WO1998032159A3 - Mounting structure and mounting process from semiconductor devices - Google Patents

Mounting structure and mounting process from semiconductor devices Download PDF

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Publication number
WO1998032159A3
WO1998032159A3 PCT/US1998/000856 US9800856W WO9832159A3 WO 1998032159 A3 WO1998032159 A3 WO 1998032159A3 US 9800856 W US9800856 W US 9800856W WO 9832159 A3 WO9832159 A3 WO 9832159A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor devices
mounting
mounting structure
circuit board
provides
Prior art date
Application number
PCT/US1998/000856
Other languages
French (fr)
Other versions
WO1998032159A2 (en
Inventor
Kazutoshi Iida
Jon Wigham
Masaki Watanabe
Takeshi Meguro
Original Assignee
Loctite Corp
Matsushita Electric Ind Co Ltd
Kazutoshi Iida
Jon Wigham
Masaki Watanabe
Takeshi Meguro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp, Matsushita Electric Ind Co Ltd, Kazutoshi Iida, Jon Wigham, Masaki Watanabe, Takeshi Meguro filed Critical Loctite Corp
Priority to BR9806742-7A priority Critical patent/BR9806742A/en
Priority to CA002278006A priority patent/CA2278006A1/en
Priority to KR1019997006453A priority patent/KR100563158B1/en
Priority to EP98902589A priority patent/EP0970520A4/en
Priority to US09/341,288 priority patent/US6274389B1/en
Publication of WO1998032159A2 publication Critical patent/WO1998032159A2/en
Publication of WO1998032159A3 publication Critical patent/WO1998032159A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device (4), such as CSP/BGA, to be securely fixed to a circuit board (5) by short-time heat curing (10), which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices.
PCT/US1998/000856 1997-01-17 1998-01-16 Mounting structure and mounting process from semiconductor devices WO1998032159A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
BR9806742-7A BR9806742A (en) 1997-01-17 1998-01-16 Assembly structure and assembly process for semiconductor devices.
CA002278006A CA2278006A1 (en) 1997-01-17 1998-01-16 Mounting structure and mounting process from semiconductor devices
KR1019997006453A KR100563158B1 (en) 1997-01-17 1998-01-16 Semiconductor device assembly and preparation process thereof
EP98902589A EP0970520A4 (en) 1997-01-17 1998-01-16 Mounting structure and mounting process from semiconductor devices
US09/341,288 US6274389B1 (en) 1997-01-17 1998-01-16 Mounting structure and mounting process from semiconductor devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP00657597A JP3543902B2 (en) 1997-01-17 1997-01-17 Semiconductor device mounting structure and mounting method
JP9/6575 1997-01-17

Publications (2)

Publication Number Publication Date
WO1998032159A2 WO1998032159A2 (en) 1998-07-23
WO1998032159A3 true WO1998032159A3 (en) 1999-02-18

Family

ID=11642138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/000856 WO1998032159A2 (en) 1997-01-17 1998-01-16 Mounting structure and mounting process from semiconductor devices

Country Status (9)

Country Link
EP (1) EP0970520A4 (en)
JP (1) JP3543902B2 (en)
KR (1) KR100563158B1 (en)
CN (1) CN1112723C (en)
BR (1) BR9806742A (en)
CA (1) CA2278006A1 (en)
ID (1) ID22705A (en)
TW (1) TW396469B (en)
WO (1) WO1998032159A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316528B1 (en) 1997-01-17 2001-11-13 Loctite (R&D) Limited Thermosetting resin compositions
JP3613367B2 (en) * 1997-01-17 2005-01-26 ヘンケル コーポレイション Thermosetting resin composition
US6358354B1 (en) * 2000-07-05 2002-03-19 Lexmark International, Inc. UV and thermally curable adhesive formulation
JP5280597B2 (en) 2001-03-30 2013-09-04 サンスター技研株式会社 One-component thermosetting epoxy resin composition and underfill material for semiconductor mounting
JP2006303192A (en) * 2005-04-20 2006-11-02 Sumitomo Bakelite Co Ltd Semiconductor device and method for reproducing chip
KR100757093B1 (en) * 2005-07-20 2007-09-10 주식회사 룩스비타 Reproduction Method of Camera Module
JP5143019B2 (en) 2006-12-04 2013-02-13 パナソニック株式会社 Sealing material, mounting method, repair method, and mounting structure
KR101719189B1 (en) 2011-04-04 2017-03-23 파나소닉 아이피 매니지먼트 가부시키가이샤 Mounting structure and method for manufacturing same
TWI695657B (en) * 2015-03-30 2020-06-01 日商則武股份有限公司 Flexible wiring board and its utilization
EP3911132A1 (en) * 2020-05-12 2021-11-17 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with a solid body protecting a component carrier hole from foreign material ingression

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120665A (en) * 1988-12-05 1992-06-09 Hitachi Chemical Company Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
US5250848A (en) * 1990-03-14 1993-10-05 International Business Machines Corporation Solder interconnection structure
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module
US5355580A (en) * 1991-12-26 1994-10-18 International Business Machines Method for replacing semiconductor chips
US5371328A (en) * 1993-08-20 1994-12-06 International Business Machines Corporation Component rework

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US355580A (en) * 1887-01-04 Elijah windsor
US4159976A (en) * 1977-03-10 1979-07-03 Loctite Corporation Curable systems containing epoxy resin and methanol or ethanol solvent to suppress the catalytic reaction between epoxy resin and an imidazole catalytic curing agent
JPS60147140A (en) * 1984-01-11 1985-08-03 Hitachi Ltd Mounting process of semiconductor element chip
JPS61255032A (en) * 1985-05-08 1986-11-12 Seiko Epson Corp Replacement of semiconductor integrated circuit element
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
JP2620611B2 (en) * 1989-01-12 1997-06-18 イビデン株式会社 Substrate for mounting electronic components
JP2679849B2 (en) * 1989-07-26 1997-11-19 松下電器産業株式会社 Electronic component mounting method and adhesive used in this method
JP2728106B2 (en) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション Cleavable diepoxide for removable device protection in electronic packaging
JPH05109838A (en) * 1991-10-21 1993-04-30 Fujitsu Ltd Repair method for bare chip
US5567266A (en) * 1994-10-13 1996-10-22 Loctite Corporation Non-environmentally hazardous, non-volatile adhesive promoter composition for curing adhesives
JPH10107095A (en) * 1996-10-01 1998-04-24 Matsushita Electric Ind Co Ltd Mounting structure and repairing method for semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120665A (en) * 1988-12-05 1992-06-09 Hitachi Chemical Company Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
US5250848A (en) * 1990-03-14 1993-10-05 International Business Machines Corporation Solder interconnection structure
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module
US5355580A (en) * 1991-12-26 1994-10-18 International Business Machines Method for replacing semiconductor chips
US5371328A (en) * 1993-08-20 1994-12-06 International Business Machines Corporation Component rework

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0970520A4 *

Also Published As

Publication number Publication date
CA2278006A1 (en) 1998-07-23
CN1112723C (en) 2003-06-25
TW396469B (en) 2000-07-01
JP3543902B2 (en) 2004-07-21
BR9806742A (en) 2000-06-06
ID22705A (en) 1999-12-09
EP0970520A2 (en) 2000-01-12
KR20000070227A (en) 2000-11-25
JPH10209342A (en) 1998-08-07
WO1998032159A2 (en) 1998-07-23
KR100563158B1 (en) 2006-03-22
CN1243601A (en) 2000-02-02
EP0970520A4 (en) 2000-08-30

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