IL70018A - Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substrates - Google Patents
Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substratesInfo
- Publication number
- IL70018A IL70018A IL70018A IL7001883A IL70018A IL 70018 A IL70018 A IL 70018A IL 70018 A IL70018 A IL 70018A IL 7001883 A IL7001883 A IL 7001883A IL 70018 A IL70018 A IL 70018A
- Authority
- IL
- Israel
- Prior art keywords
- solid phase
- defect density
- phase epitaxy
- composite substrates
- regrowth process
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title 1
- 230000007547 defect Effects 0.000 title 1
- 239000012212 insulator Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000000348 solid-phase epitaxy Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02694—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26593—Bombardment with radiation with high-energy radiation producing ion implantation at a temperature lower than room temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
- H01L21/3245—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering of AIIIBV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/441,477 US4509990A (en) | 1982-11-15 | 1982-11-15 | Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
IL70018A true IL70018A (en) | 1987-02-27 |
Family
ID=23753015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL70018A IL70018A (en) | 1982-11-15 | 1983-10-21 | Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substrates |
Country Status (6)
Country | Link |
---|---|
US (1) | US4509990A (it) |
EP (1) | EP0125260B1 (it) |
DE (1) | DE3374821D1 (it) |
IL (1) | IL70018A (it) |
IT (1) | IT1168243B (it) |
WO (1) | WO1984002034A1 (it) |
Families Citing this family (68)
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JPS59208743A (ja) * | 1983-05-13 | 1984-11-27 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
US4559091A (en) * | 1984-06-15 | 1985-12-17 | Regents Of The University Of California | Method for producing hyperabrupt doping profiles in semiconductors |
US4588447A (en) * | 1984-06-25 | 1986-05-13 | Rockwell International Corporation | Method of eliminating p-type electrical activity and increasing channel mobility of Si-implanted and recrystallized SOS films |
CA1239706A (en) * | 1984-11-26 | 1988-07-26 | Hisao Hayashi | Method of forming a thin semiconductor film |
US4617066A (en) * | 1984-11-26 | 1986-10-14 | Hughes Aircraft Company | Process of making semiconductors having shallow, hyperabrupt doped regions by implantation and two step annealing |
US4659392A (en) * | 1985-03-21 | 1987-04-21 | Hughes Aircraft Company | Selective area double epitaxial process for fabricating silicon-on-insulator structures for use with MOS devices and integrated circuits |
US4710478A (en) * | 1985-05-20 | 1987-12-01 | United States Of America As Represented By The Secretary Of The Navy | Method for making germanium/gallium arsenide high mobility complementary logic transistors |
US4659400A (en) * | 1985-06-27 | 1987-04-21 | General Instrument Corp. | Method for forming high yield epitaxial wafers |
US4952446A (en) * | 1986-02-10 | 1990-08-28 | Cornell Research Foundation, Inc. | Ultra-thin semiconductor membranes |
US4946735A (en) * | 1986-02-10 | 1990-08-07 | Cornell Research Foundation, Inc. | Ultra-thin semiconductor membranes |
US4775641A (en) * | 1986-09-25 | 1988-10-04 | General Electric Company | Method of making silicon-on-sapphire semiconductor devices |
US4732867A (en) * | 1986-11-03 | 1988-03-22 | General Electric Company | Method of forming alignment marks in sapphire |
US4766482A (en) * | 1986-12-09 | 1988-08-23 | General Electric Company | Semiconductor device and method of making the same |
US4753895A (en) * | 1987-02-24 | 1988-06-28 | Hughes Aircraft Company | Method of forming low leakage CMOS device on insulating substrate |
US4816893A (en) * | 1987-02-24 | 1989-03-28 | Hughes Aircraft Company | Low leakage CMOS/insulator substrate devices and method of forming the same |
US4797721A (en) * | 1987-04-13 | 1989-01-10 | General Electric Company | Radiation hardened semiconductor device and method of making the same |
JPH0766922B2 (ja) * | 1987-07-29 | 1995-07-19 | 株式会社村田製作所 | 半導体装置の製造方法 |
US4826300A (en) * | 1987-07-30 | 1989-05-02 | Hughes Aircraft Company | Silicon-on-sapphire liquid crystal light valve and method |
JP2746606B2 (ja) * | 1987-09-18 | 1998-05-06 | ゼロックス コーポレーション | 大粒子多結晶質膜の製造方法 |
US5021119A (en) * | 1987-11-13 | 1991-06-04 | Kopin Corporation | Zone-melting recrystallization process |
US4863877A (en) * | 1987-11-13 | 1989-09-05 | Kopin Corporation | Ion implantation and annealing of compound semiconductor layers |
US5453153A (en) * | 1987-11-13 | 1995-09-26 | Kopin Corporation | Zone-melting recrystallization process |
US4885052A (en) * | 1987-11-13 | 1989-12-05 | Kopin Corporation | Zone-melting recrystallization process |
US4837586A (en) * | 1988-01-28 | 1989-06-06 | Eastman Kodak Company | Image contrast by thermal printers |
US5063166A (en) * | 1988-04-29 | 1991-11-05 | Sri International | Method of forming a low dislocation density semiconductor device |
US4965872A (en) * | 1988-09-26 | 1990-10-23 | Vasudev Prahalad K | MOS-enhanced, self-aligned lateral bipolar transistor made of a semiconductor on an insulator |
EP0390608B1 (en) * | 1989-03-31 | 1999-06-09 | Canon Kabushiki Kaisha | Method for forming semiconductor thin-film and resulting semiconductor thin-film |
US5196355A (en) * | 1989-04-24 | 1993-03-23 | Ibis Technology Corporation | Simox materials through energy variation |
FR2650704B1 (fr) * | 1989-08-01 | 1994-05-06 | Thomson Csf | Procede de fabrication par epitaxie de couches monocristallines de materiaux a parametres de mailles differents |
US5554883A (en) * | 1990-04-28 | 1996-09-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method therefor |
DE4114162A1 (de) * | 1990-05-02 | 1991-11-07 | Nippon Sheet Glass Co Ltd | Verfahren zur herstellung eines polykristallinen halbleiterfilms |
US5318919A (en) * | 1990-07-31 | 1994-06-07 | Sanyo Electric Co., Ltd. | Manufacturing method of thin film transistor |
JPH0719738B2 (ja) * | 1990-09-06 | 1995-03-06 | 信越半導体株式会社 | 接合ウェーハ及びその製造方法 |
US5198371A (en) * | 1990-09-24 | 1993-03-30 | Biota Corp. | Method of making silicon material with enhanced surface mobility by hydrogen ion implantation |
US5225031A (en) * | 1991-04-10 | 1993-07-06 | Martin Marietta Energy Systems, Inc. | Process for depositing an oxide epitaxially onto a silicon substrate and structures prepared with the process |
US5482003A (en) * | 1991-04-10 | 1996-01-09 | Martin Marietta Energy Systems, Inc. | Process for depositing epitaxial alkaline earth oxide onto a substrate and structures prepared with the process |
US5420055A (en) * | 1992-01-22 | 1995-05-30 | Kopin Corporation | Reduction of parasitic effects in floating body MOSFETs |
US5298434A (en) * | 1992-02-07 | 1994-03-29 | Harris Corporation | Selective recrystallization to reduce P-channel transistor leakage in silicon-on-sapphire CMOS radiation hardened integrated circuits |
US6413805B1 (en) | 1993-03-12 | 2002-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device forming method |
US5374567A (en) * | 1993-05-20 | 1994-12-20 | The United States Of America As Represented By The Secretary Of The Navy | Operational amplifier using bipolar junction transistors in silicon-on-sapphire |
US6312968B1 (en) * | 1993-06-30 | 2001-11-06 | The United States Of America As Represented By The Secretary Of The Navy | Method for fabricating an electrically addressable silicon-on-sapphire light valve |
US5416043A (en) * | 1993-07-12 | 1995-05-16 | Peregrine Semiconductor Corporation | Minimum charge FET fabricated on an ultrathin silicon on sapphire wafer |
US5572040A (en) * | 1993-07-12 | 1996-11-05 | Peregrine Semiconductor Corporation | High-frequency wireless communication system on a single ultrathin silicon on sapphire chip |
US5973382A (en) * | 1993-07-12 | 1999-10-26 | Peregrine Semiconductor Corporation | Capacitor on ultrathin semiconductor on insulator |
US5930638A (en) * | 1993-07-12 | 1999-07-27 | Peregrine Semiconductor Corp. | Method of making a low parasitic resistor on ultrathin silicon on insulator |
US5864162A (en) * | 1993-07-12 | 1999-01-26 | Peregrine Seimconductor Corporation | Apparatus and method of making a self-aligned integrated resistor load on ultrathin silicon on sapphire |
US5973363A (en) * | 1993-07-12 | 1999-10-26 | Peregrine Semiconductor Corp. | CMOS circuitry with shortened P-channel length on ultrathin silicon on insulator |
US5863823A (en) * | 1993-07-12 | 1999-01-26 | Peregrine Semiconductor Corporation | Self-aligned edge control in silicon on insulator |
JP3274246B2 (ja) * | 1993-08-23 | 2002-04-15 | コマツ電子金属株式会社 | エピタキシャルウェーハの製造方法 |
US5543348A (en) * | 1995-03-29 | 1996-08-06 | Kabushiki Kaisha Toshiba | Controlled recrystallization of buried strap in a semiconductor memory device |
US5905279A (en) * | 1996-04-09 | 1999-05-18 | Kabushiki Kaisha Toshiba | Low resistant trench fill for a semiconductor device |
US6251754B1 (en) * | 1997-05-09 | 2001-06-26 | Denso Corporation | Semiconductor substrate manufacturing method |
CA2294306A1 (en) * | 1997-06-19 | 1998-12-23 | Asahi Kasei Kabushiki Kaisha | Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same |
GB9726094D0 (en) * | 1997-12-10 | 1998-02-11 | Philips Electronics Nv | Thin film transistors and electronic devices comprising such |
WO2000019500A1 (fr) * | 1998-09-25 | 2000-04-06 | Asahi Kasei Kabushiki Kaisha | Substrat a semi-conducteur et son procede de fabrication, dispositif a semi-conducteur comprenant un tel substrat et son procede de fabrication |
US6211095B1 (en) | 1998-12-23 | 2001-04-03 | Agilent Technologies, Inc. | Method for relieving lattice mismatch stress in semiconductor devices |
US6417078B1 (en) | 2000-05-03 | 2002-07-09 | Ibis Technology Corporation | Implantation process using sub-stoichiometric, oxygen doses at different energies |
US6982208B2 (en) * | 2004-05-03 | 2006-01-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for producing high throughput strained-Si channel MOSFETS |
US7402465B2 (en) * | 2004-11-11 | 2008-07-22 | Samsung Electronics Co., Ltd. | Method of fabricating single-crystal silicon film and method of fabricating TFT adopting the same |
US20100216295A1 (en) * | 2009-02-24 | 2010-08-26 | Alex Usenko | Semiconductor on insulator made using improved defect healing process |
US8962376B2 (en) * | 2009-04-21 | 2015-02-24 | The Silanna Group Pty Ltd | Optoelectronic device with lateral pin or pin junction |
EP2804202B1 (en) * | 2012-01-12 | 2021-02-24 | Shin-Etsu Chemical Co., Ltd. | Method for manufacturing a thermally oxidized heterogeneous composite substrate |
WO2014144538A1 (en) | 2013-03-15 | 2014-09-18 | Gottlieb Stacey | Fingernail system for use with capacitive touchscreens |
JP5685615B2 (ja) * | 2013-03-25 | 2015-03-18 | 東京エレクトロン株式会社 | マイクロ波加熱処理方法 |
RU2641617C1 (ru) * | 2016-10-07 | 2018-01-18 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Чеченский государственный университет" | Способ изготовления полупроводникового прибора |
FR3076292B1 (fr) * | 2017-12-28 | 2020-01-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de transfert d'une couche utile sur un substrat support |
FR3086097B1 (fr) * | 2018-09-18 | 2020-12-04 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif electroluminescent |
CN113437021B (zh) * | 2021-07-28 | 2022-06-03 | 广东省科学院半导体研究所 | 薄膜材料的异质结的制备方法及其制得的薄膜 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3393088A (en) * | 1964-07-01 | 1968-07-16 | North American Rockwell | Epitaxial deposition of silicon on alpha-aluminum |
US3414434A (en) * | 1965-06-30 | 1968-12-03 | North American Rockwell | Single crystal silicon on spinel insulators |
USB524765I5 (it) * | 1966-02-03 | 1900-01-01 | ||
US3546036A (en) * | 1966-06-13 | 1970-12-08 | North American Rockwell | Process for etch-polishing sapphire and other oxides |
US3475209A (en) * | 1967-01-05 | 1969-10-28 | North American Rockwell | Single crystal silicon on chrysoberyl |
US3664866A (en) * | 1970-04-08 | 1972-05-23 | North American Rockwell | Composite, method for growth of ii{11 {14 vi{11 {0 compounds on substrates, and process for making composition for the compounds |
DE2344320C2 (de) * | 1973-09-03 | 1975-06-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Kompensation von Grenzflächenladungen bei epitaktisch auf ein Substrat aufgewachsenen Siliziumdünnschichten |
DE2756861C2 (de) * | 1977-12-20 | 1983-11-24 | Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | Verfahren zum Ändern de Lage des Fermi-Niveaus von amorphem Silicium durch Dotieren mittels Ionenimplantation |
US4177084A (en) * | 1978-06-09 | 1979-12-04 | Hewlett-Packard Company | Method for producing a low defect layer of silicon-on-sapphire wafer |
US4317686A (en) * | 1979-07-04 | 1982-03-02 | National Research Development Corporation | Method of manufacturing field-effect transistors by forming double insulative buried layers by ion-implantation |
JPS5633821A (en) * | 1979-08-29 | 1981-04-04 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Photoannealing method for semiconductor layer |
JPS5646522A (en) * | 1979-09-25 | 1981-04-27 | Shunpei Yamazaki | Semiconductor device and manufacture thereof |
US4385937A (en) * | 1980-05-20 | 1983-05-31 | Tokyo Shibaura Denki Kabushiki Kaisha | Regrowing selectively formed ion amorphosized regions by thermal gradient |
US4391651A (en) * | 1981-10-15 | 1983-07-05 | The United States Of America As Represented By The Secretary Of The Navy | Method of forming a hyperabrupt interface in a GaAs substrate |
-
1982
- 1982-11-15 US US06/441,477 patent/US4509990A/en not_active Expired - Lifetime
-
1983
- 1983-10-17 WO PCT/US1983/001622 patent/WO1984002034A1/en active IP Right Grant
- 1983-10-17 DE DE8383903472T patent/DE3374821D1/de not_active Expired
- 1983-10-17 EP EP83903472A patent/EP0125260B1/en not_active Expired
- 1983-10-21 IL IL70018A patent/IL70018A/xx not_active IP Right Cessation
- 1983-11-14 IT IT49330/83A patent/IT1168243B/it active
Also Published As
Publication number | Publication date |
---|---|
IT1168243B (it) | 1987-05-20 |
US4509990A (en) | 1985-04-09 |
DE3374821D1 (en) | 1988-01-14 |
WO1984002034A1 (en) | 1984-05-24 |
IT8349330A0 (it) | 1983-11-14 |
EP0125260A1 (en) | 1984-11-21 |
EP0125260B1 (en) | 1987-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RH | Patent void |