WO2021164664A1 - 晶圆载盘的置载/卸载装置及其置载/卸载方法 - Google Patents

晶圆载盘的置载/卸载装置及其置载/卸载方法 Download PDF

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Publication number
WO2021164664A1
WO2021164664A1 PCT/CN2021/076313 CN2021076313W WO2021164664A1 WO 2021164664 A1 WO2021164664 A1 WO 2021164664A1 CN 2021076313 W CN2021076313 W CN 2021076313W WO 2021164664 A1 WO2021164664 A1 WO 2021164664A1
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Prior art keywords
wafer
unloading
loading
tray
positioning member
Prior art date
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PCT/CN2021/076313
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English (en)
French (fr)
Inventor
宋茂炎
Original Assignee
宋茂炎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010102312.9A external-priority patent/CN113284832A/zh
Priority claimed from CN202010102278.5A external-priority patent/CN113284831A/zh
Application filed by 宋茂炎 filed Critical 宋茂炎
Priority to US17/929,017 priority Critical patent/US20230104871A1/en
Publication of WO2021164664A1 publication Critical patent/WO2021164664A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Definitions

  • the invention relates to a loading/unloading device for a wafer carrier and a loading/unloading method thereof, in particular to a method that can reduce labor costs, improve processing efficiency, and ensure the direction and accuracy of wafer placement on the wafer tray Degree of placement and removal device and method.
  • the general integrated circuit (IC) manufacturing process can be divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging.
  • silicon ingot When the silicon ingot is cut into wafers, it needs to go through yellow light.
  • the production of integrated circuits can be completed by multiple complicated procedures such as crystal growth, etching, and mechanical polishing.
  • the wafer In the above-mentioned manufacturing process, the wafer is undergoing testing, cleaning, evaporation, drying or soaking in organic solvents, etc.
  • each wafer needs to be fixed on a wafer tray first, and each wafer tray carries the wafers to perform the processing operations of the above-mentioned processes.
  • the basic structure of a well-known wafer tray is a tray with a shape and a carrying area slightly larger than that of a wafer.
  • a separable ring frame is provided above the tray to define a position for accommodating the wafer.
  • a plurality of buckling mechanisms are arranged on the periphery of the body, and the ring frame can be clamped by the buckling mechanisms, and the ring frame is pressed on the periphery of the wafer to form a positioning.
  • each wafer tray Since most of the wafer edges are provided with a calibration mark (such as flat cut notch), and each wafer tray is set at a different position on the carrier tray, each wafer is placed on the wafer tray, and it must be ensured that each The wafer mark is located in the correct direction and angle, and each ring frame has a different setting angle on each wafer tray. Due to the complicated operation of the buckle mechanism and other factors, it is currently aimed at the above-mentioned wafer Operations such as picking and placing, positioning, and position confirmation on each wafer tray are mostly performed manually, forming a bottleneck that is relatively difficult to overcome in the overall wafer processing operation, making it difficult to improve the overall wafer transfer efficiency.
  • a calibration mark such as flat cut notch
  • the main purpose of the present invention is to provide a loading/unloading device for a wafer carrier and a loading/unloading method thereof.
  • An image grabbing assembly and a wafer positioning device are mainly provided on a first robot arm in a loading and unloading area.
  • a wafer pick-and-place mechanism is provided on a second robotic arm.
  • a carrier, a main calibration mechanism, and a wafer calibration mechanism are respectively built within the movable range of the first robotic arm and the second robotic arm.
  • a placement mechanism which uses the first robotic arm to drive the image grabbing assembly to the main correction mechanism to calibrate the accuracy of its image capturing range, and the first robotic arm drives the wafer positioning member loading and unloading mechanism to the main correction mechanism.
  • the calibration mechanism calibrate its working position, and memorize the relative position coordinates between the wafer positioning member loading and unloading mechanism and the image capturing range of the image capture assembly; then move the image capture assembly to the top of the carrier to obtain the carrier Upload the image of one of the wafer trays and adjust it to the correct corresponding position.
  • the first robot arm refers to the relative position coordinates obtained by the above operation and drives the wafer positioning member loading and unloading mechanism to align the wafer tray, and the wafer positioning member loading and unloading mechanism positions the wafer pre-fixed on the periphery of the wafer tray Remove the wafer, and then the second mechanical arm drives the wafer pick-and-place mechanism to the main calibration mechanism to calibrate the working position of the wafer pick-and-place mechanism, and take it out from the wafer pick-and-place mechanism to the placement mechanism
  • the wafer to be processed is placed on the wafer correction mechanism to obtain the code of the wafer to be processed, and the notch of the wafer to be processed is adjusted to the correct angle, and then the wafer pick-and-place mechanism will The processed wafer is moved to the wafer tray; then the first robotic arm drives the image grabbing assembly to the carrier tray, confirms whether the wafer to be processed on the wafer tray is complete, and then drives the wafer positioning member
  • the loading and unloading mechanism combines the wafer positioning
  • the first robotic arm drives the image grabbing assembly to the top of the carrier to obtain an image of one of the wafer trays on the carrier and adjust it to the correct corresponding position.
  • the first robotic arm drives the crystal
  • the circular positioning member loading and unloading mechanism is aligned with the wafer tray, and the wafer positioning member pressing the wafer disk to the periphery of the processed wafer is removed by the wafer positioning member loading and unloading mechanism, and the second mechanical arm drives the wafer
  • the round pick-and-place mechanism moves the processed wafer on the wafer tray to the wafer correction mechanism, and after the wafer correction mechanism obtains the code of the processed wafer, the wafer pick-and-place mechanism
  • the processed wafers are moved to the loading mechanism, so as to complete a correct and rapid transfer of the wafers to be processed to the wafer carrier, as well as the rapid transfer of the processed wafers on the carrier to the placing Automated operations in institutions.
  • the technical means implemented by the present invention include: a loading/unloading device for a wafer carrier, which at least includes: a first robotic arm connected and driven by a control module. At least one image grabbing component is provided on the movable end of a robotic arm; a second robotic arm is connected to and driven by the control module, and a wafer pick-and-place mechanism is provided on the movable end of the second robotic arm; a carrier plate , Arranged in the movable range of the first robot arm and the second robot arm, and connected and driven by the control module, the carrier is provided with at least one wafer tray for holding wafers; a main correction mechanism , Arranged in the movable range of the first robot arm and the second robot arm, and connected and driven by the control module for respectively correcting the operating positions of the image grabbing assembly and the wafer picking and placing mechanism; a wafer The correction mechanism is arranged in the movable range of the second mechanical arm, and is connected and driven by the control module
  • each wafer is fixed on the wafer tray via a lockable wafer positioning member, and the movable end of the first robot arm is also provided with a wafer capable of loading and unloading the wafer positioning member Positioning member loading and unloading mechanism.
  • the image capture assembly has an upper image capture assembly capable of generating illuminating light
  • the main correction mechanism has a lower image capture assembly
  • a transparent sheet is arranged above the lower image capture assembly
  • a transparent sheet is arranged on the transparent sheet
  • a standard scale used as a positioning reference
  • the wafer positioning member loading and unloading mechanism has a positioning surface on which a positioning scale is provided
  • the wafer pick-and-place mechanism has a wafer chuck capable of sucking wafers, and There is an indicating scale on it.
  • the wafer positioning member mounting and dismounting mechanism is provided with a plurality of laser light sources on the outer side of the positioning surface.
  • the main correction mechanism is provided with a distance measuring laser light source beside the lower image capturing assembly.
  • the material placement mechanism is a cassette with a accommodating space inside, the cassette is arranged on a lifting mechanism, the lifting mechanism is connected and driven by the control module to adjust the cassette high.
  • the sliding mechanism has a sliding seat which can move along a plurality of sliding guide rails extending in parallel, and a sliding seat is provided on the sliding seat.
  • a pivot seat for holding the tray.
  • an outer cover is provided above one end of the sliding guide rail, and the outer cover is provided with a notch.
  • the carrier plate is moved below the outer cover, a part of the wafer tray can be exposed to the outside.
  • the wafer calibration mechanism has a supporting seat for placing wafers.
  • a suction head with a vacuum suction hole is arranged under the through part, and the suction head can be driven by a transposition mechanism to lift and pivot.
  • the technical means implemented by the present invention also includes: a loading/unloading method using the aforementioned wafer loading/unloading device, at least including: an image grabbing component to correct the image capturing range, and the image is driven by the first robotic arm
  • the grabbing component is moved to the main calibration mechanism to calibrate the image capturing range of the image grabbing component to the correct position;
  • a wafer positioner loading and unloading mechanism corrects the working position, and the first robot arm drives the positioning of the wafer positioner loading and unloading mechanism
  • the surface is moved to the main calibration mechanism to adjust and calibrate the working position of the wafer positioning member loading and unloading mechanism, and the control module can compare and memorize the working position of the wafer positioning member loading and unloading mechanism and the image capturing range obtained by the image grabbing assembly.
  • the relative position coordinates of an image grabbing component correctly corresponding to the wafer tray the first robot arm drives the image grabbing component to move to the top of the tray, and the position is corrected to accurately correspond to one of the trays
  • a wafer tray is used to view the condition on the wafer tray; a wafer positioning member loading and unloading mechanism removes the wafer positioning member from the wafer tray.
  • the control module refers to the relative position coordinates, and passes the first
  • a mechanical arm drives the wafer positioning member loading and unloading mechanism to align the wafer tray with the positioning surface, and take out the wafer positioning member preset on the periphery of the wafer tray; a wafer pick-and-place mechanism corrects the working position
  • the second mechanical arm drives the wafer pick-and-place mechanism to move to the main correction mechanism to correct the working position of the wafer pick-and-place mechanism; a wafer pick-and-place mechanism places the wafer to be processed in the wafer correction
  • the second mechanical arm drives the wafer pick-and-place mechanism to move to the loading mechanism to take out the wafer to be processed, and place the wafer to be processed in the wafer calibration mechanism; a wafer
  • the calibration mechanism reads the code of the wafer to be processed and turns the notch of the wafer to be processed to the correct angle.
  • the wafer calibration mechanism obtains the code and notch position of the wafer to be processed, and rotates the wafer to be processed. Round to adjust the notch of the wafer to be processed to the correct angle; a wafer pick-and-place mechanism transfers the wafer to be processed to the wafer tray, and the wafer pick-and-place mechanism is driven by the second robotic arm
  • the wafer to be processed is taken out of the wafer calibration mechanism and placed on the wafer tray of the carrier; an image grabbing component obtains the image of the wafer to be processed, and the first robotic arm drives the wafer
  • the image grabbing component is moved to the carrier tray, and the image of the previously placed wafer to be processed is obtained to confirm whether the wafer to be processed is complete; a wafer positioning component loading and unloading mechanism installs the wafer positioning component on the wafer tray , In the step of fixing the wafer to be processed, the wafer positioning member loading and unloading mechanism is driven by the first robot arm to combine the wafer positioning member on the wafer tray, and pressing
  • the control module drives the carrier to move to a preset external position to be processed; an image grabbing assembly correctly corresponds to the steps of the wafer tray, and the carrier that carries the processed wafer is moved by After the outside is moved back under the cover, the first robotic arm drives the image grabbing assembly to move to the top of the carrier, and correct the position to accurately correspond to one of the wafer trays on the carrier, so as to inspect the wafer
  • the circular positioning member loading and unloading mechanism aligns the wafer disk with the positioning surface, and takes out the wafer positioning member that fixes the periphery of the wafer disk on the peripheral side of the processed wafer; a wafer pick-and-place mechanism consists of the wafer disk
  • the second robot arm drives the wafer pick-and-place mechanism to move to the wafer tray of the carrier to Take out the processed wafer, and put the processed wafer into the wafer calibration mechanism to read the code of the processed wafer; a wafer pick-and-place mechanism puts the wafer into the loading mechanism , The processed wafer is moved to the placement mechanism by the wafer pick-and-place mechanism.
  • a lower image capturing component is built in the main calibration mechanism, a transparent sheet is provided above the lower image capturing component, and a standard scale is set on the transparent sheet as a positioning reference; an upper image capturing component is built in the image capturing component
  • the imaging component if there is a position deviation between the standard scale position in the imaging range of the upper imaging component and the standard scale position in the imaging range of the lower imaging component, the control module passes through the first machine
  • the arm drives the image capture assembly to adjust the position so that the standard scale positions in the imaging range of the upper image capture assembly and the lower image capture assembly overlap, that is, the image capture range of the image capture assembly can be corrected to the correct position.
  • a lower image capturing assembly is built in the main calibration mechanism, a transparent sheet is set above the lower image capturing assembly, and a standard scale is set on the transparent sheet as a positioning reference; on the wafer pick-and-place mechanism There is an indication scale; if the position deviation of the standard scale position in the imaging range of the lower imaging assembly and the indicating scale on the wafer pick-and-place mechanism occurs, the control module drives the wafer through the second mechanical arm The position of the pick-and-place mechanism is adjusted so that the indicating scale overlaps the standard scale, that is, the working position of the wafer pick-and-place mechanism can be calibrated to the correct position.
  • a lower image capturing assembly is built in the main calibration mechanism, a transparent sheet is provided above the lower image capturing assembly, and a standard scale is provided on the transparent sheet as a positioning reference;
  • the positioning surface is provided with a positioning scale; if there is a position deviation between the standard scale position in the imaging range of the lower imaging component and the positioning scale on the positioning surface, the control module is driven by the first mechanical arm
  • the wafer positioning member loading and unloading mechanism adjusts the position so that the positioning scale overlaps the standard scale, that is, the working position of the wafer positioning member loading and unloading mechanism can be corrected to the correct position.
  • a lower image capturing component is built in the main correction mechanism, and a distance measuring laser light source is built beside the lower image capturing component.
  • the distance measuring laser light source can generate a laser beam to measure the image capture.
  • the distance between the assembly, the wafer positioning member mounting and dismounting mechanism, and the wafer pick-and-place mechanism and the lower imaging assembly is adjusted by the control module to adjust the lens focal length of the lower imaging assembly.
  • the control module drives the wafer positioner loading and unloading mechanism through the first mechanical arm to adjust the position, so that the laser beams of the same length generated by the laser light sources can be projected on the wafer tray together, so that the wafer positioner loading and unloading mechanism Corresponds to the wafer tray correctly.
  • the wafer calibration mechanism is provided with at least a supporting seat, an image capturing unit and a transposition mechanism, the supporting seat is configured to hold the wafer, and the image capturing unit obtains the code of the wafer And the position of the notch, the transposition mechanism can drive the wafer to rotate to adjust the notch of the wafer to the correct angle.
  • Fig. 1 is a complete three-dimensional structure diagram of the present invention with a partial decomposition of a carrier plate.
  • Fig. 2 is a partial enlarged schematic diagram of the main correction mechanism of the present invention.
  • Fig. 3 is a flow chart of the method of dismounting and removing of the present invention.
  • FIG. 4 is a schematic diagram of the state of the image capturing assembly of the present invention being corrected at the position above the main correction mechanism.
  • FIG. 5 is a schematic diagram of a state in which the wafer positioning member mounting and dismounting mechanism of the present invention is calibrated above the main calibration mechanism.
  • FIG. 6 is a schematic diagram of the state where the image capture assembly of the present invention is correctly corresponding to the wafer tray above the carrier tray.
  • FIG. 7 is a schematic diagram of a state in which the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to grab the wafer positioning member.
  • FIG. 8 is a schematic diagram of a state in which the wafer positioning member attaching and unloading mechanism of the present invention removes the wafer positioning member.
  • Fig. 9 is a partial enlarged schematic view of the part A in Fig. 8.
  • FIG. 10 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention in the correction position above the main correction mechanism.
  • FIG. 11 is a schematic diagram of a state in which the wafer pick-and-place mechanism of the present invention takes out the wafer to be processed from the material placement mechanism.
  • FIG. 12 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention to place the wafer to be processed on the wafer correction mechanism.
  • FIG. 13 is a schematic diagram of a state in which the wafer calibration mechanism of the present invention is calibrating a wafer to be processed.
  • FIG. 14 is a schematic diagram of a state in which the wafer pick-and-place mechanism of the present invention moves the wafer to be processed on the wafer tray.
  • 15 is a schematic diagram of a state in which the image grabbing assembly of the present invention confirms the position of the wafer to be processed on the carrier.
  • 16 is a schematic diagram of a state in which the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to install the wafer positioning member.
  • FIG. 17 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention is moved back to the initial position, and the wafer positioning member is fixed on the wafer tray.
  • Fig. 18 is a schematic diagram of the present invention when the tray is moved out to the outside of the outer cover.
  • FIG. 19 is a schematic diagram of a state in which the carrier plate is moved back to the position below the cover after the wafer processing is completed according to the present invention.
  • FIG. 20 is a schematic diagram of the state where the image grabbing assembly of the present invention is correctly corresponding to the wafer tray on the upper side of the carrier tray.
  • FIG. 21 is a schematic diagram of a state in which the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to grab the wafer positioning member.
  • FIG. 22 is a schematic diagram of a state in which the wafer positioning member attaching and unloading mechanism of the present invention removes the wafer positioning member.
  • FIG. 23 is a partial enlarged schematic diagram of part B in FIG. 22.
  • 24 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention to remove the processed wafer from the wafer tray.
  • FIG. 25 is a schematic diagram of a state in which the wafer calibration mechanism of the present invention reads the code of a processed wafer.
  • FIG. 26 is a schematic diagram of a state in which the wafer pick-and-place mechanism of the present invention places a processed wafer into the material placement mechanism.
  • the upper image capturing component
  • the image capture component calibrates the image capture range
  • the wafer positioning piece loading and unloading mechanism corrects the working position
  • the image capture component correctly corresponds to the wafer tray
  • the wafer positioning member loading and unloading mechanism removes the wafer positioning member from the wafer tray
  • the wafer pick-and-place mechanism places the wafer to be processed on the wafer calibration mechanism
  • the wafer correction mechanism reads the code of the wafer to be processed, and turns the notch of the wafer to be processed to the correct angle;
  • the wafer pick-and-place mechanism transfers the wafer to be processed to the wafer tray
  • the image grabbing component obtains an image of the wafer to be processed
  • the wafer positioning member loading and unloading mechanism installs the wafer positioning member on the wafer tray to fix the wafer to be processed
  • the image grabbing component correctly corresponds to the wafer tray
  • the wafer positioning member loading and unloading mechanism removes the wafer positioning member from the wafer tray
  • the wafer pick-and-place mechanism removes the processed wafer from the wafer tray, and the wafer calibration mechanism reads the code of the processed wafer;
  • the wafer pick-and-place mechanism puts the processed wafer into the material placement mechanism.
  • the main structure of the present invention includes: a first robotic arm 1, a second robotic arm 2, a carrier 3, a main calibration mechanism 4, a wafer calibration mechanism 5, a material placement mechanism 6, etc. Part; wherein the first robotic arm 1 is connected and driven by a control module (which can be a computer with computing functions, not shown), and the movable end of the first robotic arm 1 is provided with an image grabbing assembly 11 and a Wafer positioning member loading and unloading mechanism 12.
  • a control module which can be a computer with computing functions, not shown
  • the image capture assembly 11 has an upper image capture assembly 111 (which can be a CCD camera) that can generate illumination light;
  • the wafer positioning member handling mechanism 12 is provided with a positioning surface 121,
  • the surface 121 (center) is provided with a positioning scale 122 (may be a hole), at least two relatively movable clamping members 123 are provided on the outer peripheral side of the positioning surface 121, and the wafer positioning member handling mechanism 12 is provided on the peripheral side
  • the second robotic arm 2 is connected and driven by the control module.
  • the movable end of the second robotic arm 2 is provided with a wafer pick-and-place mechanism 21 (which can be A wafer chuck);
  • the wafer pick-and-place mechanism 21 (wafer chuck) is provided with an indicator scale 211.
  • the carrier 3 is a spherical disc body arranged in the movable range of the first mechanical arm 1 and the second mechanical arm 2, and is connected and driven by the control module.
  • the carrier 3 is arranged at different positions.
  • the tray 3 is disposed on a sliding mechanism 33, and an outer cover 32 is fixed above the tray 3, and the cover 32 is provided with a notch 321 to enable the tray 3
  • the upper part of the wafer tray 31 is exposed to the outside.
  • the sliding mechanism 33 has a sliding seat 331 disposed on a plurality of sliding guide rails 332 extending in parallel, and a bearing is provided on the sliding seat 331 Set the pivot seat 333 of the tray 3; use the control module to operate the sliding mechanism 33, so that the sliding seat 331 can drive the pivot seat 333 to slide between the two ends of the sliding guide 332, The tray 3 can be driven to pivot via the pivot seat 333.
  • the main correction mechanism 4 is arranged in the range of movement of the first robot arm 1 and the second robot arm 2, and is connected and driven by the control module to calibrate the image grabbing assembly 11 and wafer positioning parts respectively.
  • the mechanism 12 and the wafer pick-and-place mechanism 21 are respectively held at the correct working positions.
  • the main correction mechanism 4 has a lower image capturing component 42 capable of generating illuminating light and at least one ranging laser light source 41 with a ranging function; the lower image capturing component 42 can be a CCD camera A transparent sheet 43 is provided above the lower image capturing assembly 42, and a standard scale 431 is provided in the center of the transparent sheet 43.
  • the wafer correction mechanism 5 is arranged in the movable range of the second mechanical arm 2 and is connected to and driven by the control module; in this embodiment, the wafer correction mechanism 5 has a mechanism for holding the to-be-processed
  • the holding seat 51 of the wafer 60 or the processed wafer 6a has a through hole in the center of the holding seat 51, and an image capturing unit 52 is provided above the holding seat 51, and an image capturing unit 52 is provided below the through hole.
  • a suction head 53 with a vacuum suction hole is used to suck the wafer 60 to be processed or the processed wafer 6a, and the suction head 53 can be driven by a transposition mechanism 54 to perform movements such as lifting and pivoting.
  • the material placing mechanism 6 (which may be a cassette) is arranged in the movable range of the second mechanical arm 2 and has a space for accommodating a plurality of sheet-shaped wafers to be processed 60 or processed wafers 6a.
  • an elevating mechanism 61 can be provided below the material placing mechanism 6 as needed, and the elevating mechanism 61 can drive the material placing mechanism 6 (the magazine) to raise or lower the position.
  • the mounting and dismounting method of the present invention includes: image capture assembly correction image capturing range S11, wafer positioning member loading and unloading mechanism correction operation position S12, image capture assembly correctly corresponding to wafer tray S13, wafer Positioner loading and unloading mechanism Remove the wafer positioner S14 from the wafer tray, the wafer pick-and-place mechanism to correct the working position S15, the wafer pick-and-place mechanism to place the wafer to be processed on the wafer correction mechanism S16, the wafer correction mechanism Read the code of the wafer to be processed, and turn the notch of the wafer to be processed to the correct angle S17, the wafer pick-and-place mechanism transfers the wafer to be processed to the wafer tray S18, the image grabbing component obtains the wafer to be processed Image S19, wafer positioning member loading and unloading mechanism installs the wafer positioning member on the wafer tray to fix the wafer to be processed S20, the carrier is moved out S21, the carrier is moved back to the
  • the first mechanical arm 1 drives the image capture assembly 11 to move to the main correction mechanism 4 (as shown in FIG. 4) to adjust and calibrate the image capture assembly 11Get the image range to the correct position.
  • the lower image capture assembly 42 directly obtains the position of the standard scale 431 on the transparent sheet 43
  • the The main correction mechanism 4 uses the laser beam 411 generated by the ranging laser light source 41 to project onto the image capture assembly 11, and can measure the distance between the main correction mechanism 4 and the image capture assembly 11, thereby adjusting the lower image capture assembly 42
  • the focal length of the lens; and the image grabbing component 11 obtains the position of the standard scale 431 on the transparent sheet 43 through the upper imaging component 111, and the control module compares the position of the standard scale 431 with the lower imaging component 42
  • the image grabbing component 11 obtains the difference between the positions of the standard scale 431, and the position of the image grabbing component 11 is adjusted by the first mechanical arm 1 so that the image of the standard scale 431 obtained by the upper imaging component 111 is the same as the lower imaging
  • the position of the standard scale 431 obtained by the component 42 is overlapped, and the control module memorizes the coordinates of the
  • the first robot arm 1 drives the wafer positioning member loading and unloading mechanism 12 to move its positioning surface 121 to the main calibration mechanism 4 (as shown in FIG. 5) )
  • the control module can compare and memorize the relative position coordinates between the working position of the wafer positioning member handling mechanism 12 and the image range obtained by the image grabbing assembly 11 .
  • the main calibration mechanism 4 uses the laser light generated by the ranging laser light source 41 to project to On the positioning surface 121, the distance between the main correction mechanism 4 and the wafer positioning member mounting and dismounting mechanism 12 can be measured, so as to adjust the lens focal length of the lower image capturing assembly 42; and the lower image capturing assembly 42 can observe the transparent sheet 43 on the standard scale 431, and observing the position difference between the standard scale 431 and the positioning scale 122 (or hole) on the positioning surface 121 through the transparent sheet 43, the control module passes the first mechanical arm 1 Drive the wafer positioner handling mechanism 12 to adjust the position so that the positioning scale 122 (or hole) on the positioning surface 121 overlaps the standard scale 431, so that the working position of the wafer positioner handling mechanism 12 can be changed Correct to the correct position.
  • the image grabbing assembly correctly corresponds to the step of the wafer tray S13, and the first robot arm 1 drives the image grabbing assembly 11 to move to the top of the notch 321 of the cover 32 (as shown in FIG. 6), and the corresponding can be obtained
  • the image of the wafer tray 31 at the notch 321 is used to check the condition of the wafer tray 31 (whether there are remaining chips or fragments of the wafer 60).
  • the control module refers to the relative position coordinates, and the wafer positioning member loading and unloading mechanism 12 is driven by the first robot arm 1 to approach Corresponding to the wafer disk 31 at the notch 321, the wafer positioning member loading and unloading mechanism 12 is driven to adjust the position, so that multiple (at least three) laser light sources 124 generate laser beams of the same length and can be projected on On the wafer tray 31, the positioning surface 121 is aligned (parallel to) the wafer tray 31 (as shown in FIG.
  • the clamping member 123 is used to take out the wafer positioning member 311 and maintain the clamping state (as shown in FIGS. 8 and 9).
  • the second mechanical arm 2 drives the wafer pick-and-place mechanism 21 to move to the main correction mechanism 4 (as shown in FIG. 10, for easy inspection of the main correction mechanism) 4.
  • the wafer calibration mechanism 5) is not drawn to calibrate the working position of the wafer pick-and-place mechanism 21.
  • the main correction mechanism 4 uses the laser light generated by the ranging laser light source 41 to project to the
  • the wafer pick-and-place mechanism 21 is used to measure the distance of the wafer pick-and-place mechanism 21 to adjust the lens focal length of the lower imaging assembly 42; and the lower imaging assembly 42 can observe the standard scale 431 on the transparent sheet 43 At the same time, observe the position of the indicating scale 211 on the wafer pick-and-place mechanism 21 through the transparent sheet 43, and compare the position difference between the indicating scale 211 and the standard scale 431.
  • the control module passes The second robot arm 2 drives the wafer pick-and-place mechanism 21 to adjust the position, so that the indicator scale 211 on the wafer pick-and-place mechanism 21 overlaps the standard scale 431, so that the wafer pick-and-place mechanism 21 can be operated Correct the position to the correct position.
  • the wafer pick-and-place mechanism places the wafer to be processed on the wafer calibration mechanism in step S16, the second robot arm 2 drives the wafer pick-and-place mechanism 21 to move to the loading mechanism 6 to take out the wafer to be processed 60 (as shown in FIG. 11), and place the wafer 60 to be processed on the supporting seat 51 of the wafer calibration mechanism 5 (as shown in FIG. 12).
  • the wafer correction mechanism reads the code of the wafer to be processed and turns the notch of the wafer to be processed to the correct angle S17.
  • the imaging unit 52 of the wafer correction mechanism 5 first obtains the wafer 60 to be processed.
  • the code and notch position (as shown in FIG.
  • the control module calculates the angle to be adjusted for the wafer 60 to be processed according to the notch position of the wafer tray 31 to be placed, and the transposition mechanism 54 Drive the suction head 53 to suck the wafer 60 to be processed up (away from the holder 51), and rotate the wafer 60 to be processed to adjust the notch of the wafer 60 to be processed to the correct angle;
  • the placement mechanism 54 drives the suction head 53 to suck the wafer 60 to be processed down, so as to place the wafer 60 to be processed back on the supporting seat 51.
  • the wafer pick-and-place mechanism transfers the wafer to be processed to the wafer tray in step S18, and the second robot arm 2 drives the wafer pick-and-place mechanism 21 to transfer the wafer 60 with the correct notch angle from the wafer to be processed.
  • the wafer calibration mechanism 5 is removed from the supporting seat 51, and placed on the wafer tray 31 of the carrier tray 3 through the notch 321 of the cover 32 (as shown in FIG. 14).
  • the first robot arm 1 drives the image grabbing assembly 11 to move to the top of the notch 321 of the cover 32 (as shown in FIG. 15), and obtain the front An image of the wafer 60 to be processed placed in one step to confirm whether the wafer 60 to be processed is complete and placed in the correct position.
  • the wafer positioning member loading and unloading mechanism installs the wafer positioning member on the wafer tray to fix the wafer to be processed S20, and the first robot arm 1 drives the wafer positioning member loading and unloading mechanism 12 to clamp the wafer.
  • the wafer positioning member 311 clamped by the member 123 is combined with a lock on the wafer tray 31 (as shown in FIG. 16), and the wafer positioning member 311 is pressed against the periphery of the wafer 60 to be processed to form a positioning (As shown in Figure 17).
  • the pivot seat 333 drives the tray 3 to rotate, so that the wafer tray 31 that has carried the wafer 60 to be processed is turned under the cover 32, and the other is vacant (the wafer 60 to be processed is not placed)
  • the wafer tray 31 is moved to the bottom of the recess 321 of the cover 32 to be exposed, so that the steps S13, S14, S16, S17, S18, S19, and S20 are repeated in order to fix the different wafers 60 to be processed respectively.
  • the steps S13, S14, S16, S17, S18, S19, and S20 are repeated in order to fix the different wafers 60 to be processed respectively.
  • the carrier plate is moved outward in the step S21, after each wafer plate 31 of the carrier plate 3 has carried the wafer 60 to be processed, the sliding seat 331 of the sliding mechanism 33 slides outward along the sliding guide 332 To the preset position outside the outer cover 32 (as shown in FIG. 18), so that the tray 3 can be moved to the next processing process.
  • the tray 3 can be placed On the pivot seat 333 (sliding seat 331) of the sliding mechanism 33, the pivot seat 333 (sliding seat 331) is then slid along the sliding guide 332 to below the outer cover 32, and one of the crystals The processed wafer 6a on the disk 31 is exposed under the recess 321 (as shown in FIG. 19).
  • the image grabbing assembly correctly corresponds to the step of wafer tray S23.
  • the first robot arm 1 drives the image grabbing assembly 11 to move above the notch 321 of the cover 32 (as shown in FIG. 20), and the corresponding can be obtained
  • the image on the wafer tray 31 at the notch 321 is used to check the condition of the processed wafer 6a on the wafer tray 31 (whether there is damage or abnormality).
  • the control module refers to the relative position coordinates, and the wafer positioning member loading and unloading mechanism 12 is driven by the first robot arm 1 to approach Corresponding to the wafer disk 31 at the notch 321, the wafer positioning member loading and unloading mechanism 12 is driven to adjust the position, so that multiple (at least three) laser light sources 124 generate laser beams of the same length and can be projected on On the wafer tray 31, the positioning surface 121 is aligned (parallel to) the wafer tray 31 (as shown in FIG.
  • the wafer positioning member 311 is taken out by the clamping member 123 and maintained in a clamping state (as shown in FIGS. 22 and 23).
  • the wafer pick-and-place mechanism removes the processed wafer from the wafer tray, and the wafer calibration mechanism reads the code S25 of the processed wafer, and the second robot arm 2 drives the wafer pick-and-place mechanism 21 is moved to the wafer tray 31 of the carrier 3 (exposed under the notch 321) to suck the processed wafer 6a (as shown in FIG. 24); and the processed wafer 6a is moved to the On the supporting seat 51 of the wafer calibration mechanism 5, the image capturing unit 52 reads the code of the processed wafer 6a (as shown in FIG. 25), and the control module records the processed wafer 6a coding.
  • the wafer pick-and-place mechanism puts the processed wafer into the loading mechanism in the step S18, and the second robot arm 2 drives the wafer pick-and-place mechanism 21 to pick up the processed wafer 6a from the holder 51
  • the processed wafer 6a can be put into the space of the feeding mechanism 6 (as shown in FIG. 26).
  • the pivot seat 333 drives the tray 3 to rotate, so that the wafer tray 31 from which the wafer 6a has been taken out is turned under the cover 32, and the other wafer tray 31 carrying the processed wafer 6a is moved.
  • the bottom of the recess 321 of the outer cover 32 is exposed, so that the above steps S14, S15, S17, S18, etc. can be repeated in order to move the processed wafers 6a on different wafer trays 31 to the placement mechanism.
  • the sliding seat 331 pivoting seat 333 of the sliding mechanism 33 carries the carrier 3 along the The sliding guide 332 slides outward so as to take out the empty carrier 3 and place another carrier 3 with the processed wafer 6 a on the pivot seat 333.
  • the wafer loading/unloading device and the loading/unloading method of the present invention can indeed reduce labor costs, improve the transfer efficiency, and ensure the directionality and direction of wafer placement on the wafer tray.
  • the effect of accuracy is actually a novel and progressive invention.

Abstract

一种晶圆载盘的置载/卸载装置及其置载/卸载方法，于第一机械臂(1)和第二机械臂(2)活动范围内分别建置载盘(3)、主校正机构(4)、晶圆校正机构(5)及置料机构(6)，第一机械臂(1)可驱动影像攫取组件(11)及晶圆定位件装卸机构(12)活动，第二机械臂(2)可驱动晶圆取放机构(21)活动，载盘(3)上设有多个晶圆盘(31)，主校正机构(4)分别校正影像攫取组件(11)、晶圆定位件装卸机构(12)及晶圆取放机构(21)于正确操作位置。

Description

晶圆载盘的置载/卸载装置及其置载/卸载方法 技术领域
本发明是有关晶圆载盘的置载/卸载装置及其置载/卸载方法，尤指一种可降低人力成本、提升加工效率，并可确保晶圆置于晶圆盘上的方向及精准度的置卸除装置及方法。
背景技术
一般的集成电路(integrated circuit,IC)的制造过程主要可分为：硅晶圆制造、集成电路制作以及集成电路封装等三大部分；当硅晶棒切割成晶圆后，还需要经过黄光、长晶、蚀刻、机械研磨等多道手续繁杂的流程，方能完成集成电路的制作，而在上述的制造过程中，晶圆在进行测试、清洗、蒸镀、干燥或浸泡有机溶剂等流程时，为能有效固定晶圆以便于加工，皆需将各晶圆先分别固定于一晶圆盘上，由各该晶圆盘分别承载各晶圆进行上述各流程的加工作业。
公知的晶圆盘基本结构，为一形状和承载面积略大于晶圆的盘体，于该盘体上方设有一可分离的环形框体，定义出一容置晶圆的位置，且于该盘体的周缘设有多个扣合机构，利用该等扣合机构可夹固该环形框体，由该环形框体压制于该晶圆的周缘形成定位。
在实际应用时，为能同时处理较大量的晶圆，大多会将多个晶圆盘设置于一大面积的球面载盘上，利用该载盘可一并容置多个晶圆在一载盘上，并同时移置到各加工区进行不同的加工程序，以有效增加整体的晶圆加工处理效率。
由于大部份晶圆边缘设有一校准用的标记(如：平削缺口)，且各晶圆盘分别设置于该载盘上不同位置，因此各晶圆置于晶圆盘上，必须确保各晶圆的标记位于正确方向及角度，且各环形框体于各晶圆盘上亦分别具有不同的设置角度，加以该扣合机构的操作较为繁复等诸多因素限制，因此目前针对上述晶圆于各晶圆盘上的取放、定位及位置确认等作业，大多是以人工来进行，形成整体晶圆加工作业上较不易克服的瓶颈，致使整体的晶圆移置效率难以提升。
而随着自动化机械加工的逐渐普及，若能利用机械臂来执行将各晶圆准确地置放于该载盘中各晶圆盘上并加以固定的动作，将可节省大量人力，并可降低生产成本、增进加工效率；但由于一般晶圆本身极为脆弱，移置过程极易破损，且对于加工精密度的要求极高，因此，如何能在利用机械臂放置各晶圆的作业需求下，克服晶圆材料易碎特性，并精准校正其移置方向，乃为各相关业者所亟待努力的课题。
有鉴于公知将晶圆于晶圆盘上的取放装置及方法有上述缺点，发明人乃针对该些缺点研究改进之道，终于有本发明产生。
发明内容
本发明的主要目的在于提供一种晶圆载盘的置载/卸载装置及其置载/卸载方法，主要于一装卸区域内的一第一机械臂上设有一影像攫取组件及一晶圆定位件装卸机构，于一第二机械臂上设有一晶圆取放机构，于该第一机械臂和第二机械臂活动范围内分别建置一载盘、一主校正机构、一晶圆校正机构及一置料机构，利用该第一机械臂驱动该影像攫取组件至该主校正机构上，校正其取像范围的准确度，另由第一机械臂驱动该晶圆定位件装卸机构至该主校正机构上，校正其作业位置，并记忆该晶圆定位件装卸机构与该影像攫取组件取像范围之间的相对位置坐标；而后将该影像攫取组件移至该载盘上方，取得该载盘上其中一晶圆盘的影像，并调整至正确对应位置。
该第一机械臂参考上述作业取得的相对位置坐标，驱动该晶圆定位件装卸机构对准该晶圆盘，由该晶圆定位件装卸机构将该晶圆盘的周缘预先固定的晶圆定位件取下，再由该第二机械臂驱动该晶圆取放机构至该主校正机构上，校正该晶圆取放机构的作业位置，由该晶圆取放机构至该置料机构中取出待加工晶圆，放置于该晶圆校正机构上，以取得该待加工晶圆的编码，并将该待加工晶圆的缺口调整至正确的角度，再由该晶圆取放机构将该待加工晶圆移置于该晶圆盘上；而后该第一机械臂驱动该影像攫取组件至该载盘上，确认该晶圆盘上的待加工晶圆是否完整，再驱动该晶圆定位件装卸机构将该晶圆定位件结合于该晶圆盘上，用以压合于该待加工晶圆的周缘形成定位；然后，依上述步骤将设定数量的晶圆分别压合固定于该载盘上的所有晶圆盘中，再将该载盘向外移出，或移至下一工序加工位置，待各晶圆盘上的待加工晶圆完成加工后，再将该载盘移回原位进行卸除作业。
卸除时，该第一机械臂驱动该影像攫取组件至该载盘的上方，取得该载盘上其中一晶圆盘的影像，并调整至正确对应的位置，该第一机械臂驱动该晶圆定位件装卸机构对准该晶圆盘，由该晶圆定位件装卸机构将该晶圆盘压合于已加工晶圆的周缘的晶圆定位件取下，该第二机械臂驱动该晶圆取放机构将该晶圆盘上的已加工晶圆移至该晶圆校正机构上，由该晶圆校正机构取得该已加工晶圆的编码之后，再由该晶圆取放机构将该已加工晶圆移至置料机构中，借以完成一将待加工晶圆正确且快速地移置至晶圆载盘上，以及将载盘上各加工完成的晶圆快速地移置至置料机构中的自动化作业。
为达成上述目的及功效，本发明所实行的技术手段包括：一种晶圆载盘的置载/卸载装置，至少包括：一第一机械臂，连结并受一控制模组驱动，于该第一机械臂的活动端上至少设有一影像攫取组件；一第二机械臂，连结并受该控制模组驱动，于该第二机械臂的活动端上设有一晶圆取放机构；一载盘，设置于该第一机械臂和该第二机械臂的活动范围内，且连结并受该控制模组驱动，该载盘上设有至少一承置晶圆的晶圆盘；一主校正机构，设置于该第一机械臂和该第二机械臂的活动范围内，且连结并受该控制模组驱动，以供分别校正该影像攫取组件及晶圆取放机构的作业位置；一晶圆校正机构，设置于该第二机械臂的活动范围内，且连结并受该控制模组驱动，以供读取置入的晶圆的编码及调整该晶圆的缺口；一置料机构，设置于该第二机械臂的活动范围内，其内部设有收容晶圆的空间。
依上述结构，其中各晶圆分别经由一可锁掣的晶圆定位件固定于该晶圆盘上，且该第一机械臂的活动端上还设有一可装卸该晶圆定位件的晶圆定位件装卸机构。
依上述结构，其中该影像攫取组件具有一可产生照明光线的上取像组件，该主校正机构具有一下取像组件，于该下取像组件的上方设有一透明片，于该透明片上设有一作为定位基准的标准刻度；该晶圆定位件装卸机构具有一定位面，于该定位面上设有一定位刻度；该晶圆取放机构具有可吸取晶圆的晶圆吸盘，于该晶圆吸盘上设有一指示刻度。
依上述结构，其中该晶圆定位件装卸机构于该定位面的外旁侧设有多个激光光源。
依上述结构，其中该主校正机构于该下取像组件的旁侧设有一测距激光光源。
依上述结构，其中该置料机构为一内部具有收容空间的置料匣，该置料匣设置于一升降机构上，该升降机构连结并受该控制模组驱动，以调整该置料匣的高度。
依上述结构，其中该载盘设置于一滑移机构上，该滑移机构具有一滑移座，该滑移座可沿多个平行延伸的滑移导轨移动，于该滑移座上设有一承置该载盘的枢转座。
依上述结构，其中该滑移导轨的一端的上方设有一外罩，该外罩上设有一凹缺口，当该载盘移至该外罩的下方时，可使局部晶圆盘对外裸露。
依上述结构，其中该晶圆校正机构具有一可供放置晶圆的承置座，该承置座的中央为贯通，于该承置座的上方设有一取像单元，于该承置座的贯通部位的下方设有一具有真空吸孔的吸头，该吸头可受一转置机构驱动而升降及枢转。
本发明所实行的技术手段还包括：一种应用前述晶圆的置载/卸载装置的置载/卸载方法，至少包括：一影像攫取组件校正取像范围的步骤，由第一机械臂驱动影像攫取组件移至主校正机构上，以校正该影像攫取组件取像范围至正确位置；一晶圆定位件装卸 机构校正作业位置的步骤，由该第一机械臂驱动晶圆定位件装卸机构的定位面移至该主校正机构上，以调整校正该晶圆定位件装卸机构的作业位置，且该控制模组可比对记忆该晶圆定位件装卸机构作业位置与该影像攫取组件取得影像范围之间的相对位置坐标；一影像攫取组件正确对应于晶圆盘的步骤，由该第一机械臂驱动该影像攫取组件移至该载盘的上方，并修正位置以准确对应于该载盘上其中之一晶圆盘，借以检视该晶圆盘上的状况；一晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤，由该控制模组参考该相对位置坐标，经该第一机械臂驱动该晶圆定位件装卸机构以该定位面对准该晶圆盘，并将该晶圆盘的周缘预先设置的晶圆定位件取出；一晶圆取放机构校正作业位置的步骤，由该第二机械臂驱动该晶圆取放机构移至该主校正机构上，以校正该晶圆取放机构的作业位置；一晶圆取放机构将待加工晶圆放置于晶圆校正机构上的步骤，由该第二机械臂驱动该晶圆取放机构移至该置料机构中取出待加工晶圆，并将该待加工晶圆放置于该晶圆校正机构中；一晶圆校正机构读取待加工晶圆的编码，并将待加工晶圆的缺口转至正确角度的步骤，由该晶圆校正机构取得该待加工晶圆的编码及缺口位置，并转动该待加工晶圆，以将该待加工晶圆的缺口调整至正确的角度；一晶圆取放机构将待加工晶圆移送至晶圆盘上的步骤，由该第二机械臂驱动该晶圆取放机构将该待加工晶圆由该晶圆校正机构中取出，并放置于该载盘的该晶圆盘上；一影像攫取组件取得待加工晶圆的影像的步骤，由该第一机械臂驱动该影像攫取组件移至该载盘上，并取得先前放置的待加工晶圆的影像，以确认该待加工晶圆是否完整；一晶圆定位件装卸机构将晶圆定位件装设于晶圆盘上，以固定待加工晶圆的步骤，由该第一机械臂驱动该晶圆定位件装卸机构将该晶圆定位件结合于该晶圆盘上，通过该晶圆定位件压合于该待加工晶圆的周缘形成定位，然后该控制模组驱动该载盘移至一预设外部待加工位置；一影像攫取组件正确对应于晶圆盘的步骤，于承载已加工晶圆的载盘由外侧移回该外罩下之后，由该第一机械臂驱动该影像攫取组件移至该载盘的上方，并修正位置以准确对应于该载盘上其中之一晶圆盘，借以检视该晶圆盘上已加工晶圆的状况；一晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤，由该控制模组参考该相对位置坐标，经该第一机械臂驱动该晶圆定位件装卸机构以该定位面对准该晶圆盘，并将该晶圆盘的周缘固定于已加工晶圆的周侧的晶圆定位件取出；一晶圆取放机构由晶圆盘上取下已加工晶圆，并由晶圆校正机构读取已加工晶圆的编码的步骤，由该第二机械臂驱动该晶圆取放机构移至该载盘的晶圆盘上，以取出已加工晶圆，并将该已加工晶圆放入该晶圆校正机构中，以读取该已加工晶圆的编码；一晶圆取放机构将晶圆放入置料机构中的步骤，由该晶圆取放机构将 该已加工晶圆移至置料机构中。
依上述方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，透明片上设一标准刻度作为定位基准；于该影像攫取组件中建置一上取像组件，若该上取像组件的取像范围中的标准刻度位置与该下取像组件的取像范围中的标准刻度位置之间产生位置偏差，则该控制模组经由该第一机械臂驱动该影像攫取组件调整位置，使该上取像组件和该下取像组件的取像范围中的标准刻度位置重叠，即能将该影像攫取组件的取像范围被校正至正确位置。
依上述方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，于该透明片上设一标准刻度作为定位基准；于该晶圆取放机构上设有一指示刻度；若该下取像组件的取像范围中的标准刻度位置与该晶圆取放机构上的指示刻度产生位置偏差，则该控制模组经由该第二机械臂驱动该晶圆取放机构调整位置，使该指示刻度与该标准刻度重叠，即能将该晶圆取放机构的作业位置被校正至正确位置。
依上述方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，该透明片上设有一标准刻度作为定位基准；于该晶圆定位件装卸机构的该定位面上设有一定位刻度；若该下取像组件的取像范围中的标准刻度位置与该定位面上的定位刻度之间产生位置偏差，则该控制模组经由该第一机械臂驱动该晶圆定位件装卸机构调整位置，使该定位刻度与该标准刻度重叠，即能将该晶圆定位件装卸机构的作业位置被校正至正确位置。
依上述方法，其中该主校正机构中建置一下取像组件，于该下取像组件的旁侧建置一测距激光光源，该测距激光光源能产生激光光束，以量测该影像攫取组件、该晶圆定位件装卸机构、该晶圆取放机构分别与该下取像组件之间的距离，以经由该控制模组调整该下取像组件的镜头焦距。
依上述方法，其中该晶圆定位件装卸机构的周侧建置有至少三激光光源，在该晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤中，利用该控制模组经由该第一机械臂驱动该晶圆定位件装卸机构调整位置，使各激光光源所产生相同长度的激光光束，可共同投射于该晶圆盘上，借以使以该晶圆定位件装卸机构正确对应于该晶圆盘。
依上述方法，其中该晶圆校正机构中至少建置一承置座、一取像单元及一转置机构，该承置座供承置该晶圆，该取像单元取得该晶圆的编码及缺口位置，该转置机构能带动该晶圆转动，以调整该晶圆的缺口至正确的角度。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1是本发明将载盘局部分解的完整立体结构图。
图2是本发明的主校正机构的局部放大示意图。
图3是本发明的置卸除方法流程图。
图4是本发明的影像攫取组件于主校正机构上方校正位置的状态示意图。
图5是本发明的晶圆定位件装卸机构于主校正机构上方校正位置的状态示意图。
图6是本发明的影像攫取组件于载盘上方正确对应于晶圆盘的状态示意图。
图7是本发明的晶圆定位件装卸机构移至晶圆盘上抓取晶圆定位件的状态示意图。
图8是本发明的晶圆定位件装卸机构取下晶圆定位件的状态示意图。
图9是图8的A部位的局部放大示意图。
图10是本发明的晶圆取放机构于主校正机构的上方校正位置的状态示意图。
图11是本发明的晶圆取放机构由置料机构中取出待加工晶圆的状态示意图。
图12是本发明的晶圆取放机构将待加工晶圆置于晶圆校正机构上的动作示意图。
图13是本发明的晶圆校正机构校正待加工晶圆的状态示意图。
图14是本发明的晶圆取放机构将待加工晶圆移置于晶圆盘上的状态示意图。
图15是本发明的影像攫取组件确认载盘上待加工晶圆位置的状态示意图。
图16是本发明的晶圆定位件装卸机构移至晶圆盘上装设晶圆定位件的状态示意图。
图17是本发明的晶圆定位件装卸机构移回初始位置，且晶圆定位件固定于晶圆盘上的状态示意图。
图18是本发明于载盘向外移出至外罩的外部的状态示意图。
图19是本发明于晶圆加工完成后，载盘移回外罩的下方位置的状态示意图。
图20是本发明的影像攫取组件于载盘的上方正确对应于晶圆盘的状态示意图。
图21是本发明的晶圆定位件装卸机构移至晶圆盘上抓取晶圆定位件的状态示意图。
图22是本发明的晶圆定位件装卸机构取下晶圆定位件的状态示意图。
图23是图22的B部位的局部放大示意图。
图24是本发明的晶圆取放机构将已加工晶圆由晶圆盘上取下的动作示意图。
图25是本发明的晶圆校正机构读取已加工晶圆编码的状态示意图。
图26是本发明的晶圆取放机构将已加工晶圆置入置料机构的状态示意图。
附图标号说明：
1、第一机械臂；
11、影像攫取组件；
111、上取像组件；
12、晶圆定位件装卸机构；
121、定位面；
122、定位刻度；
123、夹持件；
124、激光光源；
2、第二机械臂；
21、晶圆取放机构；
211、指示刻度；
3、载盘；
31、晶圆盘；
311、晶圆定位件；
32、外罩；
321、凹缺口；
33、滑移机构；
331、滑移座；
332、滑移导轨；
333、枢转座；
4、主校正机构；
41、测距激光光源；
411、激光光束；
42、下取像组件；
43、透明片；
431、标准刻度；
5、晶圆校正机构；
51、承置座；
52、取像单元；
53、吸头；
54、转置机构；
6、置料机构；
60、待加工晶圆；
6a、已加工晶圆；
61、升降机构；
S11、影像攫取组件校正取像范围；
S12、晶圆定位件装卸机构校正作业位置；
S13、影像攫取组件正确对应于晶圆盘；
S14、晶圆定位件装卸机构由晶圆盘上取下晶圆定位件；
S15、晶圆取放机构校正作业位置；
S16、晶圆取放机构将待加工晶圆放置于晶圆校正机构上；
S17、晶圆校正机构读取待加工晶圆的编码，并将待加工晶圆的缺口转至正确角度；
S18、晶圆取放机构将待加工晶圆移送至晶圆盘上；
S19、影像攫取组件取得待加工晶圆的影像；
S20、晶圆定位件装卸机构将晶圆定位件装设于晶圆盘上，以固定待加工晶圆；
S21、载盘向外移出；
S22、载盘移回原位；
S23、影像攫取组件正确对应于晶圆盘；
S24、晶圆定位件装卸机构由晶圆盘上取下晶圆定位件；
S25、晶圆取放机构由晶圆盘上取下已加工晶圆，并由晶圆校正机构读取已加工晶圆的编码；
S26、晶圆取放机构将已加工晶圆放入置料机构中。
具体实施方式
为了对本发明的技术方案、目的和效果有更清楚的理解，现结合附图说明本发明的具体实施方式。
请参图1和图2所示，可知本发明的主要结构包括：第一机械臂1、第二机械臂2、载盘3、主校正机构4、晶圆校正机构5及置料机构6等部分；其中该第一机械臂1连结并受一控制模组(可为一具有运算功能的计算机，未绘出)驱动，该第一机械臂1的活动端上设有一影像攫取组件11及一晶圆定位件装卸机构12。
在一个可行的实施例中，该影像攫取组件11具有一可产生照明光线的上取像组件111(可为一CCD摄影机)；该晶圆定位件装卸机构12上设有一定位面121，该定位面121(中央)设有一定位刻度122(可为一孔洞)，于该定位面121的外周侧至少设有两可相对活动的夹持件123，该晶圆定位件装卸机构12的周侧设有多个均匀分布的激光光源124，多个该激光光源124分别设置于该定位面121的外旁侧至少三点。
该第二机械臂2连结并受该控制模组驱动，该第二机械臂2的活动端上设有一可吸附待加工晶圆60或已加工晶圆6a的晶圆取放机构21(可为一晶圆吸盘)；在一个可行的实施例中，该晶圆取放机构21(晶圆吸盘)上设有一指示刻度211。
该载盘3为一设置于该第一机械臂1和该第二机械臂2的活动范围内的球面形盘体，且连结并受该控制模组驱动，于该载盘3上不同位置设有多个晶圆盘31，于各晶圆盘31上分别设有可锁掣的晶圆定位件311(可为一压环)。
在一个可行的实施例中，该载盘3设置于一滑移机构33上，于该载盘3的上方固定设有一外罩32，该外罩32上设有一凹缺口321，可使该载盘3上的局部晶圆盘31对外裸露，该滑移机构33具有一滑移座331，该滑移座331设置于多个平行延伸的滑移导轨332上，于该滑移座331上设有一承置该载盘3的枢转座333；利用该控制模组操作该滑移机构33，可使该滑移座331带动该枢转座333于该滑移导轨332的两端之间滑移，并可经由该枢转座333驱动该载盘3枢转。
该主校正机构4设置于该第一机械臂1和该第二机械臂2的活动范围内，且连结并受该控制模组驱动，以供分别校正该影像攫取组件11、晶圆定位件装卸机构12及晶圆取放机构21，使其分别保持于正确的作业位置。
在一个可行的实施例中，该主校正机构4具有一可产生照明光线的下取像组件42以及至少一具有测距功能的测距激光光源41；该下取像组件42可为一CCD摄影机，于该下取像组件42上方设有一透明片43，于该透明片43中央设有一标准刻度431。
该晶圆校正机构5设置于该第二机械臂2的活动范围内，且连结并受该控制模组驱动；在本实施例中，该晶圆校正机构5具有一可供承置该待加工晶圆60或已加工晶圆6a的承置座51，该承置座51的中央设有一贯通孔，于该承置座51的上方设有一取像单元52，于该贯通孔的下方设有一具有真空吸孔的吸头53，以供吸附该待加工晶圆60或已加工晶圆6a，该吸头53可受一转置机构54驱动而执行升降及枢转等动作。
该置料机构6(可为一置料匣)设置于该第二机械臂2的活动范围内，其内部具有可供收容多个片状待加工晶圆60或已加工晶圆6a的空间。
在实际应用时，于该置料机构6的下方可依需要设置一升降机构61，该升降机构61可驱动该置料机构6(置料匣)升高或降低位置。
请参图3所示，可知本发明的置卸除方法包括：影像攫取组件校正取像范围S11、晶圆定位件装卸机构校正作业位置S12、影像攫取组件正确对应于晶圆盘S13、晶圆定位件装卸机构由晶圆盘上取下晶圆定位件S14、晶圆取放机构校正作业位置S15、晶圆取放机构将待加工晶圆放置于晶圆校正机构上S16、晶圆校正机构读取待加工晶圆的编码，并将待加工晶圆的缺口转至正确角度S17、晶圆取放机构将待加工晶圆移送至晶圆盘上S18、影像攫取组件取得待加工晶圆的影像S19、晶圆定位件装卸机构将晶圆定位件装设于晶圆盘上，以固定待加工晶圆S20、载盘向外移出S21、载盘移回原位S22、影像攫取组件正确对应于晶圆盘S23、晶圆定位件装卸机构由晶圆盘上取下晶圆定位件S24、晶圆取放机构由晶圆盘上取下已加工晶圆，并由晶圆校正机构读取已加工晶圆的编码S25及晶圆取放机构将已加工晶圆放入置料机构中S26等步骤；以下即参照图4至图26，并配合图1和图2的结构分别说明上述各步骤：
首先，该影像攫取组件校正取像范围S11的步骤，由该第一机械臂1驱动该影像攫取组件11移至该主校正机构4上(如图4所示)，以调整校正该影像攫取组件11取得影像范围至正确位置。
在本实施例中，当该第一机械臂1驱动该影像攫取组件11靠近该主校正机构4的上方时，该下取像组件42直接取得该透明片43上标准刻度431的位置，且该主校正机构4利用测距激光光源41所产生的激光光束411投射至该影像攫取组件11上，可测量该主校正机构4与该影像攫取组件11的距离，借以调整该下取像组件42的镜头焦距；而该影像攫取组件11经由该上取像组件111取得该透明片43上的标准刻度431的位置，由该控制模组比对该下取像组件42取得该标准刻度431的位置与该影像攫取组件11取得该标准刻度431的位置之间差异，经由该第一机械臂1调整该影像攫取组件11的位置，使该上取像组件111取得的标准刻度431影像与该下取像组件42取得的标准刻度431位置相叠合，再由该控制模组记忆该影像攫取组件11的正确取像范围的坐标，借以达到校正该影像攫取组件11取像范围的目的。
该晶圆定位件装卸机构校正作业位置S12的步骤，由该第一机械臂1驱动该晶圆定位件装卸机构12，使其定位面121移至该主校正机构4上(如图5所示)，以调整校正该晶圆定位件装卸机构12的作业位置，且该控制模组可比对记忆该晶圆定位件装卸机构12作业位置与该影像攫取组件11取得影像范围之间的相对位置坐标。
在本实施例中，当该第一机械臂1驱动该晶圆定位件装卸机构12靠近该主校正机构4的上方时，该主校正机构4利用测距激光光源41所产生的激光光投射至该定位面121上，可测量该主校正机构4与该晶圆定位件装卸机构12的距离，借以调整该下取像组件42的镜头焦距；而该下取像组件42则可观视该透明片43上标准刻度431，以及透过该透明片43观视该标准刻度431与该定位面121上该定位刻度122(或孔洞)之间的位置差异，由该控制模组经由该第一机械臂1驱动该晶圆定位件装卸机构12调整位置，使该定位面121上该定位刻度122(或孔洞)与该标准刻度431位置重叠，即可使该晶圆定位件装卸机构12的作业位置被校正至正确位置。
该影像攫取组件正确对应于晶圆盘S13的步骤，由该第一机械臂1驱动该影像攫取组件11移至该外罩32的凹缺口321的上方(如图6所示)，可取得对应该凹缺口321部位的该晶圆盘31的影像，借以检视该晶圆盘31上的状况(是否有残留的晶圆60碎屑或破片)。
该晶圆定位件装卸机构由晶圆盘上取下晶圆定位件S14的步骤，由该控制模组参考该相对位置坐标，经该第一机械臂1驱动该晶圆定位件装卸机构12接近对应该凹缺口321部位的该晶圆盘31，再驱动该晶圆定位件装卸机构12调整位置，使多个(至少三个)该激光光源124所产生相同长度的激光光束，可共同投射于该晶圆盘31上，使该定位面121对准(平行于)该晶圆盘31(如图7所示)，再由该晶圆定位件装卸机构12将该晶圆盘31的周缘预先设置的晶圆定位件311解除锁掣之后，利用该夹持件123取出该晶圆定位件311，并维持夹持状态(如图8和图9所示)。
该晶圆取放机构校正作业位置S15的步骤，由该第二机械臂2驱动该晶圆取放机构21移至该主校正机构4上(如图10所示，为便于检视该主校正机构4，并未绘出该晶圆校正机构5)，以校正该晶圆取放机构21的作业位置。
在本实施例中，当该第二机械臂2驱动该晶圆取放机构21靠近该主校正机构4的上方时，该主校正机构4利用测距激光光源41所产生的激光光投射至该晶圆取放机构21上，借以测量该晶圆取放机构21的距离，以调整该下取像组件42的镜头焦距；而该下取像组件42则可观视该透明片43上标准刻度431，同时再透过该透明片43观视该晶圆取放机构21上的该指示刻度211的位置，并比较该指示刻度211与该标准刻度431之间的位置差异，由该控制模组经由该第二机械臂2驱动该晶圆取放机构21调整位置，借以将该晶圆取放机构21上的该指示刻度211与该标准刻度431得以重叠，使该晶圆取放机构21的作业位置校正至正确位置。
该晶圆取放机构将待加工晶圆放置于晶圆校正机构上S16的步骤，由该第二机械臂2驱动该晶圆取放机构21移至该置料机构6中取出待加工晶圆60(如图11所示)，并将该待加工晶圆60放置于该晶圆校正机构5的承置座51上(如图12所示)。
该晶圆校正机构读取待加工晶圆的编码，并将待加工晶圆的缺口转至正确角度S17的步骤，由该晶圆校正机构5的取像单元52先取得该待加工晶圆60的编码及缺口位置(如图13所示)，再由该控制模组依据该欲置入晶圆盘31的缺口位置计算该待加工晶圆60所需调整的角度，由该转置机构54驱动该吸头53吸附该待加工晶圆60上升(脱离该承置座51)，并转动该待加工晶圆60，以将该待加工晶圆60的缺口调整至正确的角度；然后该转置机构54驱动该吸头53吸附该待加工晶圆60下降，以将该待加工晶圆60回置于该承置座51上。
该晶圆取放机构将待加工晶圆移送至晶圆盘上S18的步骤，由该第二机械臂2驱动该晶圆取放机构21将该具有正确缺口角度的待加工晶圆60由该晶圆校正机构5的承置座51上取出，并通过该外罩32的凹缺口321放置于该载盘3的该晶圆盘31上(如图14所示)。
该影像攫取组件取得待加工晶圆的影像S19的步骤，由该第一机械臂1驱动该影像攫取组件11移至该外罩32的凹缺口321的上方(如图15所示)，并取得前一步骤所放置的待加工晶圆60的影像，以确认该待加工晶圆60是否完整且是否被放置于正确位置。
该晶圆定位件装卸机构将晶圆定位件装设于晶圆盘上，以固定待加工晶圆S20的步骤，由该第一机械臂1驱动该晶圆定位件装卸机构12将该夹持件123所夹持的该晶圆定位件311结合锁掣于该晶圆盘31上(如图16所示)，通过该晶圆定位件311压合于该待加工晶圆60的周缘形成定位(如图17所示)。
然后，该枢转座333驱动该载盘3转动，使该已承载待加工晶圆60的该晶圆盘31转至该外罩32的下方，且另一空置(未放置待加工晶圆60)的晶圆盘31移至该外罩32的凹缺口321的下方形成裸露，以便于依序重复上述S13、S14、S16、S17、S18、S19、S20等步骤，将不同待加工晶圆60分别固定于各晶圆盘31上。
该载盘向外移出S21的步骤，于该载盘3的各晶圆盘31皆已承载待加工晶圆60之后，该滑移机构33的滑移座331沿该滑移导轨332向外滑动至该外罩32以外的预设定位(如图18所示)，以便于另将该载盘3移至下一加工工序。
该载盘移回原位S22的步骤，于该载盘3上各晶圆盘31所承载待加工晶圆60皆完 成加工而分别成为已加工晶圆6a之后，可将该载盘3置于该滑移机构33的枢转座333(滑移座331)上，再使该枢转座333(滑移座331)沿该滑移导轨332滑动至该外罩32的下方，并使其中一晶圆盘31上的已加工晶圆6a位于该凹缺口321的下方形成裸露(如图19所示)。
该影像攫取组件正确对应于晶圆盘S23的步骤，由该第一机械臂1驱动该影像攫取组件11移至该外罩32的凹缺口321的上方(如图20所示)，可取得对应该凹缺口321部位的晶圆盘31上的影像，借以检视该晶圆盘31上已加工晶圆6a的状况(是否有破损或异常情形)。
该晶圆定位件装卸机构由晶圆盘上取下晶圆定位件S24的步骤，由该控制模组参考该相对位置坐标，经该第一机械臂1驱动该晶圆定位件装卸机构12接近对应该凹缺口321部位的该晶圆盘31，再驱动该晶圆定位件装卸机构12调整位置，使多个(至少三个)该激光光源124所产生相同长度的激光光束，可共同投射于该晶圆盘31上，使该定位面121对准(平行于)该晶圆盘31(如图21所示)，再由该晶圆定位件装卸机构12将该晶圆盘31的周缘预先设置的晶圆定位件311解除锁掣之后，利用该夹持件123取出该晶圆定位件311，并维持夹持状态(如图22和图23所示)。
该晶圆取放机构由晶圆盘上取下已加工晶圆，并由晶圆校正机构读取已加工晶圆的编码S25的步骤，由该第二机械臂2驱动该晶圆取放机构21移至该载盘3(裸露于凹缺口321的下方)的晶圆盘31上，以吸取已加工晶圆6a(如图24所示)；并将该已加工晶圆6a移置于该晶圆校正机构5的承置座51上，通过该取像单元52读取该已加工晶圆6a的编码(如图25所示)，并由该控制模组记录该已加工晶圆6a的编码。
该晶圆取放机构将已加工晶圆放入置料机构中S18的步骤，由该第二机械臂2驱动该晶圆取放机构21将该已加工晶圆6a由承置座51上取下，配合该升降机构61驱动该置料机构6(置料匣)升降动作，可将该已加工晶圆6a放入该置料机构6的空间中(如图26所示)。
然后，该枢转座333驱动该载盘3转动，使该已取出晶圆6a的晶圆盘31转至该外罩32的下方，且另一承载有已加工晶圆6a的晶圆盘31移至该外罩32的凹缺口321的下方形成裸露，以便于依序重复上述S14、S15、S17、S18等步骤，以将不同晶圆盘31上的已加工晶圆6a分别移至该置料机构6(置料匣)中；最后，当该载盘3的各已加工晶圆6a皆已取出之后，该滑移机构33的滑移座331(枢转座333)承载该载盘3沿该滑移导轨332向外滑动，以便于将该清空的载盘3取出，并将另一具有已加工晶圆6a 的载盘3置于该枢转座333上。
综合以上所述，本发明晶圆载盘的置载/卸载装置及其置载/卸载方法确可达成降低人力成本、提升移置效率且可确保晶圆放置于晶圆盘上的方向性及精准度的功效，实为一具新颖性及进步性的发明，爰依法提出申请发明专利；但上述说明的内容，仅为本发明的较佳实施例说明，举凡依本发明的技术手段与范畴所延伸的变化、修饰、改变或等效置换，亦皆应落入本发明的保护范围内。

Claims (28)

  1. 一种晶圆载盘的置载/卸载装置，其中，该晶圆载盘的置卸除装置至少包括：
    一第一机械臂，连结并受一控制模组驱动，于该第一机械臂的活动端上至少设有一影像攫取组件；
    一第二机械臂，连结并受该控制模组驱动，于该第二机械臂的活动端上设有一晶圆取放机构；
    一载盘，设置于该第一机械臂和该第二机械臂的活动范围内，且连结并受该控制模组驱动，该载盘上设有至少一承置晶圆的晶圆盘；
    一主校正机构，设置于该第一机械臂和该第二机械臂的活动范围内，且连结并受该控制模组驱动，以供分别校正该影像攫取组件及晶圆取放机构的作业位置；
    一晶圆校正机构，设置于该第二机械臂的活动范围内，且连结并受该控制模组驱动，以供读取置入的晶圆的编码及调整该晶圆的缺口；
    一置料机构，设置于该第二机械臂的活动范围内，其内部设有收容晶圆的空间。
  2. 如权利要求1所述的晶圆载盘的置载/卸载装置，其中各晶圆分别经由一可锁掣的晶圆定位件固定于该晶圆盘上，且该第一机械臂的活动端上还设有一可装卸该晶圆定位件的晶圆定位件装卸机构。
  3. 如权利要求2所述的晶圆载盘的置载/卸载装置，其中该影像攫取组件具有一可产生照明光线的上取像组件，该主校正机构具有一下取像组件，于该下取像组件的上方设有一透明片，于该透明片上设有一作为定位基准的标准刻度；该晶圆定位件装卸机构具有一定位面，于该定位面上设有一定位刻度；该晶圆取放机构具有可吸取晶圆的晶圆吸盘，于该晶圆吸盘上设有一指示刻度。
  4. 如权利要求3所述的晶圆载盘的置载/卸载装置，其中该晶圆定位件装卸机构于该定位面的外旁侧设有多个激光光源。
  5. 如权利要求3所述的晶圆载盘的置载/卸载装置，其中该主校正机构于该下取像组件的旁侧设有一测距激光光源。
  6. 如权利要求1或2或3或4或5所述的晶圆载盘的置载/卸载装置，其中该置料机构为一内部具有收容空间的置料匣，该置料匣设置于一升降机构上，该升降机构连结并受该控制模组驱动，以调整该置料匣的高度。
  7. 如权利要求1或2或3或4或5所述的晶圆载盘的置载/卸载装置，其中该载盘设置于一滑移机构上，该滑移机构具有一滑移座，该滑移座可沿多个平行延伸的滑移导 轨移动，于该滑移座上设有一承置该载盘的枢转座。
  8. 如权利要求6所述的晶圆载盘的置载/卸载装置，其中该载盘设置于一滑移机构上，该滑移机构具有一滑移座，该滑移座可沿多个平行延伸的滑移导轨移动，于该滑移座上设有一承置该载盘的枢转座。
  9. 如权利要求7所述的晶圆载盘的置载/卸载装置，其中该滑移导轨的一端上方设有一外罩，该外罩上设有一凹缺口，当该载盘移至该外罩的下方时，可使局部该晶圆盘对外裸露。
  10. 如权利要求8所述的晶圆载盘的置载/卸载装置，其中该滑移导轨的一端上方设有一外罩，该外罩上设有一凹缺口，当该载盘移至该外罩的下方时，可使局部该晶圆盘对外裸露。
  11. 如权利要求1或2或3或4或5所述的晶圆载盘的置载/卸载装置，其中该晶圆校正机构具有一可供放置晶圆的承置座，该承置座的中央为贯通，于该承置座的上方设有一取像单元，于该承置座的贯通部位的下方设有一具有真空吸孔的吸头，该吸头可受一转置机构驱动而升降及枢转。
  12. 如权利要求6所述的晶圆载盘的置载/卸载装置，其中该晶圆校正机构具有一可供放置晶圆的承置座，该承置座的中央为贯通，于该承置座的上方设有一取像单元，于该承置座的贯通部位的下方设有一具有真空吸孔的吸头，该吸头可受一转置机构驱动而升降及枢转。
  13. 如权利要求7所述的晶圆载盘的置载/卸载装置，其中该晶圆校正机构具有一可供放置晶圆的承置座，该承置座的中央为贯通，于该承置座的上方设有一取像单元，于该承置座的贯通部位的下方设有一具有真空吸孔的吸头，该吸头可受一转置机构驱动而升降及枢转。
  14. 如权利要求8所述的晶圆载盘的置载/卸载装置，其中该晶圆校正机构具有一可供放置晶圆的承置座，该承置座的中央为贯通，于该承置座的上方设有一取像单元，于该承置座的贯通部位的下方设有一具有真空吸孔的吸头，该吸头可受一转置机构驱动而升降及枢转。
  15. 一种应用权利要求3所述的晶圆载盘的置载/卸载装置的置载方法，其中，该置载方法至少包括：
    一影像攫取组件校正取像范围的步骤，由第一机械臂驱动影像攫取组件移至主校正机构上，以校正该影像攫取组件取像范围至正确位置；
    一晶圆定位件装卸机构校正作业位置的步骤，由该第一机械臂驱动晶圆定位件装卸机构的定位面移至该主校正机构上，以调整校正该晶圆定位件装卸机构的作业位置，且该控制模组可比对记忆该晶圆定位件装卸机构作业位置与该影像攫取组件取得影像范围之间的相对位置坐标；
    一影像攫取组件正确对应于晶圆盘的步骤，由该第一机械臂驱动该影像攫取组件移至该载盘的上方，并修正位置以准确对应于该载盘上其中之一晶圆盘，借以检视该晶圆盘上的状况；
    一晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤，由该控制模组参考该相对位置坐标，经该第一机械臂驱动该晶圆定位件装卸机构以该定位面对准该晶圆盘，并将该晶圆盘的周缘预先设置的晶圆定位件取出；
    一晶圆取放机构校正作业位置的步骤，由该第二机械臂驱动该晶圆取放机构移至该主校正机构上，以校正该晶圆取放机构的作业位置；
    一晶圆取放机构将待加工晶圆放置于晶圆校正机构上的步骤，由该第二机械臂驱动该晶圆取放机构移至该置料机构中取出待加工晶圆，并将该待加工晶圆放置于该晶圆校正机构中；
    一晶圆校正机构读取待加工晶圆的编码，并将待加工晶圆的缺口转至正确角度的步骤，由该晶圆校正机构取得该待加工晶圆的编码及缺口位置，并转动该待加工晶圆，以将该待加工晶圆的缺口调整至正确的角度；
    一晶圆取放机构将待加工晶圆移送至晶圆盘上的步骤，由该第二机械臂驱动该晶圆取放机构将该待加工晶圆由该晶圆校正机构中取出，并放置于该载盘的该晶圆盘上；
    一影像攫取组件取得待加工晶圆的影像的步骤，由该第一机械臂驱动该影像攫取组件移至该载盘上，并取得先前放置的待加工晶圆的影像，以确认该待加工晶圆是否完整；
    一晶圆定位件装卸机构将晶圆定位件装设于晶圆盘上，以固定待加工晶圆的步骤，由该第一机械臂驱动该晶圆定位件装卸机构将该晶圆定位件结合于该晶圆盘上，通过该晶圆定位件压合于该待加工晶圆的周缘形成定位，然后该控制模组驱动该载盘移至一预设外部待加工位置。
  16. 如权利要求15所述的置载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，该透明片上设一标准刻度作为定位基准；于该影像攫取组件中建置一上取像组件，若该上取像组件的取像范围中的标准刻度位置与该下取像 组件的取像范围中的标准刻度位置之间产生位置偏差，则该控制模组经由该第一机械臂驱动该影像攫取组件调整位置，使该上取像组件和该下取像组件的取像范围中的标准刻度位置重叠，即能将该影像攫取组件的取像范围被校正至正确位置。
  17. 如权利要求15所述的置载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，于该透明片上设一标准刻度作为定位基准；于该晶圆取放机构上设有一指示刻度；若该下取像组件的取像范围中的标准刻度位置与该晶圆取放机构上的指示刻度产生位置偏差，则该控制模组经由该第二机械臂驱动该晶圆取放机构调整位置，使该指示刻度与该标准刻度重叠，即能将该晶圆取放机构的作业位置被校正至正确位置。
  18. 如权利要求15所述的置载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，该透明片上设有一标准刻度作为定位基准；于该晶圆定位件装卸机构的该定位面上设有一定位刻度；若该下取像组件的取像范围中的标准刻度位置与该定位面上的定位刻度之间产生位置偏差，则该控制模组经由该第一机械臂驱动该晶圆定位件装卸机构调整位置，使该定位刻度与该标准刻度重叠，即能将该晶圆定位件装卸机构的作业位置被校正至正确位置。
  19. 如权利要求15所述的置载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的旁侧建置一测距激光光源，该测距激光光源能产生激光光束，以量测该影像攫取组件、该晶圆定位件装卸机构、该晶圆取放机构分别与下取像组件之间的距离，以经由该控制模组调整该下取像组件的镜头焦距。
  20. 如权利要求15所述的置载方法，其中该晶圆定位件装卸机构的周侧建置有至少三激光光源，在该晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤中，利用该控制模组经由该第一机械臂驱动该晶圆定位件装卸机构调整位置，使各该激光光源所产生相同长度的激光光束，可共同投射于该晶圆盘上，借以使以该晶圆定位件装卸机构正确对应于该晶圆盘。
  21. 如权利要求15所述的置载方法，其中该晶圆校正机构中至少建置一承置座、一取像单元及一转置机构，该承置座供承置该晶圆，该取像单元取得该晶圆的编码及缺口位置，该转置机构能带动该晶圆转动，以调整该晶圆的缺口至正确的角度。
  22. 一种应用权利要求3所述的晶圆载盘的置载/卸载装置的卸载方法，其中，该卸载方法至少包括：
    一影像攫取组件校正取像范围的步骤，于承载已加工晶圆的载盘由外侧移回外罩 下之前，由第一机械臂驱动影像攫取组件移至主校正机构上，以校正该影像攫取组件取像范围至正确位置；
    一晶圆定位件装卸机构校正作业位置的步骤，由该第一机械臂驱动晶圆定位件装卸机构的定位面移至该主校正机构上，以调整校正该晶圆定位件装卸机构的作业位置，且该控制模组可比对记忆该晶圆定位件装卸机构作业位置与该影像攫取组件取得影像范围之间的相对位置坐标；
    一晶圆取放机构校正作业位置的步骤，由第二机械臂驱动该晶圆取放机构移至该主校正机构上，以校正该晶圆取放机构的作业位置；
    一影像攫取组件正确对应于晶圆盘的步骤，于承载已加工晶圆的载盘由外侧移回该外罩下之后，由该第一机械臂驱动该影像攫取组件移至该载盘的上方，并修正位置以准确对应于该载盘上其中之一晶圆盘，借以检视该晶圆盘上已加工晶圆的状况；
    一晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤，由该控制模组参考该相对位置坐标，经该第一机械臂驱动该晶圆定位件装卸机构以该定位面对准该晶圆盘，并将该晶圆盘的周缘固定于已加工晶圆的周侧的晶圆定位件取出；
    一晶圆取放机构由晶圆盘上取下已加工晶圆，并由晶圆校正机构读取已加工晶圆的编码步骤，由该第二机械臂驱动该晶圆取放机构移至该载盘的晶圆盘上，以取出已加工晶圆，并将该已加工晶圆放入该晶圆校正机构中，以读取该已加工晶圆的编码；
    一晶圆取放机构将晶圆放入置料机构中的步骤，由该晶圆取放机构将该已加工晶圆移至置料机构中。
  23. 如权利要求22所述的卸载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，该透明片上设一标准刻度作为定位基准；于该影像攫取组件中建置一上取像组件，若该上取像组件的取像范围中的标准刻度位置与该下取像组件的取像范围中的标准刻度位置之间产生位置偏差，则该控制模组经由该第一机械臂驱动该影像攫取组件调整位置，使该上取像组件和该下取像组件的取像范围中的标准刻度位置重叠，即能将该影像攫取组件的取像范围被校正至正确位置。
  24. 如权利要求22所述的卸载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，于该透明片上设一标准刻度作为定位基准；于该晶圆取放机构上设有一指示刻度；若该下取像组件的取像范围中的标准刻度位置与该晶圆取放机构上的指示刻度产生位置偏差，则该控制模组经由该第二机械臂驱动该晶圆取放机构调整位置，使该指示刻度与该标准刻度重叠，即能将该晶圆取放机构的作业位置被校 正至正确位置。
  25. 如权利要求22所述的卸载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的上方设一透明片，该透明片上设有一标准刻度作为定位基准；于该晶圆定位件装卸机构的该定位面上设有一定位刻度；若该下取像组件的取像范围中的标准刻度位置与该定位面上的定位刻度之间产生位置偏差，则该控制模组经由该第一机械臂驱动该晶圆定位件装卸机构调整位置，使该定位刻度与该标准刻度重叠，即能将该晶圆定位件装卸机构的作业位置被校正至正确位置。
  26. 如权利要求22所述的卸载方法，其中该主校正机构中建置一下取像组件，于该下取像组件的旁侧建置一测距激光光源，该测距激光光源能产生激光光束，以量测该影像攫取组件、该晶圆定位件装卸机构、该晶圆取放机构分别与下取像组件之间的距离，以经由该控制模组调整该下取像组件的镜头焦距。
  27. 如权利要求22所述的卸载方法，其中该晶圆定位件装卸机构周侧建置有至少三激光光源，在该晶圆定位件装卸机构由晶圆盘上取下晶圆定位件的步骤中，利用该控制模组经由该第一机械臂驱动该晶圆定位件装卸机构调整位置，使各该激光光源所产生相同长度的激光光束，可共同投射于该晶圆盘上，借以使以该晶圆定位件装卸机构正确对应于该晶圆盘。
  28. 如权利要求22所述的卸载方法，其中该晶圆校正机构中至少建置一承置座、一取像单元及一转置机构，该承置座供承置该晶圆，该取像单元取得该晶圆的编码及缺口位置，该转置机构能带动该晶圆转动，以调整该晶圆的缺口至正确的角度。
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