en) 2005-02-14 2007-03-27 Mitsubishi Denki Kabushiki Kaisha Optical semiconductor device package and optical semiconductor device
JP2007048938A (ja) * 2005-08-10 2007-02-22 Rohm Co Ltd 半導体レーザ
JP2007059692A (ja) 2005-08-25 2007-03-08 Sumitomo Electric Ind Ltd 光モジュール
JP5358806B2 (ja) 2007-05-23 2013-12-04 Ｕｈｔ株式会社 ドリル
JP5079474B2 (ja) * 2007-11-29 2012-11-21 シャープ株式会社 キャップ部材およびそれを用いた半導体装置
JP2009175426A (ja) 2008-01-24 2009-08-06 Funai Electric Co Ltd プロジェクタおよびプロジェクタの光軸調整方法
JP5143792B2 (ja) * 2009-07-09 2013-02-13 シャープ株式会社 半導体レーザ装置
JP5505719B2 (ja) * 2010-06-28 2014-05-28 カシオ計算機株式会社 光源装置及びプロジェクタ
WO2012060121A1 (ja) * 2010-11-02 2012-05-10 京セラ株式会社 多数個取り配線基板および配線基板ならびに電子装置
JP5934914B2 (ja) * 2011-05-13 2016-06-15 パナソニックＩｐマネジメント株式会社 レーザアレイ光源ユニット
JP5316911B2 (ja) 2011-06-24 2013-10-16 カシオ計算機株式会社 光源装置及びプロジェクタ
JP5817313B2 (ja) 2011-08-09 2015-11-18 セイコーエプソン株式会社 光源装置及びプロジェクター
JP5846416B2 (ja) 2011-08-31 2016-01-20 カシオ計算機株式会社 光源装置及びプロジェクタ
JP2013089501A (ja) 2011-10-19 2013-05-13 Panasonic Corp 有機エレクトロルミネッセンス素子
US8576885B2 (en) * 2012-02-09 2013-11-05 Princeton Optronics, Inc. Optical pump for high power laser
JP5677396B2 (ja) 2012-10-15 2015-02-25 三菱電機株式会社 通信装置および通信方法
JP5626397B2 (ja) 2013-03-29 2014-11-19 株式会社三洋物産 パチンコ遊技機

Also Published As

Publication number Publication date
EP2797184B1 (en) 2023-07-19
JP2015038958A (ja) 2015-02-26
EP2797184A3 (en) 2015-03-11
US20140313715A1 (en) 2014-10-23
EP4224644A2 (en) 2023-08-09
EP2797184A2 (en) 2014-10-29
CN104112982B (zh) 2021-03-26
EP4224644A3 (en) 2023-09-13
US9726329B2 (en) 2017-08-08
JP6311424B2 (ja) 2018-04-18
CN104112982A (zh) 2014-10-22

Similar Documents

Publication Publication Date Title
IN2014CH02039A (pl)
DE112016004248A5 (de) Optoelektronisches Halbleiterbauteil und 3D-Drucker damit
MX2016002767A (es) Dispositivo fotovoltaico.
BR112017014758A2 (pt) arranjo de eletrodos para monitoramento fisiológico e dispositivo que inclui ou utiliza o mesmo
KR20180084819A (ko) 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기
BR112016019633A2 (pt) Plano monolítico com contatos elétricos e métodos de fabricação do mesmo
EP4095895A3 (en) Through electrode substrate and semiconductor device using through electrode substrate
HK1199324A1 (en) Semiconductor light emitting device and method for manufacturing the same
EP3353813A4 (en) SEMICONDUCTOR COMPONENT CONTACTS WITH INCREASED CONTACT SURFACE
DE112014001516T8 (de) Kontaktbauteil und Halbleitermodul
GB201811613D0 (en) Electrode integration into organs on chip devices
BR112015018811A2 (pt) dispositivos sensores eletroquímicos miniaturizados implantáveis
HK1199323A1 (en) Semiconductor light emitting device and method for manufacturing the same
PL3598532T3 (pl) Moduł akumulatorowy zawierający urządzenie przerywające złącze
HK1199146A1 (en) Semiconductor light emitting device and method for manufacturing the same
PE20141866A1 (es) Sistema de suministro de material de impresion y cartucho
HK1199325A1 (en) Semiconductor light emitting device and method for manufacturing the same
TW201613142A (en) Light-emitting unit and semiconductor light-emitting device
DE112017001125A5 (de) Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem
BR112016001171A2 (pt) módulo semicondutor.
TW201614780A (en) Semiconductor devices having through electrodes, semiconductor packages including the same, methods of manufacturing the same, electronic systems including the same, and memory cards including the same
HK1247442A1 (zh) 帶有印刷成形封裝部件和導電路徑再分布結構的引線載體
TW201614876A (en) Light emitting device and method for manufacturing light emitting device
WO2015135725A3 (de) Elektronisches modul sowie verfahren und vorrichtung zum herstellen eines elektronischen moduls
WO2015044622A9 (fr) Dispositif optoelectronique a diodes electroluminescentes