WO2021164667A1 - 晶圆及其转载机构的校准装置及校准方法 - Google Patents

晶圆及其转载机构的校准装置及校准方法 Download PDF

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Publication number
WO2021164667A1
WO2021164667A1 PCT/CN2021/076316 CN2021076316W WO2021164667A1 WO 2021164667 A1 WO2021164667 A1 WO 2021164667A1 CN 2021076316 W CN2021076316 W CN 2021076316W WO 2021164667 A1 WO2021164667 A1 WO 2021164667A1
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WIPO (PCT)
Prior art keywords
wafer
image
image capturing
scale
calibration
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PCT/CN2021/076316
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English (en)
French (fr)
Inventor
宋茂炎
Original Assignee
宋茂炎
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Publication date
Priority claimed from CN202010102259.2A external-priority patent/CN113276104A/zh
Priority claimed from CN202020184839.6U external-priority patent/CN211879354U/zh
Application filed by 宋茂炎 filed Critical 宋茂炎
Priority to US17/759,942 priority Critical patent/US20230064861A1/en
Publication of WO2021164667A1 publication Critical patent/WO2021164667A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Definitions

  • the present invention relates to a calibration device and a calibration method for a wafer and its transfer mechanism, especially a simple mechanism and operation, which can calibrate different mechanical arms to establish a common reference point and maintain accurate movement accuracy, and can adjust the wafer to Calibration device and method for correct direction and angle.
  • the general integrated circuit (IC) manufacturing process can be divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging.
  • silicon ingot When the silicon ingot is cut into wafers, it needs to go through yellow light.
  • the production of integrated circuits can be completed by multiple complicated procedures such as crystal growth, etching, and mechanical polishing.
  • the wafer In the above-mentioned manufacturing process, the wafer is undergoing testing, cleaning, evaporation, drying or soaking in organic solvents, etc.
  • each wafer needs to be fixed on a wafer tray first, and each wafer tray carries the wafers to perform the processing operations of the above-mentioned processes.
  • the basic structure of a common wafer disk is a disk body with a shape and carrying area slightly larger than the outer diameter of the wafer.
  • a separable ring frame is provided above the disk body, and is defined between the disk body and the ring frame.
  • a position for accommodating the wafer is provided, and a plurality of buckling mechanisms are provided on the periphery of the disk body.
  • the buckling mechanisms can be used to clamp the ring frame, and the ring frame is pressed on the periphery of the wafer To form positioning; in actual applications, in order to process a larger amount of wafers at the same time, most of the wafer trays are set on a large-area carrier tray, and the carrier tray can accommodate multiple wafer trays and Move to different processing procedures at the same time to effectively increase the efficiency of the overall wafer processing.
  • each wafer is numbered and barcodes are generated, so that automated equipment (cameras or code readers) can quickly read and record the number information of the wafers; at the same time, generally for a large number of wafers
  • the wafer cassettes are used to accommodate each wafer, and the wafer cassettes are likely to shake or vibrate during the transfer process to cause the wafers inside to shift in their storage orientation (angle), so ,
  • the angle and position (or orientation) of the wafer must be corrected first, so that each wafer can be accurately placed in the position to be processed , In order to facilitate subsequent processing operations.
  • the main purpose of the present invention is to provide a calibration device and a calibration method for a wafer and its transfer mechanism, in which a main calibration mechanism and a wafer calibration mechanism are respectively built within the preset movable range of the first robot arm and the second robot arm, An image grabbing assembly and a wafer positioning member loading and unloading mechanism are provided on the first robotic arm, and a wafer picking and placing mechanism is provided on the second robotic arm.
  • the first robotic arm drives the image grabbing assembly and the wafer respectively
  • the positioning member loading and unloading mechanism is attached to the main correction mechanism to correct the image capturing range and the accuracy of the working position, and the relative position coordinates between the wafer positioning member loading and unloading mechanism and the image capturing assembly are memorized;
  • the second mechanical arm drives
  • the wafer pick-and-place mechanism is placed on the main correction mechanism to correct its working position, and the wafer pick-and-place mechanism moves the wafer on the wafer correction mechanism, and obtains the wafer's position by the wafer correction mechanism Encode information and adjust the orientation of the wafer to the correct angular direction to facilitate displacement to a preset position for subsequent processing.
  • Another object of the present invention is to provide a calibration device and a calibration method for a wafer and its transfer mechanism, wherein the image grabbing assembly has an upper image capturing element, the wafer positioning member loading and unloading mechanism has a positioning scale, the crystal The circle pick-and-place mechanism is provided with an indicator scale, the main correction mechanism has a lower image capturing element, and a transparent sheet with a standard scale is arranged above the lower image capturing element; the first mechanical arm is used to drive the image capture assembly to make the The upper image capturing element and the lower image capturing element respectively correspond to the standard scale to capture images, which can correct the image capturing range of the image capture assembly and establish the reference point coordinates of the first mechanical arm; and the first mechanical arm drives the crystal Circular positioning member loading and unloading mechanism, the position image of the positioning scale can be seen through the lower image capturing element, the working position of the wafer positioning member loading and unloading mechanism can be corrected, and the difference between the image grabbing assembly and the wafer positioning member loading and unloading mechanism can be
  • the working position of the wafer pick-and-place mechanism can be corrected to establish the second robotic arm’s
  • the coordinates of the reference point therefore, the use of the image grabbing component to first locate the correct position on the area to be operated can directly move the wafer positioning member loading and unloading mechanism to the correct position and perform subsequent operations, which not only simplifies the operating procedure, but also Maintain the working accuracy between different mechanisms on a single robot arm, and because the first robot arm and the second robot arm are calibrated through the main calibration mechanism, they have the same reference point coordinates, so that the first robot arm and the second robot arm are calibrated. A precise interconnection relationship is established between the second mechanical arms.
  • Another object of the present invention is to provide a calibration device and a calibration method for a wafer and its transfer mechanism, wherein the wafer calibration mechanism has a supporting seat for placing the wafer, and a through hole is provided in the center of the supporting seat. Hole, an image capturing unit is arranged above the supporting seat, and a suction head is arranged below the supporting seat corresponding to the through hole, and the suction head can be driven by a transposition mechanism to suck the wafer through the through hole , And drive the wafer to lift and pivot to cooperate with the imaging unit to complete the wafer barcode number reading, wafer edge inspection, and wafer calibration mark correction and adjustment. It reads the wafer barcode number Combining functions such as calibration and adjustment of wafer calibration marks in a single combined structure not only simplifies the overall structure, but also reduces the space occupied by the mechanism.
  • the technical means implemented by the present invention include: a calibration device for a wafer and its transfer mechanism, which has: a first robotic arm connected to and driven by a control module, in the first machinery The movable end of the arm is provided with an image grabbing assembly and a wafer positioning member loading and unloading mechanism.
  • the image grabbing assembly has an upper image capturing element.
  • the wafer positioning member loading and unloading mechanism has a positioning surface on which a positioning surface is provided.
  • the correction mechanism is arranged in the movable range of the first and second mechanical arms, and is connected and driven by the control module.
  • the main correction mechanism has a lower image capturing element, and is arranged above the lower image capturing element.
  • the main correction mechanism is provided with a distance measuring laser light source on the side of the lower image-taking element;
  • the peripheral side of the positioning surface of the wafer positioning member loading and unloading mechanism is provided with a plurality of laser light sources, and a plurality of the laser light sources At least three points are respectively arranged on the outer side of the positioning surface.
  • the wafer calibration device has a holder for placing wafers, an image capturing unit that can capture images, a suction head that can absorb wafers, and a transposition Mechanism; the image capturing unit is arranged above the supporting seat, the suction head is arranged below the supporting seat, and the transposition mechanism is combined under the suction head to drive the suction head to drive the wafer in Movements such as lifting and pivoting are performed on the bearing seat.
  • the transposition mechanism has a lifting component and a pivoting component
  • the lifting component is provided with a lifting power source
  • an eccentric wheel driven to pivot by the lifting power source and one end pivotally connected to the eccentric
  • the pivot assembly is provided with a pivoting force source
  • the pivoting force source is arranged on a vertically slidable sliding seat, and is connected to the other end of the connecting rod on the pivoting force source
  • a pivot shaft is provided, and the pivot shaft is combined with the suction head.
  • the center of the supporting seat has a through hole
  • the suction head is arranged at a position corresponding to the through hole
  • a ring flange is provided on the periphery of the top side of the supporting seat.
  • an inwardly extending guide slope is protruded from the outer peripheral side of the ring flange.
  • a recess is provided at a local position of the bearing seat on the ring flange.
  • a support structure is provided on the side of the supporting base, and the supporting structure has a plurality of supporting feet below the supporting base.
  • the lower side frame extends upwardly from the other side of the supporting leg, and the image capturing unit is fixed to an end of the upper side frame away from the lower side frame.
  • the technical means implemented by the present invention further includes: a calibration method using the aforementioned calibration device, at least having: a step of comparing the position difference between the lower image capturing element and the upper image capturing element to obtain a standard scale, driven by the first mechanical arm The image capture component is moved to the top of the main correction mechanism.
  • the lower image capturing element directly obtains the position image of the standard scale on the transparent film to form a lower standard position image
  • the upper image capturing element obtains the position image of the standard scale on the transparent film to form An upper standard position image
  • the control module compares the difference between the lower standard position image and the upper standard position image
  • a step of establishing the reference point coordinates of the first robot arm and the first robot arm drives the image to grab
  • the component is moved to an image capturing and correction position, so that the lower standard position image and the upper standard position image are superimposed, so as to correct the image capturing range of the image capture unit, and the control module stores the image capture correction of the image capture unit Position coordinates to establish the reference point coordinates of the first robotic arm
  • the control module compares the lower standard position image with the The difference between the positioning position images; a step of establishing the correct operating position of the wafer positioning member handling mechanism, the first robotic arm drives the wafer positioning member handling mechanism to move to a loading and unloading correction position, so that the next standard position image is consistent with the The positioning position images overlap, so as to correct the working position of the wafer positioning member loading and unloading mechanism, and the control module memorizes the coordinates of the loading and unloading correction position of the wafer positioning member loading and unloading mechanism, and then calculates and memorizes the capturing correction position and loading and unloading The relative coordinates between the calibration positions; a step of comparing the lower imaging element to obtain the position difference between the indicated scale position and the standard scale, the second robotic arm drives the wafer pick-and-place mechanism to move above the main calibration mechanism, and The lower image capturing element penetrates the transparent sheet to see through the position image of the indicating scale on the wafer pick-and-place mechanism to form an indicated position image, and then the control module compare
  • a step of adjusting the lens focal length of the upper image capturing element corresponding to the standard scale is performed in advance.
  • the correction mechanism uses the laser beam generated by the ranging laser light source to project to the standard scale position of the image capture assembly, and can measure the distance between the main correction mechanism and the standard scale, and adjust the lens focal length of the upper image capturing element to facilitate the The upper image capturing element clearly obtains the position image of the standard scale on the transparent film.
  • a step of adjusting the focal length of the lens corresponding to the positioning scale of the imaging element is performed in advance, and the main correction is performed.
  • the mechanism uses the laser beam generated by the distance measuring laser light source to project onto the positioning scale of the positioning surface, thereby measuring the distance between the main correction mechanism and the wafer positioning member loading and unloading mechanism, and adjusting the lens focal length of the lower imaging element to It is helpful for the lower image capturing element to clearly obtain the position image of the positioning scale of the wafer positioning member loading and unloading mechanism.
  • a step of adjusting the focal length of the lens corresponding to the indicated scale of the lower image capturing element is performed in advance, and the main correction is performed.
  • the mechanism uses the laser beam generated by the ranging laser light source to project on the indicator scale structure of the wafer pick-and-place machine, thereby measuring the distance between the main correction mechanism and the indicator scale, to adjust the lens focal length of the lower imaging element, It is helpful for the lower image pickup component to clearly obtain the position image of the indicator scale of the wafer pick-and-place machine.
  • Figure 1 is a schematic diagram of the overall structure of the present invention.
  • Fig. 2 is a partial enlarged schematic diagram of the main correction mechanism of the present invention.
  • FIG 3 is a partial enlarged schematic diagram of the wafer calibration mechanism of the present invention.
  • Fig. 4 is an exploded view of the three-dimensional structure of the transposition assembly of the present invention.
  • Fig. 5 is a flow chart of the calibration method of the present invention.
  • FIG. 6 is a schematic diagram of the state of the image capture assembly of the present invention above the main correction mechanism.
  • FIG. 7 is a schematic diagram of the state of the wafer positioning member attaching and unloading mechanism of the present invention above the main calibration mechanism.
  • FIG. 8 is a schematic diagram of the state where the image grabbing assembly is correctly corresponding to the wafer tray on the upper side of the carrier tray when the present invention is actually applied.
  • FIG. 9 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism is moved to the wafer tray when the present invention is actually applied.
  • FIG. 10 is a schematic diagram of a state in which the wafer positioning member loading and unloading mechanism removes the wafer positioning member when the present invention is actually applied.
  • Fig. 11 is a partial enlarged schematic view of the part A in Fig. 10.
  • FIG. 12 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention above the main correction mechanism.
  • FIG. 13 is a schematic diagram of a state in which the wafer pick-and-place mechanism of the present invention takes out the wafer from the material placement mechanism.
  • FIG. 14 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention to move the wafer onto the wafer correction mechanism.
  • Fig. 15 is a partial side plan view of Fig. 14.
  • Fig. 16 is an enlarged schematic view of part B in Fig. 15.
  • FIG. 17 is a schematic diagram of the operation of the wafer according to the present invention placed on the holder and the image capturing unit obtains an image of the wafer.
  • Fig. 18 is a partial side plan view of Fig. 17.
  • Fig. 19 is an enlarged schematic view of part C in Fig. 18.
  • FIG. 20 is a schematic diagram of the operation of the lifting module of the present invention to lift up the wafer through the suction head.
  • 21 is a schematic diagram of the movement of the pivot module of the present invention to rotate the wafer through the suction head.
  • FIG. 22 is a schematic diagram of the operation of the wafer pick-and-place mechanism to move the wafer onto the wafer tray when the present invention is in practical application.
  • FIG. 23 is a schematic diagram of the operation of the image grabbing component to confirm the wafer status on the wafer tray when the present invention is in practical application.
  • FIG. 24 is a schematic diagram of the operation of the wafer positioning member loading and unloading mechanism moving to the wafer tray to install the wafer positioning member when the present invention is in practical application.
  • 25 is a schematic diagram of a state in which the wafer positioning member is fixed on the wafer tray and the wafer positioning member loading and unloading mechanism moves back to the initial position when the present invention is actually applied.
  • the wafer pick-and-place mechanism places the wafer on the holder
  • the imaging unit corresponds to a local part of the edge of the wafer
  • the transposed component drives the wafer to rotate 360 degrees, so that the imaging unit can obtain a complete image of the peripheral side of the wafer;
  • the transposed component drives the wafer to the correct azimuth angle position
  • FIG. 10 An enlarged schematic diagram of the position of the wafer positioning member loading and unloading mechanism shown in Figure 10;
  • the main structure of the present invention includes: the first robot arm 1, the second robot arm 2, the main calibration mechanism 3 and the wafer calibration mechanism 4 and other parts; wherein the first robot arm 1 It is connected and driven by a control module (which can be a computer with arithmetic function, not shown) for multi-axis pivoting activities.
  • a control module which can be a computer with arithmetic function, not shown
  • An image capture is set on the movable end of the first robotic arm 1
  • the assembly 11 and a wafer positioning member loading and unloading mechanism 12 the image grabbing assembly 11 is provided with an upper image capturing element 111 (may be a CCD camera) with an illuminating light source, and the wafer positioning member loading and unloading mechanism 12 is provided with a positioning surface 121 ,
  • the positioning surface 121 (center) is provided with a positioning scale 122 (may be a hole or a scale), at least two relatively movable clamping members 123 are provided on the outer peripheral side of the positioning surface 121, and the wafer positioning member loading and unloading mechanism 12
  • a plurality of uniformly distributed laser light sources 124 are arranged on the peripheral side of the positioning surface 121, and the plurality of laser light sources 124 are respectively arranged at at least three points on the outer side of the positioning surface 121.
  • the second robotic arm 2 is connected and driven by the control module for multi-axis movement.
  • a wafer pick-and-place mechanism 21 is assembled on the movable end of the second robotic arm 2, and the wafer pick-and-place mechanism
  • An indicator scale 211 is provided on 21; in a feasible embodiment, the wafer pick-and-place mechanism 21 is a wafer chuck with vacuum suction.
  • the main correction mechanism 3 is arranged in the common range of movement of the first mechanical arm 1 and the second mechanical arm 2, and is connected and driven by the control module.
  • the main correction mechanism 3 is provided with a lower image capturing element with an illuminating light source 32 (can be a CCD camera), and at least one distance measuring laser light source 31 with a distance measuring function; a transparent sheet 33 is provided above the lower image capturing element 32, and a standard scale is provided in the center of the transparent sheet 33 331.
  • the wafer correction mechanism 4 is arranged in the movable range of the second mechanical arm 2 and is connected to and driven by the control module.
  • the wafer correction mechanism 4 is mainly composed of a holder 41, an image capturing unit 42, and a suction head 43. And the transposed component 44; wherein the bearing seat 41 is provided with a through hole 411 in the center, a ring flange 412 is provided on the peripheral side of the bearing seat 41, and a ring flange 412 is provided on the outer periphery of the ring flange 412 An inwardly extending guide slope 414 is protrudingly provided on the side, and a recess 413 is provided at a local position on the ring flange 412.
  • the supporting seat 41 is disposed above the plurality of legs 451 of a bracket module 45, and an upright lower frame 452 is provided on one side of the plurality of legs 451, and An upper side frame 453 extends upward from the other side of the leg 451.
  • the image capturing unit 42 is disposed above the supporting seat 41; in a feasible embodiment, the image capturing unit 42 is fixed to an end of the upper frame 453 away from the lower frame 452 and faces the bearing Seat 41, the image capturing unit 42 can be a CCD camera.
  • the suction head 43 is disposed under the receiving seat 41 corresponding to the through hole 411, and a plurality of vacuum suction holes 431 that can suck air are provided on the periphery of the suction head 43 on the side facing the through hole 411. .
  • the transposing assembly 44 is disposed under the bearing seat 41 and combined with the suction head 43; in a feasible embodiment, the transposing assembly 44 has a lifting module 441 and a pivoting module 442 And a sliding seat 443, wherein the sliding seat 443 can lift and slide along a plurality of guide rails 4431 vertically arranged on the lower side frame 452; the lifting module 441 is arranged on the lower side frame 452, and includes a lifting power source 4411 (may be a servo motor), an eccentric 4412 driven by the lifting power source 4411 to pivot, and a connecting rod 4413, the connecting rod 4413 is pivotally connected to the peripheral side of the eccentric 4412 at one end, and The other end of the connecting rod 4413 is pivotally connected to the sliding seat 443; the pivoting module 442 has a pivoting force source 4421 (may be a servo motor) disposed on the sliding seat 443, and the pivoting force source A pivot shaft 4422 is provided on the 4421, and the pivot shaft 4422 is coupled to the suction
  • the calibration method of the present invention includes: adjusting the lens focal length S11 of the upper image capturing element corresponding to the standard scale, comparing the position difference between the lower image capturing element and the upper image capturing element to obtain the standard scale S12, and establishing the first The coordinate of the reference point of a robotic arm S13, adjust the lens focal length of the lower imaging element corresponding to the positioning scale S14, compare the position of the lower imaging element to obtain the position difference between the positioning scale and the standard scale S15, establish the correct operation of the wafer positioning member loading and unloading mechanism Position S16, adjust the lens focal length of the lower image capturing element corresponding to the indicated scale S17, compare the lower image capturing element to obtain the position difference between the indicated scale position and the standard scale S18, establish the reference point coordinates of the second robot arm S19, and pick and place the wafer
  • the mechanism puts the wafer on the supporting seat S20, the imaging unit corresponds to the local part of the edge of the wafer S21, the transposition assembly drives the
  • the movable range of the first robot arm 1 and the second robot arm 2 is also provided with a wafer tray that can hold multiple wafers.
  • the carrier 5 is arranged on a sliding mechanism 53
  • the sliding mechanism 53 has a sliding seat 531
  • the sliding seat 531 is arranged on a plurality of sliding guide rails 532 extending in parallel
  • the sliding seat 531 is provided with a pivot seat 533 for supporting the tray 5; and an outer cover 52 is fixed above one end of the sliding guide 532, and the outer cover 52 is provided with a recessed notch 521.
  • the outer cover 52 When 5 is located at one end of the sliding guide 532, the outer cover 52 can be covered above the carrier plate 5, and the partial wafer plate 51 is exposed to the outside through the notch 521, and the control module is used to operate the sliding mechanism 53, the sliding seat 531 can drive the pivoting seat 533 and the tray 5 to slide between the two ends of the sliding guide 532, and the tray 5 can be driven to pivot via the pivoting seat 533.
  • the loading mechanism 6 can accommodate a plurality of wafers 60, and the loading mechanism 6 is provided On a lifting mechanism 61, the lifting mechanism 61 can be used to drive the material placement mechanism 6 to raise or lower the position; but in practical applications, the material placement mechanism 6 can also cooperate with other components to perform different operations and achieve different effects, and It is not limited to the content disclosed in the drawings.
  • the first mechanical arm 1 drives the image capturing assembly 11 to move above the main correction mechanism 3 (as shown in FIG. 6);
  • the main correction mechanism 3 uses the laser beam 311 generated by the distance measuring laser light source 31 to project to a predetermined position on the image capture assembly 11 (upper image capture element 111), and can measure the main correction mechanism 3 and the image capture assembly 11 (
  • the distance of the upper image capturing element 111) is adjusted, and the lens focal length of the upper image capturing element 111 corresponding to the standard scale 331 is adjusted to facilitate the upper image capturing element 111 to clearly obtain the position image of the standard scale 331 on the transparent sheet 33.
  • the lower image capturing element 32 (the lens focal length has been adjusted correctly) directly obtains the standard scale 331 on the transparent sheet 33 upward.
  • the position image forms a lower standard position image
  • the upper image capturing element 111 clearly obtains the position image of the standard scale 331 on the transparent sheet 33 downward to form an upper standard position image; the control module compares the lower standard position image The difference between the position image and the above standard position image.
  • the first mechanical arm 1 drives the image grabbing assembly 11 to move to an image capturing correction position, so that the lower standard position image and the upper standard position image overlap ,
  • the control module memorizes the coordinates of the imaging correction position (correct imaging range) of the image grabbing assembly 11 to form the reference point of the first robotic arm 1 (Origin) coordinates.
  • the first robot arm 1 drives the wafer positioning member loading and unloading mechanism 12 to move above the main correction mechanism 3 (as shown in FIG. 7);
  • the laser beam 311 generated by the main correction mechanism 3 using the distance measuring laser light source 31 is projected onto the positioning surface 121 of the wafer positioning member loading and unloading mechanism 12, so as to measure the distance between the main correction mechanism 3 and the positioning surface 121, and Adjust the lens focal length of the lower image capturing element 32 corresponding to the positioning scale 122 on the positioning surface 121.
  • the lower image capturing element 32 In the step of comparing the lower image capturing element to obtain the position difference between the positioning scale position and the standard scale S15, the lower image capturing element 32 directly looks upward to obtain an image of the standard scale 331 position on the transparent sheet 33 (that is, the lower standard position image) ); At the same time the lower image capturing element 32 upward (penetrating the transparent sheet 33) sees through the position image of the positioning scale 122 (hole or scale) on the positioning surface 121 to form a positioning position image, which is compared by the control module The difference between the next standard position image and the positioning position image.
  • the first robot arm 1 drives the wafer positioning member loading and unloading mechanism 12 to move to a loading and unloading correction position so that the lower standard position image overlaps the positioning position image ,
  • the control module memorizes the coordinates of the loading and unloading correction position (correct working position) of the wafer positioning member handling mechanism 12, and then calculates and memorizes the imaging correction The relative coordinates between the position and the loading and unloading correction position.
  • a reference point (origin) coordinate as the starting standard of the first robot arm 1 can be established, and the wafer positioning member loading and unloading mechanism 12 passes through
  • a relative coordinate between the wafer positioning member loading and unloading mechanism 12 and the image grabbing assembly 11 can be generated; therefore, the relationship between the wafer positioning member loading and unloading mechanism 12 and the image grabbing assembly 11 can be established.
  • the image grabbing assembly 11 with the image grabbing function can be used to first locate the correct position on the area to be operated (such as the wafer tray), and then the wafer positioning member loading and unloading mechanism 12
  • the relative coordinates can be used directly to quickly move to the correct position to facilitate subsequent processing operations.
  • the first robot arm 1 can drive the image grabbing The component 11 is moved to the top of the cover 52 (as shown in FIG.
  • the wafer disk 51 uses a plurality of (at least three) laser light sources 124 to generate laser beams of the same length, which can be projected on the wafer disk 51 together, so that the positioning surface 121 is aligned (parallel to) the wafer Disk 51 (as shown in FIG. 9), after unlocking the wafer positioning member 511 preset on the periphery of the wafer disk 51, use the clamping member 123 to take out the wafer positioning member 511 and maintain the clamping Hold state (as shown in Figure 10 and Figure 11).
  • the second robotic arm 2 drives the wafer pick-and-place mechanism 21 to move above the main correction mechanism 3 (as shown in FIG. 12);
  • the main calibration mechanism 3 uses the laser beam 311 generated by the ranging laser light source 31 to project onto the wafer pick-and-place mechanism 21 (indicating scale 211), so as to measure the main calibration mechanism 3 and the wafer pick-and-place mechanism 21 (indicating scale 211).
  • the distance of the scale 211) is used to adjust the lens focal length of the lower image capturing element 32 corresponding to the wafer pick-and-place mechanism 21 (indicating scale 211).
  • the comparison lower image capturing element obtains the position difference between the indicated scale position and the standard scale S18.
  • the lower image capturing element 32 can directly obtain the position image of the standard scale 331 on the transparent sheet 33 (that is, the lower standard position image); At the same time, the lower image capturing element 32 (penetrating the transparent sheet 33) sees through the position image of the indicator scale 211 on the wafer pick-and-place mechanism 21 to form an indicator position image, and then the control module compares the lower standard position The difference between the image and the image at the indicated position.
  • the second robot arm 2 drives the wafer pick-and-place mechanism 21 to move to a pick-and-place correction position so that the lower standard position image overlaps the indicated position image,
  • the control module memorizes the coordinates of the pick-and-place correction position (correct operating position) of the wafer pick-and-place mechanism 21
  • the reference point of the second robot arm 2 is formed (Origin) coordinates.
  • a reference point (origin) coordinate as the starting standard of the second robot arm 2 can be established, and the second robot arm 2 and The first robot arm 1 has the same reference point coordinates, so as to form an accurate relationship with each other.
  • the step S20 of the wafer pick-and-place mechanism placing the wafer on the holder is that after the wafer pick-and-place mechanism 21 is calibrated by the main calibration mechanism 3, the second mechanical arm 2 can drive the wafer pick-and-place
  • the mechanism 21 is moved to the loading mechanism 6 to take out the wafer 60 to be processed (as shown in FIG. 13, FIG. 14, FIG. 15 and FIG. 16), and moves the wafer 60 to the support of the wafer correction mechanism 4.
  • the sliding seat 443 and the pivoting module 442 are located at the initial position of the lowest point, and then the second robotic arm 2 is lowered to make the wafer pick-and-place mechanism 21 extend into the recess 413, Moreover, the wafer 60 can be accurately slid down to a preset position on the ring flange 412 of the supporting seat 41 through the guiding of the sliding guide slope 414, and then the wafer pick-and-place mechanism 21 can be moved downward from the wafer. 60.
  • the image capturing unit corresponds to the step of the wafer edge local part S21, so that the projection range D of the image capturing unit 42 of the wafer calibration mechanism 4 corresponds to the code and calibration mark (notch) position of the wafer 60, and obtains
  • the wafer 60 encodes image information such as the position of the mark (notch) for calibration (as shown in FIG. 17, FIG. 18, and FIG. 19).
  • the transposition assembly drives the wafer to rotate 360 degrees to enable the imaging unit to obtain a complete image of the wafer periphery side S22.
  • the lifting power source 4411 of the lifting module 441 operates to drive the eccentric wheel 4412 to rotate 180 degrees to make the connecting rod 4413 pushes the sliding seat 443 to a raised position, so that the suction head 43 contacts the wafer 60, and each vacuum suction hole 431 starts to suck the wafer 60 (as shown in FIG.
  • the pivot module 442 then drives the pivot shaft 4422 to rotate the suction head 43 and the wafer 60 through the pivotal force source 4421, and rotates a total of six times (total 360 degrees) in a one-sixth rotation to make the imaging unit 42 can sequentially obtain images of the complete periphery of the wafer 60 (as shown in FIG. 21), so as to check whether the wafer 60 is intact and undamaged.
  • the control module calculates the required wafer 60 according to the alignment mark (notch) position of the wafer 60 to be placed in the wafer tray 51
  • the pivot shaft 4422 drives the suction head 43 and the wafer 60 to rotate an angle, so that the calibration mark (notch) of the wafer 60 can be transferred to the correct direction position (as shown in Figure 21, namely Correct the notch direction of the wafer 60); then, each vacuum suction hole 431 stops pumping, and the lifting power source 4411 of the lifting module 441 is linked to the connecting rod 4413 through the eccentric wheel 4412 to descend and return to the initial position, so that The suction head 43 is separated from the wafer 60 and the wafer 60 falls back on the supporting seat 41.
  • the second robot arm 2 can drive the wafer pick-and-place mechanism 21 to remove the wafer with the correct azimuth angle. 60 is taken out from the supporting seat 41 of the wafer calibration mechanism 4, and placed on the wafer tray 51 of the carrier tray 5 (as shown in FIG. 22).
  • the first robot arm 1 drives the image grabbing assembly 11 to move to the carrier plate 5 (as shown in FIG. 23), and obtains the image of the wafer 60 placed in the previous step to confirm the wafer 60 Whether it is complete and placed in the correct position; then the first robot arm 1 drives the wafer positioning member loading and unloading mechanism 12 to combine the wafer positioning member 511 clamped by the clamping member 123 with the wafer tray 51 (As shown in FIG. 24), the wafer positioning member 511 is pressed against the periphery of the wafer 60 to form a positioning (as shown in FIG. 25).
  • the pivot seat 533 drives the tray 5 to rotate, so that the wafer tray 51 that has loaded the wafer 60 is turned under the cover 52, and the other wafer tray 51 without the wafer 60 is moved to The underside of the recess 521 of the cover 52 is exposed, so that the above-mentioned correction and wafer placement operations can be repeated in sequence, and different wafers 60 can be fixed on each wafer tray 51 respectively; finally, when the carrier plate 5 is mounted After each wafer tray 51 has loaded the wafer 60, the sliding seat 531 of the sliding mechanism 53 slides outward along the sliding guide 532, so as to move the tray 5 to the next process.
  • the calibration device and calibration method of the wafer and its transfer mechanism of the present invention can indeed calibrate different robot arms to establish a common reference point coordinate, establish the relative coordinates of different mechanisms on a single robot arm, and can adjust the crystal.
  • the effect of the circle to the correct displacement angle is indeed a novel and progressive invention.
  • An invention patent is filed according to law; however, the content of the above description is only a description of the preferred embodiments of the present invention. Any changes, modifications, alterations or equivalent replacements extended by the means and categories shall also fall within the protection scope of the present invention.

Abstract

一种晶圆及其转载机构的校准装置及校准方法，第一机械臂(1)上设有影像攫取组件(11)及晶圆定位件装卸机构(12)，第二机械臂(2)上设有晶圆取放机构(21)，第一机械臂(1)分别驱动影像攫取组件(11)、晶圆定位件装卸机构(12)移至主校正机构(3)，利用不同方向取得影像位置的差异校正其取像范围及作业位置，第二机械臂(2)驱动晶圆取放机构(21)至主校正机构(3)上，利用单向取得影像位置的差异校正其作业位置，并由晶圆取放机构(21)将晶圆(60)移置于晶圆校正机构(4)，以读取晶圆(60)资讯并调整晶圆(60)至正确方位角度。

Description

晶圆及其转载机构的校准装置及校准方法 技术领域
本发明是有关晶圆及其转载机构的校准装置及校准方法，尤指一种经由简单机构及操作，可分别校准不同机械臂建立共同的基准点并保持准确活动精度，且可调整晶圆至正确方向角度的校准装置及方法。
背景技术
一般的集成电路(integrated circuit,IC)的制造过程主要可分为：硅晶圆制造、集成电路制作以及集成电路封装等三大部分；当硅晶棒切割成晶圆后，还需要经过黄光、长晶、蚀刻、机械研磨等多道手续繁杂的流程，方能完成集成电路的制作，而在上述的制造过程中，晶圆在进行测试、清洗、蒸镀、干燥或浸泡有机溶剂等流程时，为能有效固定晶圆以便于加工，皆需将各晶圆先分别固定于一晶圆盘上，由各该晶圆盘分别承载各晶圆进行上述各流程的加工作业。
常见的晶圆盘基本结构，为一形状和承载面积略大于晶圆外径的盘体，于该盘体上方设有一可分离的环形框体，于该盘体与该环形框体之间界定出一容置晶圆的位置，且于该盘体的周缘设有多个扣合机构，利用该等扣合机构可夹固该环形框体，由该环形框体压制于该晶圆的周缘形成定位；而在实际应用时，为能同时处理较大量的晶圆，大多会将多个晶圆盘设置于一大面积的载盘上，利用该载盘可容置多个晶圆盘并同时移至各不同的加工程序，以有效增加整体的晶圆加工处理的效率。
随着自动化机械加工的逐渐普及，利用机械臂执行各晶圆在各晶圆盘上的取放作业，不但可节省大量人力，并可降低生产成本、增进加工效率，已为必然的趋势，但由于一般晶圆本身极为脆弱，且对于加工精密度的要求极高，因此，不但对于单一机械臂取放晶圆时的作业精确度有极高的要求，且在多个机械臂分别对相同晶圆进行不同作业时，亦必须具有相同精确度，否则，极易影响加工精度及成品质量，甚至于造成产品毁损的情形；故而，如何有效校准各机械臂，使其不但在单一机械臂进行不同加工动作时保持适当准确性，亦可使不同机械臂利用共同的基准点进行校准，而形成极佳的相对活动关联性，以便于在利用机械臂对晶圆进行不同的作业需求下，确保各机械臂的作业精确度，乃为各相关业者所亟待努力的一主要课题。
再者，在上述晶圆进行测试、清洗、干燥或浸泡有机溶剂等流程中，需对各晶圆进 行反复的输送及加工位置的取、放等动作，为能有效区分与掌握各批次生产的晶圆产品，大多会将各晶圆进行编号并产生条形码，以便于利用自动化设备(摄影机或读码机)快速读取并记录该晶圆的编号资讯；同时，目前一般对于大量的晶圆集体运送，大多采用晶圆匣来容置各晶圆，而该晶圆匣在移送的过程中，容易因摇晃或震动而使其内部的晶圆产生其存放方位(角度)的偏移，因此，在利用机械手臂将晶圆移置于待加工位置之前，必须先将该晶圆置放的角度及位置(即方位)作一校正，方能使各晶圆被准确地放置于待加工位置，以便于进行后续的加工作业。
然而，针对上述的作业需求，目前大多是以两组独立的装置分别进行该晶圆校准用标记(如：缺口)的方位校正，以及条形码编号读取等操作，如此一来，不但增加设备投资成本，亦造成整体的体积增加，并不符合经济效益；因此，若能将读取晶圆编号资讯及校正晶圆方位等需求整合于单一装置中，应可达到简化结构并减少整体体积的功效，乃为相关业者所可思考的另一改进方向。
有鉴于公知晶圆方向调整及载盘上各晶圆盘中取放晶圆的方式有上述限制需求，发明人乃针对该些缺点研究改进之道，终于有本发明产生。
发明内容
本发明的主要目的在于提供一种晶圆及其转载机构的校准装置及校准方法，于预设的第一机械臂和第二机械臂活动范围内分别建置主校正机构及晶圆校正机构，于该第一机械臂上设有一影像攫取组件及一晶圆定位件装卸机构，于该第二机械臂上设有一晶圆取放机构，该第一机械臂分别驱动该影像攫取组件及晶圆定位件装卸机构至该主校正机构上，校正其取像范围及作业位置的准确度，并记忆该晶圆定位件装卸机构与该影像攫取组件之间的相对位置坐标；该第二机械臂驱动该晶圆取放机构至该主校正机构上，校正其作业位置，并由该晶圆取放机构将晶圆移置于该晶圆校正机构上，通过该晶圆校正机构取得该晶圆的编码资讯，并可将该晶圆的方位调整至正确的角度方向，以利于移置至预设位置进行后续加工。
本发明的另一目的在于提供一种晶圆及其转载机构的校准装置及校准方法，其中该影像攫取组件具有一上取像元件，于该晶圆定位件装卸机构具有一定位刻度，该晶圆取放机构上设有指示刻度，该主校正机构具有一下取像元件，该下取像元件的上方设有一具有标准刻度的透明片；利用该第一机械臂驱动该影像攫取组件，使该上取像元件和该下取像元件分别对应该标准刻度取像，可校正该影像攫取组件的取像范围，并建立该第 一机械臂的基准点坐标；而该第一机械臂驱动该晶圆定位件装卸机构，由该下取像元件透视该定位刻度的位置影像，可校正该晶圆定位件装卸机构的作业位置，并计算出该影像攫取组件及晶圆定位件装卸机构之间的相对坐标，利用该第二机械臂驱动该晶圆取放机构，使该下取像元件透视该指示刻度的位置影像，可校正该晶圆取放机构的作业位置，建立该第二机械臂的基准点坐标；因此，利用该影像攫取组件先行定位于待作业区域上正确位置，可直接使该晶圆定位件装卸机构迅速移至正确位置并进行后续的作业，不但可简化操作程序，亦可保持单一机械臂上不同机构之间的作业精度，且由于该第一机械臂和第二机械臂皆是经由该主校正机构进行校准，因此具有相同基准点坐标，可使该第一机械臂和第二机械臂之间建立一精确的相互连系关系。
本发明的又一目的在于提供一种晶圆及其转载机构的校准装置及校准方法，其中该晶圆校正机构具有一供放置晶圆的承置座，该承置座中央设有一贯通的通孔，承置座的上方设有一取像单元，于该承置座对应于该通孔的下方设置一吸头，该吸头可受一转置机构驱动而通过该通孔吸合该晶圆，并带动该晶圆进行升降及枢转，以配合该取像单元完成晶圆条形码编号读取、晶圆边缘检查及晶圆的校准用标记校正调整等动作，其将晶圆条形码编号读取及晶圆的校准用标记校正调整等功能结合于单一组合结构中，不但可简化整体结构，亦可减少机构占用的空间。
为达成上述目的及功效，本发明所实行的技术手段包括：一种晶圆及其转载机构的校准装置，具有：一第一机械臂，连结并受一控制模组驱动，于该第一机械臂的活动端上设有一影像攫取组件及一晶圆定位件装卸机构，该影像攫取组件具有一上取像元件，该晶圆定位件装卸机构具有一定位面，于该定位面上设有一定位刻度；一第二机械臂，连结并受该控制模组驱动，于该第二机械臂的活动端上设有一晶圆取放机构，于该晶圆取放机构上设有一指示刻度；一主校正机构，设置于该第一机械臂和该第二机械臂的活动范围内，且连结并受该控制模组驱动，该主校正机构具有一下取像元件，于该下取像元件的上方设有一透明片，于该透明片上设有一作为定位基准的标准刻度。
依上述结构，其中该主校正机构于该下取像元件的旁侧设有一测距激光光源；该晶圆定位件装卸机构的定位面的周侧设有多个激光光源，多个该激光光源分别设置于该定位面的外旁侧至少三点。
依上述结构，其中还包括有一晶圆校正装置，该晶圆校正装置具有一供放置晶圆的承置座、一能攫取影像的取像单元、一能吸附晶圆的吸头及一转置机构；该取像单元设置于该承置座的上方，该吸头设置于该承置座的下方，该转置机构结合于该吸头的下方， 用以驱动该吸头带动该晶圆在该承置座上进行升降及枢转等动作。
依上述结构，其中该转置机构具有一升降组件及一枢转组件，该升降组件设有一升降动力源、一受该升降动力源驱动而枢转的偏心轮，以及以一端枢接于该偏心轮上的连杆，该枢转组件设有一枢转动力源，该枢转动力源设置于一可垂直滑动的滑座上，并连结于该连杆的另一端，于该枢转动力源上设有一枢转轴，该枢转轴结合于该吸头。
依上述结构，其中该承置座的中央具有一贯通的通孔，该吸头设置于对应该通孔的位置，且该承置座的顶侧周边设有环凸缘。
依上述结构，其中该环凸缘的外周侧凸设一向内延伸的导滑斜面。
依上述结构，其中该承置座于该环凸缘上的局部位置设有一凹部。
依上述结构，其中该承置座的旁侧设有一支架结构，该支架结构具有多个支撑于该承置座的下方的支脚，于所述支脚的一旁侧设有供该升降组件结合固定的下侧架，于所述支脚的另一旁侧向上延伸一上侧架，该取像单元固定于该上侧架的远离该下侧架的一端。
本发明所实行的技术手段另包括：一种应用前述校准装置的校准方法，至少具有：一比对下取像元件与上取像元件取得标准刻度的位置差异的步骤，由第一机械臂驱动影像攫取组件移至主校正机构的上方，由下取像元件直接取得透明片上的标准刻度的位置影像，形成一下标准位置影像，且上取像元件取得该透明片上的标准刻度的位置影像，形成一上标准位置影像；由控制模组比对该下标准位置影像与该上标准位置影像之间差异；一建立第一机械臂的基准点坐标的步骤，由该第一机械臂驱动该影像攫取组件移至一取像校正位置，使该下标准位置影像与该上标准位置影像相叠合，借以校正该影像攫取组件取像范围，并由该控制模组记忆该影像攫取组件的取像校正位置的坐标，以建立该第一机械臂的基准点坐标；一比对下取像元件取得定位刻度位置与标准刻度的位置差异的步骤，由该第一机械臂驱动晶圆定位件装卸机构移至该主校正机构的上方，由该下取像元件穿透该透明片透视定位面上的定位刻度的位置影像，形成一定位位置影像，由该控制模组比对该下标准位置影像与该定位位置影像之间差异；一建立晶圆定位件装卸机构正确作业位置的步骤，由该第一机械臂驱动该晶圆定位件装卸机构移至一装卸校正位置，使该下标准位置影像与该定位位置影像重叠，借以校正该晶圆定位件装卸机构的作业位置，并由该控制模组记忆该晶圆定位件装卸机构的装卸校正位置的坐标，再计算并记忆该取像校正位置及装卸校正位置之间的相对坐标；一比对下取像元件取得指示刻度位置与标准刻度的位置差异的步骤，由第二机械臂驱动该晶圆取放机构移至该主校正 机构的上方，由该下取像元件穿透该透明片透视该晶圆取放机构上的指示刻度的位置影像，形成一指示位置影像，然后由该控制模组比对该下标准位置影像与该指示位置影像之间差异；一建立第二机械臂的基准点坐标的步骤，由该第二机械臂驱动该晶圆取放机构移至一取放校正位置，使该下标准位置影像与该指示位置影像重叠，借以校正该晶圆取放机构的作业位置，并由该控制模组记忆该晶圆取放机构的取放校正位置的坐标，以建立该第二机械臂的基准点坐标，且使该第一机械臂和该第二机械臂具有相同的基准点坐标；一晶圆取放机构将晶圆置于承置座上的步骤，由该第二机械臂驱动该晶圆取放机构取出晶圆，并将该晶圆移至晶圆校正机构的承置座的上方；一取像单元对应于晶圆边缘局部部位的步骤，使该晶圆校正机构的取像单元的投射范围对应于该晶圆的编码及校准用标记(可为一缺口)位置，并取得该晶圆编码及校准用标记(缺口)位置等影像资讯；一转置组件驱动晶圆转动360度，使取像单元取得晶圆周侧完整影像的步骤，由该转置组件驱动吸头吸附该晶圆，并带动该晶圆转动一圈，使该取像单元可取得该晶圆完整周缘的影像，借以检查确认该晶圆是否完整无损；一转置组件驱动晶圆转至正确方位角度位置的步骤，由该控制模组依所需调整的角度，由该转置组件经由该吸头带动该晶圆转动，使其校准用标记(缺口)可转移至正确的角度方向，再使该吸头脱离该晶圆，该晶圆回落于该承置座上。
依上述方法，其中在执行该比对下取像元件与上取像元件取得标准刻度的位置差异的步骤之前，预先执行一调整上取像元件对应于标准刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该影像攫取组件的标准刻度部位，可测量该主校正机构与该标准刻度的距离，并调整该上取像元件的镜头焦距，以利于该上取像元件清晰取得该透明片上的标准刻度的位置影像。
依上述方法，其中在执行该比对下取像元件取得定位刻度位置与标准刻度的位置差异的步骤之前，预先执行一调整下取像元件对应于定位刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该定位面的定位刻度上，借以测量该主校正机构与该晶圆定位件装卸机构的距离，并调整该下取像元件的镜头焦距，以利于该下取像元件清晰取得该晶圆定位件装卸机构的定位刻度的位置影像。
依上述方法，其中在执行该比对下取像元件取得指示刻度位置与标准刻度的位置差异的步骤之前，预先执行一调整下取像元件对应于指示刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该晶圆取放机的指示刻度构上，借以测量该主校正机构与该指示刻度的距离，以调整该下取像元件的镜头焦距，以利于该 下取像元件清晰取得该晶圆取放机的指示刻度的位置影像。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1是本发明的整体结构示意图。
图2是本发明的主校正机构的局部放大示意图。
图3是本发明的晶圆校正机构的局部放大示意图。
图4是本发明的转置组件的立体结构分解图。
图5是本发明的校准方法流程图。
图6是本发明的影像攫取组件于主校正机构的上方的状态示意图。
图7是本发明的晶圆定位件装卸机构于主校正机构的上方的状态示意图。
图8是本发明于实际应用时，影像攫取组件于载盘的上方正确对应于晶圆盘的状态示意图。
图9是本发明于实际应用时，晶圆定位件装卸机构移至晶圆盘上的状态示意图。
图10是本发明于实际应用时，晶圆定位件装卸机构取下晶圆定位件的状态示意图。
图11是图10的A部位的局部放大示意图。
图12是本发明的晶圆取放机构于主校正机构的上方的状态示意图。
图13是本发明的晶圆取放机构由置料机构中取出晶圆的状态示意图。
图14是本发明的晶圆取放机构将晶圆移置于晶圆校正机构上的动作示意图。
图15是图14的局部侧视平面图。
图16是图15的B部位放大示意图。
图17是本发明的晶圆置于承置座上，且取像单元取得晶圆影像的动作示意图。
图18是图17的局部侧视平面图。
图19是图18的C部位放大示意图。
图20是本发明的升降模组经由吸头顶升晶圆的动作示意图。
图21是本发明的枢转模组经由吸头转动晶圆的动作示意图。
图22是本发明于实际应用时，晶圆取放机构将晶圆移置于晶圆盘上的动作示意图。
图23是本发明于实际应用时，影像攫取组件确认晶圆盘上晶圆状态的动作示意图。
图24是本发明于实际应用时，晶圆定位件装卸机构移至晶圆盘上装设晶圆定位件的动作示意图。
图25是本发明于实际应用时，晶圆定位件固定于晶圆盘上且晶圆定位件装卸机构移回初始位置的状态示意图。
附图标号说明：
1、第一机械臂；
11、影像攫取组件；
111、上取像元件；
12、晶圆定位件装卸机构；
121、定位面；
122、定位刻度；
123、夹持件
124、激光光源；
2、第二机械臂；
21、晶圆取放机构；
211、指示刻度；
3、主校正机构
31、测距激光光源
311、激光光束；
32、下取像元件；
33、透明片；
331、标准刻度；
4、晶圆校正机构；
41、承置座；
411、通孔；
412、环凸缘；
413、凹部；
414、导滑斜面；
42、取像单元；
43、吸头；
431、真空吸孔；
44、转置组件；
441、升降模组；
4411、升降动力源；
4412、偏心轮；
4413、连杆；
442、枢转模组；
4421、枢转动力源；
4422、枢转轴；
443、滑座；
4431、导轨；
45、支架模组；
451、支脚；
452、下侧架；
453、上侧架；
5、载盘；
51、晶圆盘；
511、晶圆定位件；
52、外罩；
521、凹缺口；
53、滑移机构；
531、滑移座；
532、滑移导轨；
533、枢转座；
6、置料机构；
60、晶圆；
61、升降机构；
S11、调整上取像元件对应于标准刻度的镜头焦距；
S12、比对下取像元件与上取像元件取得标准刻度的位置差异；
S13、建立第一机械臂的基准点坐标；
S14、调整下取像元件对应于定位刻度的镜头焦距；
S15、比对下取像元件取得定位刻度位置与标准刻度的位置差异；
S16、建立晶圆定位件装卸机构正确作业位置；
S17、调整下取像元件对应于指示刻度的镜头焦距；
S18、比对下取像元件取得指示刻度位置与标准刻度的位置差异；
S19、建立第二机械臂的基准点坐标；
S20、晶圆取放机构将晶圆置于承置座上；
S21、取像单元对应于晶圆边缘局部部位；
S22、转置组件驱动晶圆转动360度，使取像单元取得晶圆周侧完整影像；
S23、转置组件驱动晶圆转至正确方位角度位置；
A、图10的晶圆定位件装卸机构部位放大示意；
B、图15的转置组件部位放大示意；
C、图18的转置组件部位放大示意；
D、取像单元的投射范围。
具体实施方式
为了对本发明的技术方案、目的和效果有更清楚的理解，现结合附图说明本发明的具体实施方式。
请参图1至图4所示，可知本发明的主要结构包括：第一机械臂1、第二机械臂2、主校正机构3及晶圆校正机构4等部份；其中该第一机械臂1连结并受一控制模组(可为一具有运算功能的计算机，未绘出)驱动，以供进行多轴枢转活动，于该第一机械臂1的活动端上分别组设一影像攫取组件11及一晶圆定位件装卸机构12，该影像攫取组件11设有一具有照明光源的上取像元件111(可为一CCD摄影机)，该晶圆定位件装卸机构12上设有一定位面121，该定位面121(中央)设有一定位刻度122(可为一孔洞或刻度)，于该定位面121的外周侧至少设有两可相对活动的夹持件123，该晶圆定位件装卸机构12于该定位面121的周侧设有多个均匀分布的激光光源124，多个该激光光源124分别设置于该定位面121的外旁侧至少三点。
该第二机械臂2连结并受该控制模组驱动，以供进行多轴活动，于该第二机械臂2的活动端上组设一晶圆取放机构21，于该晶圆取放机构21上设有一指示刻度211；在一个可行的实施例中，该晶圆取放机构21为一具有真空吸力的晶圆吸盘。
该主校正机构3设置于该第一机械臂1和第二机械臂2的共同活动范围内，且连结并受该控制模组驱动，该主校正机构3设有一具有照明光源的下取像元件32(可为一 CCD摄影机)，以及至少一具有量测距离功能的测距激光光源31；于该下取像元件32的上方设有一透明片33，于该透明片33的中央设有一标准刻度331。
该晶圆校正机构4设置于该第二机械臂2的活动范围内，且连结并受该控制模组驱动，该晶圆校正机构4主要由承置座41、取像单元42、吸头43及转置组件44等部分组成；其中该承置座41于中央设有一贯通的通孔411，于该承置座41的周侧环设有一环凸缘412，于该环凸缘412的外周侧凸设一向内延伸的导滑斜面414，且于该环凸缘412上的局部位置设有一凹部413。
在一个可行的实施例中，该承置座41设置于一支架模组45的多个支脚451的上方，于多个该支脚451的一旁侧设有一直立的下侧架452，于多个该支脚451的另一旁侧向上延伸一上侧架453。
该取像单元42设置于该承置座41的上方；在一个可行的实施例中，该取像单元42固定于该上侧架453的远离该下侧架452的一端，且朝向该承置座41，该取像单元42可为一CCD摄影机。
该吸头43设置于该承置座41的对应于该通孔411的下方，于该吸头43的朝向该通孔411的一侧的周缘设有多个能抽吸空气的真空吸孔431。
该转置组件44设置于该承置座41的下方，并与该吸头43相结合；在一个可行的实施例中，该转置组件44具有一升降模组441、一枢转模组442及一滑座443，其中该滑座443可沿垂直设置于该下侧架452上的多个导轨4431升降滑动；该升降模组441设置于该下侧架452上，其包括有一升降动力源4411(可为一伺服马达)、一受该升降动力源4411驱动而枢转的偏心轮4412，以及以一连杆4413，该连杆4413以一端枢接于该偏心轮4412的周侧，且该连杆4413的另一端枢接于该滑座443；该枢转模组442具有一设置于该滑座443上的枢转动力源4421(可为一伺服马达)，于该枢转动力源4421上设有一枢转轴4422，且该枢转轴4422结合于该吸头43。
请参图5所示，可知本发明的校准方法包括：调整上取像元件对应于标准刻度的镜头焦距S11、比对下取像元件与上取像元件取得标准刻度的位置差异S12、建立第一机械臂的基准点坐标S13、调整下取像元件对应于定位刻度的镜头焦距S14、比对下取像元件取得定位刻度位置与标准刻度的位置差异S15、建立晶圆定位件装卸机构正确作业位置S16、调整下取像元件对应于指示刻度的镜头焦距S17、比对下取像元件取得指示刻度位置与标准刻度的位置差异S18、建立第二机械臂的基准点坐标S19、晶圆取放机构将晶圆置于承置座上S20、取像单元对应于晶圆边缘局部部位S21、转置组件驱动晶 圆转动360度，使取像单元取得晶圆周侧完整影像S22、转置组件驱动晶圆转至正确方位角度位置S23等步骤；以下即配合图6至图25，分别说明上述各步骤，以及一实际可行的应用实施例：
为便于说明，在图6至图25中所举的应用实施例中，于上述结构中该第一机械臂1和第二机械臂2的活动范围内还设有一可承置多个晶圆盘51的载盘5，该载盘5设置于一滑移机构53上，该滑移机构53具有一滑移座531，该滑移座531设置于多个平行延伸的滑移导轨532上，于该滑移座531上设有一承置该载盘5的枢转座533；而于该滑移导轨532的一端上方固定设有一外罩52，该外罩52上设有一凹缺口521，当该载盘5位于该滑移导轨532的一端时，可使该外罩52遮盖于该载盘5的上方，并使局部晶圆盘51经由该凹缺口521对外裸露，利用该控制模组操作该滑移机构53，可使该滑移座531带动该枢转座533及载盘5于该滑移导轨532的两端之间滑移，并可经由该枢转座533驱动该载盘5枢转。
而于该第二机械臂2的活动范围内还设有一置料机构6(可为一置料匣)，该置料机构6内部可供收容多个晶圆60，且该置料机构6设置于一升降机构61上，利用该升降机构61可驱动该置料机构6升高或降低位置；但在实际应用时，该置料机构6亦可配合其它组件执行不同操作并达成不同功效，并不局限于附图所揭露的内容。
首先，该调整上取像元件对应于标准刻度的镜头焦距S11的步骤，由该第一机械臂1驱动该影像攫取组件11移至该主校正机构3的上方(如图6所示)；由该主校正机构3利用测距激光光源31所产生的激光光束311投射至该影像攫取组件11(上取像元件111)上预设部位，可测量该主校正机构3与该影像攫取组件11(上取像元件111)的距离，并调整该上取像元件111对应于该标准刻度331的镜头焦距；以利于该上取像元件111清晰取得该透明片33上的标准刻度331的位置影像。
该比对下取像元件与上取像元件取得标准刻度的位置差异S12的步骤，由该下取像元件32(镜头焦距已预先调整正确)直接向上取得该透明片33上的标准刻度331的位置影像，形成一下标准位置影像，且该上取像元件111向下清晰取得该透明片33上的标准刻度331的位置影像，形成一上标准位置影像；由该控制模组比对该下标准位置影像与该上标准位置影像之间差异。
该建立第一机械臂的基准点坐标S13的步骤，由该第一机械臂1驱动该影像攫取组件11移至一取像校正位置，使该下标准位置影像与该上标准位置影像相叠合，借以校正该影像攫取组件11的取像范围，并由该控制模组记忆该影像攫取组件11的取像校正 位置(正确取像范围)的坐标，以形成该第一机械臂1的基准点(原点)坐标。
该调整下取像元件对应于定位刻度的镜头焦距S14的步骤，由该第一机械臂1驱动该晶圆定位件装卸机构12移至该主校正机构3的上方(如图7所示)；由该主校正机构3利用测距激光光源31所产生的激光光束311投射至该晶圆定位件装卸机构12的定位面121上，借以测量该主校正机构3与该定位面121的距离，并调整该下取像元件32对应于该定位面121上定位刻度122的镜头焦距。
该比对下取像元件取得定位刻度位置与标准刻度的位置差异S15的步骤，由该下取像元件32直接向上观视取得该透明片33上标准刻度331位置影像(即该下标准位置影像)；同时该下取像元件32向上(穿透该透明片33)透视该定位面121上该定位刻度122(孔洞或刻度)的位置影像，形成一定位位置影像，由该控制模组比对该下标准位置影像与该定位位置影像之间差异。
该建立晶圆定位件装卸机构正确作业位置S16的步骤，由该第一机械臂1驱动该晶圆定位件装卸机构12移至一装卸校正位置，使该下标准位置影像与该定位位置影像重叠，借以校正该晶圆定位件装卸机构12的作业位置，并由该控制模组记忆该晶圆定位件装卸机构12的装卸校正位置(正确作业位置)的坐标，再计算并记忆该取像校正位置及装卸校正位置之间的相对坐标。
在上述各步骤中，该影像攫取组件11经由该主校正机构3校准后，可建立一作为第一机械臂1起始标准的基准点(原点)坐标，而该晶圆定位件装卸机构12经由该主校正机构3校准后，可产生一该晶圆定位件装卸机构12与该影像攫取组件11之间的相对坐标；因此，可借以建立该晶圆定位件装卸机构12与影像攫取组件11之间的相对位置关系，在后续的作业中，可利用具有影像攫取功能的该影像攫取组件11先行定位于待作业区域(如：晶圆盘)上正确位置，再由该晶圆定位件装卸机构12直接利用该相对坐标可快速移至该正确位置，以便于进行后续的加工作业。
请参图8至图11所示，当该晶圆定位件装卸机构12与该影像攫取组件11经由该主校正机构3校准后，在实际应用时，该第一机械臂1可驱动该影像攫取组件11移至该外罩52的上方(如图8所示)，并朝向对应于该凹缺口521的晶圆盘51取像，借以检视该晶圆盘51上的状况(是否有残留的晶圆60碎屑或破片)并利用影像使该影像攫取组件11定位于正确位置；再由该控制模组参考该相对位置坐标，由该第一机械臂1驱动该晶圆定位件装卸机构12接近该晶圆盘51，利用多个(至少三个)该激光光源124所产生相同长度的激光光束，可共同投射于该晶圆盘51上，借以使该定位面121对准 (平行于)该晶圆盘51(如图9所示)，再将该晶圆盘51的周缘预先设置的晶圆定位件511解除锁掣之后，利用该夹持件123取出该晶圆定位件511，并维持夹持状态(如图10和图11所示)。
该调整下取像元件对应于指示刻度的镜头焦距S17的步骤，由该第二机械臂2驱动该晶圆取放机构21移至该主校正机构3的上方(如图12所示)；由该主校正机构3利用测距激光光源31所产生的激光光束311投射至该晶圆取放机构21(指示刻度211)上，借以测量该主校正机构3与该晶圆取放机构21(指示刻度211)的距离，以调整该下取像元件32对应于该晶圆取放机构21(指示刻度211)的镜头焦距。
该比对下取像元件取得指示刻度位置与标准刻度的位置差异S18上午步骤，由该下取像元件32可直接取得该透明片33上标准刻度331位置影像(即该下标准位置影像)；同时该下取像元件32(穿透该透明片33)透视该晶圆取放机构21上该指示刻度211的位置影像，形成一指示位置影像，然后由该控制模组比对该下标准位置影像与该指示位置影像之间差异。
该建立第二机械臂的基准点坐标S19的步骤，由该第二机械臂2驱动该晶圆取放机构21移至一取放校正位置，使该下标准位置影像与该指示位置影像重叠，借以校正该晶圆取放机构21的作业位置，并由该控制模组记忆该晶圆取放机构21的取放校正位置(正确作业位置)的坐标，形成该第二机械臂2的基准点(原点)坐标。
在上述个步骤中，该晶圆取放机构21经由该主校正机构3校准后，可建立一作为第二机械臂2起始标准的基准点(原点)坐标，且该第二机械臂2与该第一机械臂1具有相同的基准点坐标，借以形成一相互准确连系的关系。
该晶圆取放机构将晶圆置于承置座上S20的步骤，为当该晶圆取放机构21经由该主校正机构3校准后，该第二机械臂2可驱动该晶圆取放机构21移至该置料机构6中取出待加工的晶圆60(如图13、图14、图15和图16所示)，并将该晶圆60移至该晶圆校正机构4的承置座41的上方；此时，该滑座443及枢转模组442位于最低点的初始位置，然后，第二机械手臂2下降，使该晶圆取放机构21伸入该凹部413中，且该晶圆60经由该导滑斜面414的导引，可精确地滑落于该承置座41的环凸缘412上预设位置，再使该晶圆取放机构21向下脱离该晶圆60。
该取像单元对应于晶圆边缘局部部位S21的步骤，使该晶圆校正机构4的取像单元42的投射范围D对应于该晶圆60的编码及校准用标记(缺口)位置，并取得该晶圆60编码及校准用标记(缺口)位置等影像资讯(如图17、图18和图19所示)。
该转置组件驱动晶圆转动360度，使取像单元取得晶圆周侧完整影像S22的步骤，该升降模组441的升降动力源4411动作，驱动该偏心轮4412转动180度，使该连杆4413推动该滑座443至上升位置，使该吸头43接触该晶圆60，且各真空吸孔431开始抽气以吸附该晶圆60(如图20所示)；而该枢转模组442随后经由该枢转动力源4421驱动该枢转轴4422带动该吸头43及晶圆60转动，以一次转动六分之一的方式，总共转动六次(共360度)，使该取像单元42可依序取得该晶圆60完整周缘的影像(如图21所示)，借以检查确认该晶圆60是否完整无损。
该转置组件驱动晶圆转至正确方位角度位置S23的步骤，由该控制模组依据该欲置入晶圆盘51的晶圆60的校准用标记(缺口)位置计算该晶圆60所需调整的角度，再由该枢转轴4422带动该吸头43及晶圆60转动一角度，使该晶圆60的校准用标记(缺口)可转移至正确的方向位置(如图21所示，即校正该晶圆60的缺口方向)；然后，各真空吸孔431停止抽气，且该升降模组441的升降动力源4411经由该偏心轮4412连动该连杆4413下降回复至初始位置，使该吸头43脱离该晶圆60，且该晶圆60回落于该承置座41上。
请参图22至图25所示，当该晶圆60完成前述校正程序后，在实际应用时，可由该第二机械臂2驱动该晶圆取放机构21将该具有正确方位角度的晶圆60由该晶圆校正机构4的承置座41上取出，并放置于该载盘5的该晶圆盘51上(如图22所示)。
再使该第一机械臂1驱动该影像攫取组件11移至该载盘5上(如图23所示)，并取得前一步骤所放置的该晶圆60的影像，以确认该晶圆60是否完整且是否被放置于正确位置；再由该第一机械臂1驱动该晶圆定位件装卸机构12将该夹持件123所夹持的该晶圆定位件511结合于该晶圆盘51上(如图24所示)，通过该晶圆定位件511压合于该晶圆60的周缘形成定位(如图25所示)。
然后，该枢转座533驱动该载盘5转动，使该已承载晶圆60的该晶圆盘51转至该外罩52的下方，且另一未放置晶圆60的晶圆盘51移至该外罩52的凹缺口521的下方形成裸露，以便于依序重复上述校正及放置晶圆等动作，可将不同晶圆60分别固定于各晶圆盘51上；最后，当该载盘5的各晶圆盘51皆已承载晶圆60之后，该滑移机构53的滑移座531沿该滑移导轨532向外滑动，以便于将该载盘5移至下一工序。
综合以上所述，本发明的晶圆及其转载机构的校准装置及校准方法确可达成分别校准不同机械臂建立共同的基准点坐标、建立单一机械臂上不同机构的相对坐标，且可调整晶圆至正确移置角度的功效，实为一具新颖性及进步性的发明，依法提出申请发明专 利；但上述说明的内容，仅为本发明的较佳实施例说明，举凡依本发明的技术手段与范畴所延伸的变化、修饰、改变或等效置换者，亦皆应落入本发明的保护范围内。

Claims (16)

  1. 一种晶圆及其转载机构的校准装置，其中，该晶圆及其转载机构的校准装置包括：
    一第一机械臂，连结并受一控制模组驱动，于该第一机械臂的活动端上设有一影像攫取组件及一晶圆定位件装卸机构，该影像攫取组件具有一上取像元件，该晶圆定位件装卸机构具有一定位面，于该定位面上设有一定位刻度；
    一第二机械臂，连结并受该控制模组驱动，于该第二机械臂的活动端上设有一晶圆取放机构，于该晶圆取放机构上设有一指示刻度；
    一主校正机构，设置于该第一机械臂和该第二机械臂的活动范围内，且连结并受该控制模组驱动，该主校正机构具有一下取像元件，于该下取像元件的上方设有一透明片，于该透明片上设有一作为定位基准的标准刻度。
  2. 如权利要求1所述的晶圆及其转载机构的校准装置，其中该主校正机构于该下取像元件的旁侧设有一测距激光光源；该晶圆定位件装卸机构的定位面的周侧设有多个激光光源，多个该激光光源分别设置于该定位面的外旁侧至少三点。
  3. 如权利要求1或2所述的晶圆及其转载机构的校准装置，其中还包括有一晶圆校正装置，该晶圆校正装置具有一供放置晶圆的承置座、一能攫取影像的取像单元、一能吸附晶圆的吸头及一转置机构；该取像单元设置于该承置座的上方，该吸头设置于该承置座的下方，该转置机构结合于该吸头的下方，用以驱动该吸头带动该晶圆在该承置座上进行升降及枢转等动作。
  4. 如权利要求3所述的晶圆及其转载机构的校准装置，其中该转置机构具有一升降组件及一枢转组件，该升降组件设有一升降动力源、一受该升降动力源驱动而枢转的偏心轮，以及以一端枢接于该偏心轮上的连杆，该枢转组件设有一枢转动力源，该枢转动力源设置于一可垂直滑动的滑座上，并连结于该连杆的另一端，于该枢转动力源上设有一枢转轴，该枢转轴结合于该吸头。
  5. 如权利要求3所述的晶圆及其转载机构的校准装置，其中该承置座的中央具有一贯通的通孔，该吸头设置于对应该通孔的位置，且该承置座的顶侧周边设有环凸缘。
  6. 如权利要求5所述的晶圆及其转载机构的校准装置，其中该环凸缘的外周侧凸设一向内延伸的导滑斜面。
  7. 如权利要求6所述的晶圆及其转载机构的校准装置，其中该承置座于该环凸缘上的局部位置设有一凹部。
  8. 如权利要求4所述的晶圆及其转载机构的校准装置，其中该承置座的旁侧设有一支架结构，该支架结构具有多个支撑于该承置座的下方的支脚，于所述支脚的一旁侧设有供该升降组件结合固定的下侧架，于所述支脚的另一旁侧向上延伸一上侧架，该取像单元固定于该上侧架的远离该下侧架的一端。
  9. 一种应用前述权利要求2所述的校准装置的校准方法，其中，该校准方法至少包括：
    一比对下取像元件与上取像元件取得标准刻度的位置差异的步骤，由第一机械臂驱动影像攫取组件移至主校正机构的上方，由下取像元件直接取得透明片上的标准刻度的位置影像，形成一下标准位置影像，且上取像元件取得该透明片上的标准刻度的位置影像，形成一上标准位置影像；由控制模组比对该下标准位置影像与该上标准位置影像之间差异；
    一建立第一机械臂的基准点坐标的步骤，由该第一机械臂驱动该影像攫取组件移至一取像校正位置，使该下标准位置影像与该上标准位置影像相叠合，借以校正该影像攫取组件取像范围，并由该控制模组记忆该影像攫取组件的取像校正位置的坐标，以建立该第一机械臂的基准点坐标；
    一比对下取像元件取得定位刻度位置与标准刻度的位置差异的步骤，由该第一机械臂驱动晶圆定位件装卸机构移至该主校正机构的上方，由该下取像元件穿透该透明片透视定位面上的定位刻度的位置影像，形成一定位位置影像，由该控制模组比对该下标准位置影像与该定位位置影像之间差异；
    一建立晶圆定位件装卸机构正确作业位置的步骤，由该第一机械臂驱动该晶圆定位件装卸机构移至一装卸校正位置，使该下标准位置影像与该定位位置影像重叠，借以校正该晶圆定位件装卸机构的作业位置，并由该控制模组记忆该晶圆定位件装卸机构的装卸校正位置的坐标，再计算并记忆该取像校正位置及装卸校正位置之间的相对坐标；
    一比对下取像元件取得指示刻度位置与标准刻度的位置差异的步骤，由第二机械臂驱动该晶圆取放机构移至该主校正机构的上方，由该下取像元件穿透该透明片透视该晶圆取放机构上的指示刻度的位置影像，形成一指示位置影像，然后由该控制模组比对该下标准位置影像与该指示位置影像之间差异；
    一建立第二机械臂的基准点坐标的步骤，由该第二机械臂驱动该晶圆取放机构移至一取放校正位置，使该下标准位置影像与该指示位置影像重叠，借以校正该晶圆取放机构的作业位置，并由该控制模组记忆该晶圆取放机构的取放校正位置的坐标，以建立 该第二机械臂的基准点坐标，且使该第一机械臂和该第二机械臂具有相同的基准点坐标。
  10. 如权利要求9所述的校准方法，其中在执行该比对下取像元件与上取像元件取得标准刻度的位置差异的步骤之前，预先执行一调整上取像元件对应于标准刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该影像攫取组件的标准刻度部位，可测量该主校正机构与该标准刻度的距离，并调整该上取像元件的镜头焦距，以利于该上取像元件清晰取得该透明片上的标准刻度的位置影像。
  11. 如权利要求9所述的校准方法，其中在执行该比对下取像元件取得定位刻度位置与标准刻度的位置差异的步骤之前，预先执行一调整下取像元件对应于定位刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该定位面的定位刻度上，借以测量该主校正机构与该晶圆定位件装卸机构的距离，并调整该下取像元件的镜头焦距，以利于该下取像元件清晰取得该晶圆定位件装卸机构的定位刻度的位置影像。
  12. 如权利要求9所述的校准方法，其中在执行该比对下取像元件取得指示刻度位置与标准刻度的位置差异的步骤之前，预先执行一调整下取像元件对应于指示刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该晶圆取放机的指示刻度构上，借以测量该主校正机构与该指示刻度的距离，以调整该下取像元件的镜头焦距，以利于该下取像元件清晰取得该晶圆取放机的指示刻度的位置影像。
  13. 一种应用前述权利要求3所述的校准装置的校准方法，其中，该校准方法至少包括：
    一比对下取像元件与上取像元件取得标准刻度的位置差异的步骤，由第一机械臂驱动影像攫取组件移至主校正机构的上方，由下取像元件直接取得透明片上的标准刻度的位置影像，形成一下标准位置影像，且上取像元件取得该透明片上的标准刻度的位置影像，形成一上标准位置影像；由控制模组比对该下标准位置影像与该上标准位置影像之间差异；
    一建立第一机械臂的基准点坐标的步骤，由该第一机械臂驱动该影像攫取组件移至一取像校正位置，使该下标准位置影像与该上标准位置影像相叠合，借以校正该影像攫取组件取像范围，并由该控制模组记忆该影像攫取组件的取像校正位置的坐标，以建立该第一机械臂的基准点坐标；
    一比对下取像元件取得定位刻度位置与标准刻度的位置差异的步骤，由该第一机 械臂驱动晶圆定位件装卸机构移至该主校正机构的上方，由该下取像元件穿透该透明片透视定位面上的定位刻度的位置影像，形成一定位位置影像，由该控制模组比对该下标准位置影像与该定位位置影像之间差异；
    一建立晶圆定位件装卸机构正确作业位置的步骤，由该第一机械臂驱动该晶圆定位件装卸机构移至一装卸校正位置，使该下标准位置影像与该定位位置影像重叠，借以校正该晶圆定位件装卸机构的作业位置，并由该控制模组记忆该晶圆定位件装卸机构的装卸校正位置的坐标，再计算并记忆该取像校正位置及装卸校正位置之间的相对坐标；
    一比对下取像元件取得指示刻度位置与标准刻度的位置差异的步骤，由第二机械臂驱动该晶圆取放机构移至该主校正机构的上方，由该下取像元件穿透该透明片透视该晶圆取放机构上的指示刻度的位置影像，形成一指示位置影像，然后由该控制模组比对该下标准位置影像与该指示位置影像之间差异；
    一建立第二机械臂的基准点坐标的步骤，由该第二机械臂驱动该晶圆取放机构移至一取放校正位置，使该下标准位置影像与该指示位置影像重叠，借以校正该晶圆取放机构的作业位置，并由该控制模组记忆该晶圆取放机构的取放校正位置的坐标，以建立该第二机械臂的基准点坐标，且使该第一机械臂和该第二机械臂具有相同的基准点坐标；
    一晶圆取放机构将晶圆置于承置座上的步骤，由该第二机械臂驱动该晶圆取放机构取出晶圆，并将该晶圆移至晶圆校正机构的承置座的上方；
    一取像单元对应于晶圆边缘局部部位的步骤，使该晶圆校正机构的取像单元的投射范围对应于该晶圆的编码及校准用标记位置，并取得该晶圆编码及校准用标记位置等影像资讯；
    一转置组件驱动晶圆转动360度，使取像单元取得晶圆周侧完整影像的步骤，由该转置组件驱动吸头吸附该晶圆，并带动该晶圆转动一圈，使该取像单元可取得该晶圆完整周缘的影像，借以检查确认该晶圆是否完整无损；
    一转置组件驱动晶圆转至正确方位角度位置的步骤，由该控制模组依所需调整的角度，由该转置组件经由该吸头带动该晶圆转动，使其校准用标记可转移至正确的角度方向，再使该吸头脱离该晶圆，该晶圆回落于该承置座上。
  14. 如权利要求13所述的校准方法，其中该主校正机构于该下取像元件的旁侧建置一测距激光光源；在执行该比对下取像元件与上取像元件取得标准刻度的位置差异的步骤之前，预先执行一调整上取像元件对应于标准刻度的镜头焦距的步骤，由该主校正 机构利用测距激光光源所产生的激光光束投射至该影像攫取组件的标准刻度部位，可测量该主校正机构与该标准刻度的距离，并调整该上取像元件的镜头焦距，以利于该上取像元件清晰取得该透明片上的标准刻度的位置影像。
  15. 如权利要求13所述的校准方法，其中该主校正机构于该下取像元件的旁侧建置一测距激光光源；在执行该比对下取像元件取得定位刻度位置与标准刻度的位置差异的步骤之前，预先执行一调整下取像元件对应于定位刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该定位面的定位刻度上，借以测量该主校正机构与该晶圆定位件装卸机构的距离，并调整该下取像元件的镜头焦距，以利于该下取像元件清晰取得该晶圆定位件装卸机构的定位刻度的位置影像。
  16. 如权利要求13所述的校准方法，其中该主校正机构于该下取像元件的旁侧建置一测距激光光源；在执行该比对下取像元件取得指示刻度位置与标准刻度的位置差异的步骤之前，预先执行一调整下取像元件对应于指示刻度的镜头焦距的步骤，由该主校正机构利用测距激光光源所产生的激光光束投射至该晶圆取放机的指示刻度构上，借以测量该主校正机构与该指示刻度的距离，以调整该下取像元件的镜头焦距，以利于该下取像元件清晰取得该晶圆取放机的指示刻度的位置影像。
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