IL143316A - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces - Google Patents
Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesInfo
- Publication number
- IL143316A IL143316A IL14331699A IL14331699A IL143316A IL 143316 A IL143316 A IL 143316A IL 14331699 A IL14331699 A IL 14331699A IL 14331699 A IL14331699 A IL 14331699A IL 143316 A IL143316 A IL 143316A
- Authority
- IL
- Israel
- Prior art keywords
- workpieces
- electroplating
- holding
- methods
- during electropolishing
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11013698P | 1998-11-28 | 1998-11-28 | |
PCT/US1999/028106 WO2000033356A2 (en) | 1998-11-28 | 1999-11-24 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
IL143316A0 IL143316A0 (en) | 2002-04-21 |
IL143316A true IL143316A (en) | 2005-03-20 |
Family
ID=22331393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14331699A IL143316A (en) | 1998-11-28 | 1999-11-24 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1133786A2 (zh) |
JP (2) | JP2002531702A (zh) |
KR (3) | KR100562011B1 (zh) |
CN (2) | CN100382235C (zh) |
AU (1) | AU3105400A (zh) |
CA (1) | CA2352160A1 (zh) |
IL (1) | IL143316A (zh) |
TW (1) | TW430919B (zh) |
WO (1) | WO2000033356A2 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299741B1 (en) | 1999-11-29 | 2001-10-09 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
US6537144B1 (en) | 2000-02-17 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for enhanced CMP using metals having reductive properties |
US6848970B2 (en) | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US7066800B2 (en) | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
JP4644926B2 (ja) * | 2000-10-13 | 2011-03-09 | ソニー株式会社 | 半導体製造装置および半導体装置の製造方法 |
WO2002083995A1 (en) * | 2001-04-12 | 2002-10-24 | Arthur, Keigler | Method of and apparatus for controlling fluid flow |
JP2003027280A (ja) * | 2001-07-18 | 2003-01-29 | Ebara Corp | めっき装置 |
US7147765B2 (en) * | 2001-08-31 | 2006-12-12 | Semitool, Inc. | Apparatus and method for deposition of an electrophoretic emulsion |
TWI275436B (en) | 2002-01-31 | 2007-03-11 | Ebara Corp | Electrochemical machining device, and substrate processing apparatus and method |
TWI274393B (en) * | 2002-04-08 | 2007-02-21 | Acm Res Inc | Electropolishing and/or electroplating apparatus and methods |
JP2006511699A (ja) * | 2002-07-22 | 2006-04-06 | エーシーエム リサーチ,インコーポレイティド | 厚さの計測値を使用した適応型の電解研磨と障壁及び犠牲層の除去 |
JP3860111B2 (ja) * | 2002-12-19 | 2006-12-20 | 大日本スクリーン製造株式会社 | メッキ装置およびメッキ方法 |
US7842169B2 (en) | 2003-03-04 | 2010-11-30 | Applied Materials, Inc. | Method and apparatus for local polishing control |
US8804535B2 (en) * | 2009-03-25 | 2014-08-12 | Avaya Inc. | System and method for sending packets using another device's network address |
TWI410531B (zh) * | 2010-05-07 | 2013-10-01 | Taiwan Semiconductor Mfg | 直立式電鍍設備及其電鍍方法 |
KR101211826B1 (ko) * | 2010-06-14 | 2012-12-18 | 연세대학교 산학협력단 | 자기유변유체를 이용한 피가공물의 연마장치 및 그 연마방법 |
JP5782398B2 (ja) | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
US9399827B2 (en) * | 2013-04-29 | 2016-07-26 | Applied Materials, Inc. | Microelectronic substrate electro processing system |
CN105210181B (zh) * | 2013-05-09 | 2017-12-01 | 盛美半导体设备(上海)有限公司 | 电镀和/或电抛光硅片的装置及方法 |
KR101353378B1 (ko) * | 2013-08-19 | 2014-01-22 | 주식회사 케이엠 | 주사기용 믹싱 조인트 |
CN104465481A (zh) * | 2013-09-22 | 2015-03-25 | 盛美半导体设备(上海)有限公司 | 晶圆夹盘 |
CN105297127B (zh) * | 2014-05-30 | 2019-04-05 | 盛美半导体设备(上海)有限公司 | 带有电极的喷头装置 |
JP6449091B2 (ja) * | 2015-04-20 | 2019-01-09 | 東京エレクトロン株式会社 | スリップリング、支持機構及びプラズマ処理装置 |
US10053793B2 (en) * | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
GB201701166D0 (en) * | 2017-01-24 | 2017-03-08 | Picofluidics Ltd | An apparatus for electrochemically processing semiconductor substrates |
KR102156430B1 (ko) * | 2020-04-28 | 2020-09-15 | 주식회사 스마트코리아피씨비 | 회전식 기판 도금장치 |
CN114262920A (zh) * | 2020-09-16 | 2022-04-01 | 长鑫存储技术有限公司 | 晶圆电镀设备、漏气检测装置和方法、晶圆电镀方法 |
EP3998374A4 (en) | 2020-09-16 | 2022-08-03 | Changxin Memory Technologies, Inc. | DEVICE AND METHOD FOR AIR LEAK DETECTION AND METHOD FOR ELECTROPLATING WAFER |
CN112144096B (zh) * | 2020-09-25 | 2022-05-10 | 深圳市生利科技有限公司 | 一种锌镍合金电镀设备 |
CN113013078A (zh) * | 2021-03-04 | 2021-06-22 | 苏州竣合信半导体科技有限公司 | 一种用于芯片定位的兼容芯片定位槽及其使用方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5419649A (en) * | 1977-07-15 | 1979-02-14 | Hitachi Ltd | Wafer holding jig for electrtolytic plating |
JPS58181898A (ja) * | 1982-04-14 | 1983-10-24 | Fujitsu Ltd | メツキ用給電装置 |
JPS6396292A (ja) * | 1986-10-13 | 1988-04-27 | Mitsubishi Electric Corp | 電解メツキ装置 |
JPH0375394A (ja) * | 1989-08-18 | 1991-03-29 | Fujitsu Ltd | メッキ装置 |
JPH03232994A (ja) * | 1990-02-06 | 1991-10-16 | Fujitsu Ltd | メッキ装置 |
JP2567716B2 (ja) * | 1990-03-20 | 1996-12-25 | 富士通株式会社 | 電気メッキ装置 |
JP2608485B2 (ja) * | 1990-05-30 | 1997-05-07 | 富士通株式会社 | めっき装置 |
DE4024576A1 (de) * | 1990-08-02 | 1992-02-06 | Bosch Gmbh Robert | Vorrichtung zum einseitigen aetzen einer halbleiterscheibe |
JPH04186630A (ja) * | 1990-11-19 | 1992-07-03 | Oki Electric Ind Co Ltd | 半導体ウエハのバンプ電極めっき装置 |
JP2704796B2 (ja) * | 1991-04-22 | 1998-01-26 | 株式会社東芝 | 半導体ウェハめっき用治具 |
JPH05243236A (ja) * | 1992-03-03 | 1993-09-21 | Fujitsu Ltd | 電気メッキ装置 |
US5405518A (en) * | 1994-04-26 | 1995-04-11 | Industrial Technology Research Institute | Workpiece holder apparatus |
US5670034A (en) * | 1995-07-11 | 1997-09-23 | American Plating Systems | Reciprocating anode electrolytic plating apparatus and method |
US5620581A (en) * | 1995-11-29 | 1997-04-15 | Aiwa Research And Development, Inc. | Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring |
US5980706A (en) * | 1996-07-15 | 1999-11-09 | Semitool, Inc. | Electrode semiconductor workpiece holder |
TW334609B (en) * | 1996-09-19 | 1998-06-21 | Hitachi Ltd | Electrostatic chuck, method and device for processing sanyle use the same |
JP3627884B2 (ja) * | 1996-10-17 | 2005-03-09 | 株式会社デンソー | メッキ装置 |
US5932077A (en) * | 1998-02-09 | 1999-08-03 | Reynolds Tech Fabricators, Inc. | Plating cell with horizontal product load mechanism |
-
1999
- 1999-11-24 KR KR1020057000594A patent/KR100562011B1/ko not_active IP Right Cessation
- 1999-11-24 CN CNB2005100037736A patent/CN100382235C/zh not_active Expired - Fee Related
- 1999-11-24 IL IL14331699A patent/IL143316A/xx not_active IP Right Cessation
- 1999-11-24 CN CNB998137944A patent/CN1191605C/zh not_active Expired - Fee Related
- 1999-11-24 KR KR10-2001-7006569A patent/KR100516776B1/ko not_active IP Right Cessation
- 1999-11-24 JP JP2000585913A patent/JP2002531702A/ja active Pending
- 1999-11-24 EP EP99965053A patent/EP1133786A2/en not_active Withdrawn
- 1999-11-24 KR KR10-2004-7011238A patent/KR100503553B1/ko not_active IP Right Cessation
- 1999-11-24 CA CA002352160A patent/CA2352160A1/en not_active Abandoned
- 1999-11-24 WO PCT/US1999/028106 patent/WO2000033356A2/en active IP Right Grant
- 1999-11-24 AU AU31054/00A patent/AU3105400A/en not_active Abandoned
- 1999-11-26 TW TW088120687A patent/TW430919B/zh not_active IP Right Cessation
-
2006
- 2006-11-22 JP JP2006315540A patent/JP2007119923A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1346510A (zh) | 2002-04-24 |
TW430919B (en) | 2001-04-21 |
CN1191605C (zh) | 2005-03-02 |
WO2000033356A3 (en) | 2001-07-12 |
JP2002531702A (ja) | 2002-09-24 |
KR100562011B1 (ko) | 2006-03-22 |
KR20040070317A (ko) | 2004-08-06 |
WO2000033356A9 (en) | 2001-08-02 |
AU3105400A (en) | 2000-06-19 |
CN100382235C (zh) | 2008-04-16 |
CA2352160A1 (en) | 2000-06-08 |
KR100503553B1 (ko) | 2005-07-26 |
JP2007119923A (ja) | 2007-05-17 |
CN1632914A (zh) | 2005-06-29 |
IL143316A0 (en) | 2002-04-21 |
KR20010086051A (ko) | 2001-09-07 |
KR20050013179A (ko) | 2005-02-02 |
EP1133786A2 (en) | 2001-09-19 |
WO2000033356A2 (en) | 2000-06-08 |
KR100516776B1 (ko) | 2005-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees |