ID22705A - Struktur pemegang alat semikonduktor serta proses pemasangannya - Google Patents

Struktur pemegang alat semikonduktor serta proses pemasangannya

Info

Publication number
ID22705A
ID22705A IDW990702A ID990702A ID22705A ID 22705 A ID22705 A ID 22705A ID W990702 A IDW990702 A ID W990702A ID 990702 A ID990702 A ID 990702A ID 22705 A ID22705 A ID 22705A
Authority
ID
Indonesia
Prior art keywords
holder
installation process
semiconductor tools
tools
semiconductor
Prior art date
Application number
IDW990702A
Other languages
English (en)
Inventor
Iida Kazutoshi
Wigham Jon
Watanabe Masaki
Meguro Takeshi
Original Assignee
Loctite Corp
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp, Matsushita Electric Ind Co Ltd filed Critical Loctite Corp
Publication of ID22705A publication Critical patent/ID22705A/id

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
IDW990702A 1997-01-17 1998-01-16 Struktur pemegang alat semikonduktor serta proses pemasangannya ID22705A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00657597A JP3543902B2 (ja) 1997-01-17 1997-01-17 半導体装置の実装構造および実装方法

Publications (1)

Publication Number Publication Date
ID22705A true ID22705A (id) 1999-12-09

Family

ID=11642138

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW990702A ID22705A (id) 1997-01-17 1998-01-16 Struktur pemegang alat semikonduktor serta proses pemasangannya

Country Status (9)

Country Link
EP (1) EP0970520A4 (id)
JP (1) JP3543902B2 (id)
KR (1) KR100563158B1 (id)
CN (1) CN1112723C (id)
BR (1) BR9806742A (id)
CA (1) CA2278006A1 (id)
ID (1) ID22705A (id)
TW (1) TW396469B (id)
WO (1) WO1998032159A2 (id)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316528B1 (en) 1997-01-17 2001-11-13 Loctite (R&D) Limited Thermosetting resin compositions
JP3613367B2 (ja) * 1997-01-17 2005-01-26 ヘンケル コーポレイション 熱硬化性樹脂組成物
US6358354B1 (en) * 2000-07-05 2002-03-19 Lexmark International, Inc. UV and thermally curable adhesive formulation
JP5280597B2 (ja) 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
JP2006303192A (ja) * 2005-04-20 2006-11-02 Sumitomo Bakelite Co Ltd 半導体装置及びチップの再生方法
KR100757093B1 (ko) * 2005-07-20 2007-09-10 주식회사 룩스비타 카메라 모듈의 재생방법
JP5143019B2 (ja) 2006-12-04 2013-02-13 パナソニック株式会社 封止材料、実装方法、リペア方法および実装構造体
KR101719189B1 (ko) * 2011-04-04 2017-03-23 파나소닉 아이피 매니지먼트 가부시키가이샤 실장구조체 및 그 제조방법
TWI695657B (zh) * 2015-03-30 2020-06-01 日商則武股份有限公司 柔性配線基板及其利用
EP3911132B1 (en) * 2020-05-12 2024-07-03 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with a solid body protecting a component carrier hole from foreign material ingression
CN118197987B (zh) * 2024-05-17 2024-08-13 日月新半导体(威海)有限公司 一种可返修半导体封装结构及其形成方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US355580A (en) * 1887-01-04 Elijah windsor
US4159976A (en) * 1977-03-10 1979-07-03 Loctite Corporation Curable systems containing epoxy resin and methanol or ethanol solvent to suppress the catalytic reaction between epoxy resin and an imidazole catalytic curing agent
JPS60147140A (ja) * 1984-01-11 1985-08-03 Hitachi Ltd 半導体素子チツプの実装方法
JPS61255032A (ja) * 1985-05-08 1986-11-12 Seiko Epson Corp 半導体集積回路素子交換方法
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JP2620611B2 (ja) * 1989-01-12 1997-06-18 イビデン株式会社 電子部品搭載用基板
JP2679849B2 (ja) * 1989-07-26 1997-11-19 松下電器産業株式会社 電子部品の実装方法およびこの方法に用いる接着剤
US5089440A (en) * 1990-03-14 1992-02-18 International Business Machines Corporation Solder interconnection structure and process for making
JP2728106B2 (ja) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
JPH05109838A (ja) * 1991-10-21 1993-04-30 Fujitsu Ltd ベアチツプのリペア方法
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module
JPH06103707B2 (ja) * 1991-12-26 1994-12-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チップの交換方法
US5371328A (en) * 1993-08-20 1994-12-06 International Business Machines Corporation Component rework
US5567266A (en) * 1994-10-13 1996-10-22 Loctite Corporation Non-environmentally hazardous, non-volatile adhesive promoter composition for curing adhesives
JPH10107095A (ja) * 1996-10-01 1998-04-24 Matsushita Electric Ind Co Ltd 半導体装置の実装構造とリペア方法

Also Published As

Publication number Publication date
JPH10209342A (ja) 1998-08-07
CN1112723C (zh) 2003-06-25
KR20000070227A (ko) 2000-11-25
BR9806742A (pt) 2000-06-06
EP0970520A4 (en) 2000-08-30
TW396469B (en) 2000-07-01
CA2278006A1 (en) 1998-07-23
KR100563158B1 (ko) 2006-03-22
WO1998032159A3 (en) 1999-02-18
JP3543902B2 (ja) 2004-07-21
WO1998032159A2 (en) 1998-07-23
EP0970520A2 (en) 2000-01-12
CN1243601A (zh) 2000-02-02

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