IN2013CH00566A - - Google Patents
Info
- Publication number
- IN2013CH00566A IN2013CH00566A IN566CH2013A IN2013CH00566A IN 2013CH00566 A IN2013CH00566 A IN 2013CH00566A IN 566CH2013 A IN566CH2013 A IN 566CH2013A IN 2013CH00566 A IN2013CH00566 A IN 2013CH00566A
- Authority
- IN
- India
- Prior art keywords
- robot
- robot control
- control device
- substrate positioning
- positioning device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1682—Dual arm manipulator; Coordination of several manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/50—Machine tool, machine tool null till machine tool work handling
- G05B2219/50036—Find center of circular mark, groove
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012031982A JP5573861B2 (ja) | 2012-02-16 | 2012-02-16 | 搬送システム |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2013CH00566A true IN2013CH00566A (ko) | 2015-04-24 |
Family
ID=48957803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN566CH2013 IN2013CH00566A (ko) | 2012-02-16 | 2013-02-11 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8989901B2 (ko) |
JP (1) | JP5573861B2 (ko) |
KR (1) | KR101446413B1 (ko) |
CN (1) | CN103253512A (ko) |
IN (1) | IN2013CH00566A (ko) |
TW (1) | TW201347937A (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6199199B2 (ja) * | 2014-02-20 | 2017-09-20 | 東京エレクトロン株式会社 | 基板処理装置、位置ずれ補正方法及び記憶媒体 |
JP6384195B2 (ja) * | 2014-08-20 | 2018-09-05 | 株式会社安川電機 | ロボットシステムおよびロボット教示方法 |
US9824908B2 (en) * | 2015-05-05 | 2017-11-21 | Kawasaki Jukogyo Kabushiki Kaisha | Conveying system, conveying robot and teaching method of the same |
JP6587423B2 (ja) * | 2015-05-28 | 2019-10-09 | キヤノン株式会社 | 搬送システム及び露光システム |
WO2017104039A1 (ja) * | 2015-12-17 | 2017-06-22 | 株式会社安川電機 | 教示システム、教示方法およびロボット |
US10099377B2 (en) * | 2016-06-29 | 2018-10-16 | Applied Materials, Inc. | Methods and systems providing misalignment correction in robots |
JP6741538B2 (ja) * | 2016-09-28 | 2020-08-19 | 川崎重工業株式会社 | ロボット、ロボットの制御装置、及び、ロボットの位置教示方法 |
JP7199073B2 (ja) * | 2017-10-20 | 2023-01-05 | 株式会社キーレックス | 垂直多関節ロボットの教示データ作成システム |
CN111868886B (zh) * | 2018-04-09 | 2024-01-05 | 东京毅力科创株式会社 | 激光加工装置、激光加工系统以及激光加工方法 |
US10974388B2 (en) * | 2018-12-27 | 2021-04-13 | Kawasaki Jukogyo Kabushiki Kaisha | Method of correcting position of robot and robot |
US11059178B2 (en) * | 2018-12-27 | 2021-07-13 | Kawasaki Jukogyo Kabushiki Kaisha | Method of correcting position of robot and robot |
CN113276104A (zh) * | 2020-02-19 | 2021-08-20 | 总督科技股份有限公司 | 晶圆转载机构的机械臂校准装置及其校准方法 |
WO2021164664A1 (zh) * | 2020-02-19 | 2021-08-26 | 宋茂炎 | 晶圆载盘的置载/卸载装置及其置载/卸载方法 |
JP2022102888A (ja) * | 2020-12-25 | 2022-07-07 | 川崎重工業株式会社 | 基板搬送ロボットの制御装置及び関節モータの制御方法 |
CN114536339B (zh) * | 2022-03-03 | 2024-05-31 | 深圳市大族机器人有限公司 | 协作机器人的控制方法、装置、协作机器人和存储介质 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10173022A (ja) * | 1996-12-10 | 1998-06-26 | Mecs:Kk | ウェハ搬送装置 |
US6405101B1 (en) * | 1998-11-17 | 2002-06-11 | Novellus Systems, Inc. | Wafer centering system and method |
JP2003142417A (ja) | 2001-11-05 | 2003-05-16 | Anelva Corp | 成膜処理装置に装備されたロボットの制御装置 |
JP3760212B2 (ja) * | 2001-11-30 | 2006-03-29 | 川崎重工業株式会社 | アライメント処理方法およびアライメント処理装置 |
JP4071057B2 (ja) * | 2002-07-10 | 2008-04-02 | 東京エレクトロン株式会社 | 基板位置決め装置及び基板処理装置 |
US6748293B1 (en) * | 2003-03-24 | 2004-06-08 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for high speed object handling |
KR100583727B1 (ko) * | 2004-01-07 | 2006-05-25 | 삼성전자주식회사 | 기판 제조 장치 및 이에 사용되는 기판 이송 모듈 |
CN1876529B (zh) | 2006-07-11 | 2010-12-01 | 友达光电股份有限公司 | 玻璃基板移送装置 |
JP2008173744A (ja) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | 搬送システムの搬送位置合わせ方法 |
KR100855877B1 (ko) | 2007-02-23 | 2008-09-03 | 세메스 주식회사 | 기판 처리 장치 및 그 장치에서의 기판 정렬 방법 |
US8060252B2 (en) * | 2007-11-30 | 2011-11-15 | Novellus Systems, Inc. | High throughput method of in transit wafer position correction in system using multiple robots |
US8258426B2 (en) * | 2008-08-26 | 2012-09-04 | Applied Materials, Inc. | Laser material removal methods and apparatus |
JP2011108958A (ja) * | 2009-11-20 | 2011-06-02 | Hitachi High-Tech Control Systems Corp | 半導体ウェーハ搬送装置及びこれを用いた搬送方法 |
JP5755844B2 (ja) * | 2010-05-31 | 2015-07-29 | 株式会社ダイヘン | ワーク搬送システム |
JP5627518B2 (ja) * | 2011-03-16 | 2014-11-19 | 大日本スクリーン製造株式会社 | 基板処理装置および電源管理方法 |
-
2012
- 2012-02-16 JP JP2012031982A patent/JP5573861B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-15 TW TW102101495A patent/TW201347937A/zh unknown
- 2013-02-11 IN IN566CH2013 patent/IN2013CH00566A/en unknown
- 2013-02-13 US US13/765,754 patent/US8989901B2/en not_active Expired - Fee Related
- 2013-02-15 KR KR1020130016250A patent/KR101446413B1/ko not_active IP Right Cessation
- 2013-02-16 CN CN2013100512096A patent/CN103253512A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP5573861B2 (ja) | 2014-08-20 |
US8989901B2 (en) | 2015-03-24 |
CN103253512A (zh) | 2013-08-21 |
TW201347937A (zh) | 2013-12-01 |
KR20130094754A (ko) | 2013-08-26 |
US20130218337A1 (en) | 2013-08-22 |
JP2013168579A (ja) | 2013-08-29 |
KR101446413B1 (ko) | 2014-10-02 |
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