ID27939A - Bahan-bahan perekat tahan api dan bahan-bahan sirkuit dengan penggunaan bahan-bahan perekat yang sama - Google Patents

Bahan-bahan perekat tahan api dan bahan-bahan sirkuit dengan penggunaan bahan-bahan perekat yang sama

Info

Publication number
ID27939A
ID27939A IDP20000903D ID20000903D ID27939A ID 27939 A ID27939 A ID 27939A ID P20000903 D IDP20000903 D ID P20000903D ID 20000903 D ID20000903 D ID 20000903D ID 27939 A ID27939 A ID 27939A
Authority
ID
Indonesia
Prior art keywords
materials
adhesive
circuit
same
same adhesive
Prior art date
Application number
IDP20000903D
Other languages
English (en)
Inventor
Atsushi Kuniyoshi
Takato Fujii
Masayuki Kumakura
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of ID27939A publication Critical patent/ID27939A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/5205—Salts of P-acids with N-bases
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C08K5/5333—Esters of phosphonic acids
    • C08K5/5353—Esters of phosphonic acids containing also nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fireproofing Substances (AREA)
IDP20000903D 1999-10-28 2000-10-19 Bahan-bahan perekat tahan api dan bahan-bahan sirkuit dengan penggunaan bahan-bahan perekat yang sama ID27939A (id)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30669999 1999-10-28
JP34271199A JP3598033B2 (ja) 1999-10-28 1999-12-02 難燃性接着剤及びこれを用いた回路材

Publications (1)

Publication Number Publication Date
ID27939A true ID27939A (id) 2001-05-03

Family

ID=26564829

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP20000903D ID27939A (id) 1999-10-28 2000-10-19 Bahan-bahan perekat tahan api dan bahan-bahan sirkuit dengan penggunaan bahan-bahan perekat yang sama

Country Status (9)

Country Link
US (1) US6753476B1 (id)
EP (1) EP1095975B1 (id)
JP (1) JP3598033B2 (id)
KR (1) KR100796966B1 (id)
CN (1) CN1179014C (id)
DE (1) DE60009229T2 (id)
ID (1) ID27939A (id)
MY (1) MY122527A (id)
TW (1) TW501389B (id)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155210A (ja) * 2000-09-06 2002-05-28 Toyobo Co Ltd 難燃性樹脂組成物及びこれを塗布又は積層した難燃性積層体
JP2003064339A (ja) * 2001-08-27 2003-03-05 Fujikura Ltd 接着剤
US20040256139A1 (en) * 2003-06-19 2004-12-23 Clark William T. Electrical cable comprising geometrically optimized conductors
US20100258344A1 (en) * 2005-02-09 2010-10-14 Laird Technologies, Inc. Flame retardant emi shields
DE102007036465A1 (de) * 2007-08-01 2009-02-05 Catena Additives Gmbh & Co. Kg Phosphorhaltige Triazin-Verbindungen als Flammschutzmittel
US9200122B2 (en) 2007-08-01 2015-12-01 J. M. Huber Corporation Triazine compounds containing phosphorous as flame retardants
CN103694922B (zh) * 2013-12-12 2015-06-03 江阴伟韬塑料新材料有限公司 一种应用于电子行业的无卤阻燃热熔胶膜及其制备方法
EP2883904A1 (en) * 2013-12-13 2015-06-17 Nexans Flame retardant polymeric material
JP6428028B2 (ja) * 2014-08-04 2018-11-28 住友電気工業株式会社 接着剤組成物、絶縁フィルム、絶縁フィルムの製造方法及びフラットケーブル
US10462928B2 (en) * 2017-11-24 2019-10-29 Super Micro Computer Inc. Composite cable assembly and server having the same
CN112331856B (zh) * 2020-11-03 2022-06-07 华东理工大学华昌聚合物有限公司 锂离子电池电极粘结剂及其制备方法和应用

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247831A (en) 1975-10-15 1977-04-16 Toyobo Co Ltd Flame-ratardant polyester hot-melt adhesive composition
US4072653A (en) * 1976-05-20 1978-02-07 Monsanto Company Polymeric phosphine oxide flame retardants
JPS54141792A (en) * 1978-03-20 1979-11-05 Yuka Melamin Manufacture of melamine cyanuric acid addition product
JPS54162174A (en) * 1978-06-14 1979-12-22 Sumitomo Bakelite Co Method of producing flexible printed circuit board
US4659872A (en) * 1985-04-30 1987-04-21 Amp Incorporated Flexible flat multiconductor cable
JPH01206575A (ja) * 1988-02-15 1989-08-18 Shin Etsu Polymer Co Ltd 接着性熱融着形コネクタ
JPH0828139B2 (ja) * 1988-09-20 1996-03-21 株式会社フジクラ テープ電線の製造方法
JP2941078B2 (ja) 1991-03-30 1999-08-25 城北化学工業株式会社 プラスチック用難燃剤
JPH06286081A (ja) * 1993-04-05 1994-10-11 Mitsubishi Kasei Vinyl Co 積層フィルム及びフラットケーブル
JPH07258479A (ja) * 1994-03-18 1995-10-09 Sumitomo Bakelite Co Ltd 難燃性ポリオレフィン系樹脂組成物及びその製造方法
US5578666A (en) 1994-07-29 1996-11-26 Polytechnic University Flame retardant composition
TW318861B (id) * 1994-08-16 1997-11-01 Mitsui Toatsu Chemicals
JP2987831B2 (ja) 1994-08-18 1999-12-06 ソニーケミカル株式会社 接着シート及びフラットケーブル
US6022914A (en) 1995-11-27 2000-02-08 3M Innovative Properties Company Pressure-sensitive adhesive composition and tapes
JPH10120881A (ja) * 1996-10-17 1998-05-12 Kanegafuchi Chem Ind Co Ltd 難燃性ポリエステル樹脂組成物
EP0877048A3 (en) * 1997-05-09 1998-12-30 Tokuyama Corporation Fire resistant resin composition
JPH10316843A (ja) * 1997-05-16 1998-12-02 Kanegafuchi Chem Ind Co Ltd 難燃性ポリエステル樹脂組成物
US6225383B1 (en) * 1997-05-26 2001-05-01 Mitsubishi Engineering Plastic Corp. Resin composition comprising polyamide resin
CN1204220C (zh) * 1998-05-19 2005-06-01 索尼化学株式会社 阻燃性粘合剂和用其制造的阻燃性粘合薄膜及扁形电缆
US6764765B2 (en) * 1998-05-19 2004-07-20 Sony Chemicals Corporation Fire-retardant adhesive, fire-retardant adhesive film using the same, and flat cable
US6166114A (en) * 1998-08-13 2000-12-26 E. I. Du Pont De Nemours And Company Fire and electrical resistant compositions
KR100503978B1 (ko) 1998-08-24 2005-07-27 니폰 가가쿠 고교 가부시키가이샤 난연제 조성물 및 난연성 수지 조성물
JP3438611B2 (ja) * 1998-10-06 2003-08-18 ソニーケミカル株式会社 難燃性接着フィルム及びフラットケーブル
JP3742522B2 (ja) * 1999-01-22 2006-02-08 株式会社カネカ 強化難燃性ポリエステル樹脂組成物
JP2001345990A (ja) * 2000-06-05 2001-12-14 Noritsu Koki Co Ltd ディジタルカメラの画像データ補正方法及びシステム

Also Published As

Publication number Publication date
EP1095975A3 (en) 2001-05-09
KR20010051281A (ko) 2001-06-25
JP2001192632A (ja) 2001-07-17
EP1095975B1 (en) 2004-03-24
DE60009229T2 (de) 2005-02-24
EP1095975A2 (en) 2001-05-02
TW501389B (en) 2002-09-01
JP3598033B2 (ja) 2004-12-08
US6753476B1 (en) 2004-06-22
KR100796966B1 (ko) 2008-01-22
DE60009229D1 (de) 2004-04-29
CN1294165A (zh) 2001-05-09
MY122527A (en) 2006-04-29
CN1179014C (zh) 2004-12-08

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