IL140565A0 - Method of fabricating a stacked poly-poly and mos capacitor using a sige integration scheme - Google Patents

Method of fabricating a stacked poly-poly and mos capacitor using a sige integration scheme

Info

Publication number
IL140565A0
IL140565A0 IL14056500A IL14056500A IL140565A0 IL 140565 A0 IL140565 A0 IL 140565A0 IL 14056500 A IL14056500 A IL 14056500A IL 14056500 A IL14056500 A IL 14056500A IL 140565 A0 IL140565 A0 IL 140565A0
Authority
IL
Israel
Prior art keywords
poly
polysilicon layer
mos capacitor
fabricating
stacked
Prior art date
Application number
IL14056500A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IL140565A0 publication Critical patent/IL140565A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92—Capacitors having potential barriers
    • H01L29/94—Metal-insulator-semiconductors, e.g. MOS

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
IL14056500A 2000-04-17 2000-12-26 Method of fabricating a stacked poly-poly and mos capacitor using a sige integration scheme IL140565A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/551,168 US6507063B2 (en) 2000-04-17 2000-04-17 Poly-poly/MOS capacitor having a gate encapsulating first electrode layer

Publications (1)

Publication Number Publication Date
IL140565A0 true IL140565A0 (en) 2002-02-10

Family

ID=24200135

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14056500A IL140565A0 (en) 2000-04-17 2000-12-26 Method of fabricating a stacked poly-poly and mos capacitor using a sige integration scheme

Country Status (12)

Country Link
US (2) US6507063B2 (ja)
EP (1) EP1148557B1 (ja)
JP (1) JP2002009163A (ja)
KR (1) KR20010096611A (ja)
CN (1) CN1184698C (ja)
AT (1) ATE360890T1 (ja)
DE (1) DE60128028T2 (ja)
ES (1) ES2281379T3 (ja)
IL (1) IL140565A0 (ja)
MY (1) MY133800A (ja)
SG (1) SG107561A1 (ja)
TW (1) TW506043B (ja)

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US6440811B1 (en) * 2000-12-21 2002-08-27 International Business Machines Corporation Method of fabricating a poly-poly capacitor with a SiGe BiCMOS integration scheme
MXPA03009967A (es) * 2001-05-31 2004-02-12 Procter & Gamble Mecanismo disparador para iniciar un cambio de fase en un elemento liquido variable.
JP2003224204A (ja) * 2002-01-29 2003-08-08 Mitsubishi Electric Corp キャパシタを有する半導体装置
KR100451517B1 (ko) * 2002-07-19 2004-10-06 주식회사 하이닉스반도체 반도체소자의 캐패시터 제조방법
JP2004228188A (ja) * 2003-01-21 2004-08-12 Renesas Technology Corp 半導体装置
TWI233689B (en) * 2003-04-14 2005-06-01 Samsung Electronics Co Ltd Capacitors of semiconductor devices including silicon-germanium and metallic electrodes and methods of fabricating the same
DE10324066A1 (de) * 2003-05-27 2004-12-30 Texas Instruments Deutschland Gmbh Stapelkondensator und Verfahren zur Herstellung eines solchen
CN1327525C (zh) * 2003-12-24 2007-07-18 上海宏力半导体制造有限公司 测量电容的结构与方法
EP1560269A1 (en) * 2004-01-30 2005-08-03 Alcatel MOS capacitor in an integrated semiconductor circuit
US7709313B2 (en) * 2005-07-19 2010-05-04 International Business Machines Corporation High performance capacitors in planar back gates CMOS
CN100446254C (zh) * 2005-12-15 2008-12-24 上海华虹Nec电子有限公司 半导体电容
US7821053B2 (en) * 2006-11-15 2010-10-26 International Business Machines Corporation Tunable capacitor
US7670920B2 (en) 2007-04-09 2010-03-02 Texas Instruments Incorporated Methods and apparatus for forming a polysilicon capacitor
KR100979001B1 (ko) * 2007-12-27 2010-08-30 주식회사 동부하이텍 커패시터 및 커패시터 제조 방법
CN102088001B (zh) * 2009-12-04 2013-10-09 中芯国际集成电路制造(上海)有限公司 快闪存储器及其制作方法
US8318575B2 (en) 2011-02-07 2012-11-27 Infineon Technologies Ag Compressive polycrystalline silicon film and method of manufacture thereof
US9112060B2 (en) 2011-03-23 2015-08-18 Freescale Semiconductor, Inc. Low-leakage, high-capacitance capacitor structures and method of making
US11009788B2 (en) 2011-09-09 2021-05-18 Centera Photonics Inc. Method for manufacturing optical electrical module and substrate of an optical electrical module
US9581772B2 (en) 2011-09-09 2017-02-28 Centera Photonics Inc. Optical electrical module used for optical communication
US9379202B2 (en) * 2012-11-12 2016-06-28 Nvidia Corporation Decoupling capacitors for interposers
CN104851776A (zh) * 2014-02-14 2015-08-19 中芯国际集成电路制造(上海)有限公司 MiS电容器结构及其制造方法
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9905707B1 (en) * 2016-10-28 2018-02-27 Globalfoundries Inc. MOS capacitive structure of reduced capacitance variability
CN111180394B (zh) * 2018-11-13 2022-09-09 无锡华润上华科技有限公司 形成有电容器的半导体器件及其制造方法
KR20200113871A (ko) 2019-03-26 2020-10-07 에스케이하이닉스 주식회사 반도체 메모리 장치 및 그 제조방법
US11257940B2 (en) * 2020-01-14 2022-02-22 Cree, Inc. Group III HEMT and capacitor that share structural features

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US4246502A (en) * 1978-08-16 1981-01-20 Mitel Corporation Means for coupling incompatible signals to an integrated circuit and for deriving operating supply therefrom
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US5082797A (en) * 1991-01-22 1992-01-21 Micron Technology, Inc. Method of making stacked textured container capacitor
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US5583359A (en) * 1995-03-03 1996-12-10 Northern Telecom Limited Capacitor structure for an integrated circuit
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Also Published As

Publication number Publication date
JP2002009163A (ja) 2002-01-11
US6507063B2 (en) 2003-01-14
CN1318869A (zh) 2001-10-24
DE60128028D1 (de) 2007-06-06
DE60128028T2 (de) 2008-01-03
SG107561A1 (en) 2004-12-29
ATE360890T1 (de) 2007-05-15
KR20010096611A (ko) 2001-11-07
EP1148557B1 (en) 2007-04-25
EP1148557A3 (en) 2003-08-27
TW506043B (en) 2002-10-11
US20020089008A1 (en) 2002-07-11
EP1148557A2 (en) 2001-10-24
ES2281379T3 (es) 2007-10-01
US6833299B2 (en) 2004-12-21
CN1184698C (zh) 2005-01-12
MY133800A (en) 2007-11-30
US20030092239A1 (en) 2003-05-15

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