IL111497A - Seelan preparations are useful as adhesives - Google Patents
Seelan preparations are useful as adhesivesInfo
- Publication number
- IL111497A IL111497A IL11149794A IL11149794A IL111497A IL 111497 A IL111497 A IL 111497A IL 11149794 A IL11149794 A IL 11149794A IL 11149794 A IL11149794 A IL 11149794A IL 111497 A IL111497 A IL 111497A
- Authority
- IL
- Israel
- Prior art keywords
- silane
- carbon atoms
- group
- formula
- layer
- Prior art date
Links
- 229910000077 silane Inorganic materials 0.000 title claims abstract description 72
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 239000000203 mixture Substances 0.000 title claims abstract description 69
- 239000000853 adhesive Substances 0.000 title description 11
- 230000001070 adhesive effect Effects 0.000 title description 9
- -1 mercapto, carboxy Chemical group 0.000 claims abstract description 46
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 40
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 34
- 239000007983 Tris buffer Substances 0.000 claims abstract description 24
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 22
- 125000000524 functional group Chemical group 0.000 claims abstract description 17
- 125000003118 aryl group Chemical group 0.000 claims abstract description 16
- 125000003368 amide group Chemical group 0.000 claims abstract description 15
- 239000004593 Epoxy Chemical group 0.000 claims abstract description 13
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 13
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 13
- 239000004721 Polyphenylene oxide Chemical group 0.000 claims abstract description 12
- 229920000570 polyether Chemical group 0.000 claims abstract description 12
- 229920002554 vinyl polymer Chemical group 0.000 claims abstract description 12
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 11
- 125000002252 acyl group Chemical group 0.000 claims abstract description 11
- 150000001335 aliphatic alkanes Chemical class 0.000 claims abstract description 11
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims abstract description 11
- 125000005504 styryl group Chemical group 0.000 claims abstract description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 11
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 10
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 10
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims abstract description 9
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims abstract description 8
- 125000001475 halogen functional group Chemical group 0.000 claims abstract 5
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 150000001412 amines Chemical class 0.000 claims description 21
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 5
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 claims description 3
- SGPGESCZOCHFCL-UHFFFAOYSA-N Tilisolol hydrochloride Chemical group [Cl-].C1=CC=C2C(=O)N(C)C=C(OCC(O)C[NH2+]C(C)(C)C)C2=C1 SGPGESCZOCHFCL-UHFFFAOYSA-N 0.000 claims 2
- 125000004429 atom Chemical group 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- 238000012360 testing method Methods 0.000 description 19
- 239000000243 solution Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000011888 foil Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- KHLWLJFRUQJJKQ-UHFFFAOYSA-N 3-trimethoxysilyl-n,n-bis(3-trimethoxysilylpropyl)propan-1-amine Chemical compound CO[Si](OC)(OC)CCCN(CCC[Si](OC)(OC)OC)CCC[Si](OC)(OC)OC KHLWLJFRUQJJKQ-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000000839 emulsion Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 4
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 4
- TZZGHGKTHXIOMN-UHFFFAOYSA-N 3-trimethoxysilyl-n-(3-trimethoxysilylpropyl)propan-1-amine Chemical compound CO[Si](OC)(OC)CCCNCCC[Si](OC)(OC)OC TZZGHGKTHXIOMN-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical group C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 241000242532 Polycladida Species 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ZYOASNRWXIDODK-UHFFFAOYSA-N 1-triethoxysilyl-n,n-bis(triethoxysilylmethyl)methanamine Chemical compound CCO[Si](OCC)(OCC)CN(C[Si](OCC)(OCC)OCC)C[Si](OCC)(OCC)OCC ZYOASNRWXIDODK-UHFFFAOYSA-N 0.000 description 1
- ORJKEGHRATZXTK-UHFFFAOYSA-N 1-trimethoxysilyl-n,n-bis(trimethoxysilylmethyl)methanamine Chemical compound CO[Si](OC)(OC)CN(C[Si](OC)(OC)OC)C[Si](OC)(OC)OC ORJKEGHRATZXTK-UHFFFAOYSA-N 0.000 description 1
- IRGKJPHTQIWQTD-UHFFFAOYSA-N 2,7-dibromopyrene-1,3,6,8-tetrone Chemical compound O=C1C(Br)C(=O)C2=CC=C3C(=O)C(Br)C(=O)C4=CC=C1C2=C43 IRGKJPHTQIWQTD-UHFFFAOYSA-N 0.000 description 1
- QKTZVAGIHBWJCP-UHFFFAOYSA-N 2-trimethoxysilyl-n,n-bis(2-trimethoxysilylethyl)ethanamine Chemical compound CO[Si](OC)(OC)CCN(CC[Si](OC)(OC)OC)CC[Si](OC)(OC)OC QKTZVAGIHBWJCP-UHFFFAOYSA-N 0.000 description 1
- SSQDUJQHQQDNRY-UHFFFAOYSA-N 3-(2,2-dimethoxyethoxysilyl)-N,N-bis[3-(2,2-dimethoxyethoxysilyl)propyl]propan-1-amine Chemical compound COC(CO[SiH2]CCCN(CCC[SiH2]OCC(OC)OC)CCC[SiH2]OCC(OC)OC)OC SSQDUJQHQQDNRY-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- ABPIQRNDMOQKDG-UHFFFAOYSA-N 3-tripropoxysilyl-n,n-bis(3-tripropoxysilylpropyl)propan-1-amine Chemical compound CCCO[Si](OCCC)(OCCC)CCCN(CCC[Si](OCCC)(OCCC)OCCC)CCC[Si](OCCC)(OCCC)OCCC ABPIQRNDMOQKDG-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PVLBXNICXUCXTA-UHFFFAOYSA-N [2-hydroxy-3-(3-triethoxysilylpropylamino)propyl] prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCNCC(O)COC(=O)C=C PVLBXNICXUCXTA-UHFFFAOYSA-N 0.000 description 1
- WYUIWUCVZCRTRH-UHFFFAOYSA-N [[[ethenyl(dimethyl)silyl]amino]-dimethylsilyl]ethene Chemical compound C=C[Si](C)(C)N[Si](C)(C)C=C WYUIWUCVZCRTRH-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- VLFKGWCMFMCFRM-UHFFFAOYSA-N [diacetyloxy(phenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C1=CC=CC=C1 VLFKGWCMFMCFRM-UHFFFAOYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- IYABWNGZIDDRAK-UHFFFAOYSA-N allene Chemical group C=C=C IYABWNGZIDDRAK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000004977 cycloheptylene group Chemical group 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- KSFBTBXTZDJOHO-UHFFFAOYSA-N diaminosilicon Chemical compound N[Si]N KSFBTBXTZDJOHO-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N dimethylformamide Substances CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- HLXCYTXLQJWQFG-UHFFFAOYSA-N diphenyl(2-triethoxysilylethyl)phosphane Chemical compound C=1C=CC=CC=1P(CC[Si](OCC)(OCC)OCC)C1=CC=CC=C1 HLXCYTXLQJWQFG-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- VSBXEXGFTRRACW-UHFFFAOYSA-N ethoxy-(3-isocyanatopropyl)-dimethylsilane Chemical compound CCO[Si](C)(C)CCCN=C=O VSBXEXGFTRRACW-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 125000000031 ethylamino group Chemical group [H]C([H])([H])C([H])([H])N([H])[*] 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- JJJXKZYKNMHSMY-UHFFFAOYSA-N n'-[3-[tris(2-ethylhexoxy)silyl]propyl]ethane-1,2-diamine Chemical compound CCCCC(CC)CO[Si](CCCNCCN)(OCC(CC)CCCC)OCC(CC)CCCC JJJXKZYKNMHSMY-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical class [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 231100000563 toxic property Toxicity 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- WCAGGTLUGWSHOV-UHFFFAOYSA-N tris(tert-butylperoxy)-ethenylsilane Chemical compound CC(C)(C)OO[Si](OOC(C)(C)C)(OOC(C)(C)C)C=C WCAGGTLUGWSHOV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/08—Reinforcements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
- Silicon Polymers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16394693A | 1993-12-08 | 1993-12-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL111497A0 IL111497A0 (en) | 1995-01-24 |
| IL111497A true IL111497A (en) | 2001-01-28 |
Family
ID=22592314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL11149794A IL111497A (en) | 1993-12-08 | 1994-11-02 | Seelan preparations are useful as adhesives |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6215011B1 (de) |
| EP (1) | EP0657394B1 (de) |
| JP (1) | JPH07228702A (de) |
| KR (1) | KR100308770B1 (de) |
| CA (1) | CA2136137C (de) |
| DE (1) | DE69404017T2 (de) |
| IL (1) | IL111497A (de) |
| TW (1) | TW293025B (de) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5928790A (en) * | 1996-04-23 | 1999-07-27 | Mcgean-Rohco, Inc. | Multilayer circuit boards and processes of making the same |
| US7750175B2 (en) * | 1996-06-25 | 2010-07-06 | Northwestern University | Organic light-emitting diodes and related hole transport compounds |
| US5750197A (en) | 1997-01-09 | 1998-05-12 | The University Of Cincinnati | Method of preventing corrosion of metals using silanes |
| JPH11185423A (ja) * | 1997-12-24 | 1999-07-09 | Tdk Corp | ディスクカートリッジ |
| JP3691952B2 (ja) * | 1998-01-30 | 2005-09-07 | 株式会社日立製作所 | 配線基板及びその製造方法 |
| US6162547A (en) * | 1998-06-24 | 2000-12-19 | The University Of Cinncinnati | Corrosion prevention of metals using bis-functional polysulfur silanes |
| US6416869B1 (en) | 1999-07-19 | 2002-07-09 | University Of Cincinnati | Silane coatings for bonding rubber to metals |
| US6132808A (en) * | 1999-02-05 | 2000-10-17 | Brent International Plc | Method of treating metals using amino silanes and multi-silyl-functional silanes in admixture |
| US6827981B2 (en) | 1999-07-19 | 2004-12-07 | The University Of Cincinnati | Silane coatings for metal |
| DE10010669A1 (de) * | 2000-03-04 | 2001-09-06 | Degussa | Verfahren zur Herstellung eines extrusionsbeschichteten Metallgegenstands |
| US7547579B1 (en) * | 2000-04-06 | 2009-06-16 | Micron Technology, Inc. | Underfill process |
| US6783918B2 (en) | 2000-08-30 | 2004-08-31 | Lexmark International, Inc. | Radiation curable resin layer |
| US6635353B2 (en) * | 2001-06-18 | 2003-10-21 | Vision-Ease Lens, Inc. | Aminosilane coating composition and process for producing coated articles |
| US20030113523A1 (en) * | 2001-08-22 | 2003-06-19 | Landi Vincent R. | Silanated copper foils, method of making, and use thereof |
| US6652977B2 (en) * | 2001-09-10 | 2003-11-25 | Johnson Diversey, Inc. | Primer composition |
| KR100436710B1 (ko) * | 2002-01-23 | 2004-06-22 | 삼성에스디아이 주식회사 | 투명도전막, 그 제조방법 및 이를 채용한 화상표시장치 |
| DE10208208B4 (de) * | 2002-02-26 | 2012-03-08 | Eaton Industries Gmbh | Bausatz aus mehreren Bausatzelementen und einer Welle |
| US6887308B2 (en) * | 2003-01-21 | 2005-05-03 | Johnsondiversey, Inc. | Metal coating coupling composition |
| DE602004028350D1 (de) * | 2003-03-19 | 2010-09-09 | Nsk Ltd | Elektrische servolenkvorrichtung und dafür verwendetes harz-zahnrad |
| US20050013925A1 (en) * | 2003-07-17 | 2005-01-20 | Melvin Cabey | Immobilization methods for organic molecules telomers and polymers on solid substrates |
| DE102004060799A1 (de) * | 2004-12-17 | 2006-06-29 | Bayer Materialscience Ag | Thermoplastische Polyurethane und deren Verwendung |
| US10041176B2 (en) * | 2005-04-07 | 2018-08-07 | Momentive Performance Materials Inc. | No-rinse pretreatment methods and compositions |
| TWI391454B (zh) * | 2005-06-17 | 2013-04-01 | Nissan Chemical Ind Ltd | 用於形成膜之塗覆流體及其膜與形成膜之方法 |
| KR100733253B1 (ko) * | 2005-11-18 | 2007-06-27 | 삼성전기주식회사 | 고밀도 인쇄회로기판 및 그 제조방법 |
| US20090171415A1 (en) * | 2006-04-27 | 2009-07-02 | Kenneth Dowling | Coated medical leads and method for preparation thereof |
| GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
| US20080206454A1 (en) * | 2007-02-27 | 2008-08-28 | Insight Equity A.P.X., L.P. (Dba Vision-Ease Lens) | Composition Of Primer Solution For Use With An Optical Article And Method Of Priming An Optical Article |
| EP1978024A1 (de) * | 2007-04-04 | 2008-10-08 | Atotech Deutschland Gmbh | Silan-Zusammensetzungen mit neuen Vernetzungsmitteln |
| DE102007038661A1 (de) * | 2007-08-15 | 2009-02-19 | Henkel Ag & Co. Kgaa | Silanvernetzender Kleb- oder Dichtstoff mit N-Silylakylamiden und seine Verwendung |
| US20110183146A1 (en) * | 2008-06-16 | 2011-07-28 | Wendell Jr Jay Morell | Glass hardening methods and compositions |
| MY155804A (en) | 2008-08-18 | 2015-11-30 | Semblant Ltd | Halo-hydrocarbon polymer coating |
| JP5136791B2 (ja) * | 2008-11-21 | 2013-02-06 | 信越化学工業株式会社 | シアノアクリレート系瞬間接着剤用プライマー組成物 |
| DE102009000500A1 (de) * | 2009-01-30 | 2010-08-05 | Wacker Chemie Ag | Verfahren zur Herstellung von Bis- und Tris(silylorgano)aminen |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| JP6150071B2 (ja) * | 2011-09-16 | 2017-06-21 | 日産化学工業株式会社 | 有機ケイ素化合物及びそれを含むシランカップリング剤 |
| WO2015105854A1 (en) * | 2014-01-07 | 2015-07-16 | Orthobond, Inc. | Surface adhesive for devices |
| BR112016018539A2 (pt) | 2014-02-12 | 2018-05-02 | Vision Ease, Lp | revestimento de fácil limpeza. |
| CN107735450B (zh) * | 2015-07-06 | 2020-08-11 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、树脂片、覆金属箔层叠板及印刷电路板 |
| KR102643184B1 (ko) * | 2015-09-01 | 2024-03-04 | 에이지씨 가부시키가이샤 | 함불소 에테르 화합물, 함불소 에테르 조성물, 코팅액 및 물품 |
| JP6614014B2 (ja) | 2016-04-26 | 2019-12-04 | 信越化学工業株式会社 | 含窒素オルガノキシシラン化合物およびその製造方法 |
| GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
| WO2019066814A1 (en) * | 2017-09-27 | 2019-04-04 | Intel Corporation | BINDING METHOD USING REACTIONS BETWEEN MONOLAYERS |
| US11177232B2 (en) | 2018-01-23 | 2021-11-16 | Intel Corporation | Circuit device with monolayer bonding between surface structures |
| KR20210020891A (ko) * | 2018-05-09 | 2021-02-24 | 피셔 앤 페이켈 핼스케어 리미티드 | 기판에 열가소성 성형체가 접합된 의료기기 부품 (medical components with thermoplastic moldings bonded to substrates) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2715133A (en) | 1950-06-30 | 1955-08-09 | Dow Corning | Organosil ylamines |
| US2832754A (en) | 1955-01-21 | 1958-04-29 | Union Carbide Corp | Alkoxysilylpropylamines |
| US2920095A (en) * | 1958-02-24 | 1960-01-05 | Union Carbide Corp | Tris(trialkoxysilylpropyl)amines |
| US3469982A (en) | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| DE3120195C2 (de) | 1981-05-21 | 1986-09-04 | Degussa Ag, 6000 Frankfurt | Polymere Ammoniumverbindungen mit kieselsäureartigem Grundgerüst, Verfahren zu ihrer Herstellung und Verwendung |
| US4499152A (en) | 1982-08-09 | 1985-02-12 | General Electric Company | Metal-clad laminate construction |
| US4689085A (en) * | 1986-06-30 | 1987-08-25 | Dow Corning Corporation | Coupling agent compositions |
| US4775415A (en) | 1986-08-06 | 1988-10-04 | First Brands Corporation | Alcohol-based aluminum corrosion inhibitor compositions comprising polysilyl compounds |
| US5073456A (en) * | 1989-12-05 | 1991-12-17 | E. I. Du Pont De Nemours And Company | Multilayer printed circuit board formation |
| US5051129A (en) | 1990-06-25 | 1991-09-24 | Dow Corning Corporation | Masonry water repellent composition |
| DE4035032C1 (de) | 1990-11-03 | 1992-04-30 | Degussa Ag, 6000 Frankfurt, De | |
| US6004679A (en) * | 1991-03-14 | 1999-12-21 | General Electric Company | Laminates containing addition-curable silicone adhesive compositions |
| DE4113655A1 (de) * | 1991-04-26 | 1992-10-29 | Basf Lacke & Farben | Haftvermittler |
| US5101055A (en) | 1991-09-09 | 1992-03-31 | Dow Corning Corporation | Process for preparation of bis- and tris(silylorgano)amines |
| US5205860A (en) | 1992-01-23 | 1993-04-27 | Dow Corning Corporation | Water repellents containing organosilicon compounds |
-
1994
- 1994-11-02 IL IL11149794A patent/IL111497A/en not_active IP Right Cessation
- 1994-11-10 TW TW083110398A patent/TW293025B/zh not_active IP Right Cessation
- 1994-11-18 CA CA002136137A patent/CA2136137C/en not_active Expired - Fee Related
- 1994-11-18 KR KR1019940030400A patent/KR100308770B1/ko not_active IP Right Cessation
- 1994-12-07 DE DE69404017T patent/DE69404017T2/de not_active Expired - Lifetime
- 1994-12-07 EP EP94119323A patent/EP0657394B1/de not_active Expired - Lifetime
- 1994-12-08 JP JP6305254A patent/JPH07228702A/ja active Pending
-
1995
- 1995-01-20 US US08/376,282 patent/US6215011B1/en not_active Expired - Lifetime
- 1995-05-30 US US08/452,969 patent/US5639555A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR950018370A (ko) | 1995-07-22 |
| JPH07228702A (ja) | 1995-08-29 |
| US6215011B1 (en) | 2001-04-10 |
| DE69404017D1 (de) | 1997-08-07 |
| US5639555A (en) | 1997-06-17 |
| EP0657394A1 (de) | 1995-06-14 |
| DE69404017T2 (de) | 1998-02-19 |
| TW293025B (de) | 1996-12-11 |
| CA2136137A1 (en) | 1995-06-09 |
| EP0657394B1 (de) | 1997-07-02 |
| IL111497A0 (en) | 1995-01-24 |
| CA2136137C (en) | 2000-11-14 |
| KR100308770B1 (ko) | 2002-04-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| MM9K | Patent not in force due to non-payment of renewal fees |