ID17398A - Dimerkaptan teralkoksilasi sebagai bahan aditif tembaga - Google Patents

Dimerkaptan teralkoksilasi sebagai bahan aditif tembaga

Info

Publication number
ID17398A
ID17398A IDP971835A ID971835A ID17398A ID 17398 A ID17398 A ID 17398A ID P971835 A IDP971835 A ID P971835A ID 971835 A ID971835 A ID 971835A ID 17398 A ID17398 A ID 17398A
Authority
ID
Indonesia
Prior art keywords
thaloxoxation
calculated
additive materials
copper additive
electrodes
Prior art date
Application number
IDP971835A
Other languages
English (en)
Indonesian (id)
Inventor
Sylvia Martin
Original Assignee
Enthone Omi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Omi Inc filed Critical Enthone Omi Inc
Publication of ID17398A publication Critical patent/ID17398A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Push-Button Switches (AREA)
  • Fodder In General (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Organic Insulating Materials (AREA)
IDP971835A 1996-05-30 1997-05-30 Dimerkaptan teralkoksilasi sebagai bahan aditif tembaga ID17398A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/656,410 US5730854A (en) 1996-05-30 1996-05-30 Alkoxylated dimercaptans as copper additives and de-polarizing additives

Publications (1)

Publication Number Publication Date
ID17398A true ID17398A (id) 1997-12-24

Family

ID=24632921

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP971835A ID17398A (id) 1996-05-30 1997-05-30 Dimerkaptan teralkoksilasi sebagai bahan aditif tembaga

Country Status (14)

Country Link
US (1) US5730854A (fr)
EP (1) EP0912777B1 (fr)
JP (1) JP3306438B2 (fr)
CN (1) CN1220709A (fr)
AT (1) ATE221583T1 (fr)
AU (1) AU706220B2 (fr)
BR (1) BR9709899A (fr)
CO (1) CO4780049A1 (fr)
DE (1) DE69714446T2 (fr)
ES (1) ES2181000T3 (fr)
ID (1) ID17398A (fr)
PE (1) PE38598A1 (fr)
TW (1) TW432127B (fr)
WO (1) WO1997045571A2 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) * 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6605204B1 (en) 1999-10-14 2003-08-12 Atofina Chemicals, Inc. Electroplating of copper from alkanesulfonate electrolytes
KR100366631B1 (ko) 2000-09-27 2003-01-09 삼성전자 주식회사 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US20040046121A1 (en) * 2001-07-15 2004-03-11 Golden Josh H. Method and system for analyte determination in metal plating baths
US20030030800A1 (en) * 2001-07-15 2003-02-13 Golden Josh H. Method and system for the determination of arsenic in aqueous media
US20030049858A1 (en) * 2001-07-15 2003-03-13 Golden Josh H. Method and system for analyte determination in metal plating baths
US20030049850A1 (en) * 2001-09-12 2003-03-13 Golden Josh H. Enhanced detection of metal plating additives
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US7182849B2 (en) * 2004-02-27 2007-02-27 Taiwan Semiconducotr Manufacturing Co., Ltd. ECP polymer additives and method for reducing overburden and defects
CN101302635B (zh) * 2008-01-18 2010-12-08 梁国柱 钢铁件酸性预镀铜电镀添加剂及预镀工艺
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
JP5363523B2 (ja) * 2011-03-28 2013-12-11 上村工業株式会社 電気銅めっき用添加剤及び電気銅めっき浴
JP6318719B2 (ja) * 2014-03-10 2018-05-09 住友金属鉱山株式会社 硫酸系銅電解液、及びこの電解液を用いたデンドライト状銅粉の製造方法
JP6318718B2 (ja) * 2014-03-10 2018-05-09 住友金属鉱山株式会社 硫酸系銅電解液、及びこの電解液を用いた粒状銅粉の製造方法
CN114214677A (zh) * 2021-12-30 2022-03-22 佛山亚特表面技术材料有限公司 一种酸性镀铜深孔剂及其制备方法与电镀方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
SE322956B (fr) * 1966-08-20 1970-04-20 Schering Ag
GB1235101A (en) * 1967-05-01 1971-06-09 Albright & Wilson Mfg Ltd Improvements relating to electrodeposition of copper
FR2085243A1 (fr) * 1970-04-01 1971-12-24 Peugeot & Renault
DE2039831C3 (de) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US3987246A (en) * 1970-07-21 1976-10-19 Electromitor, Inc. Apparatus for automatically sending data over a telephone system from a remote station to a central station
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3985784A (en) * 1972-07-10 1976-10-12 Oxy Metal Industries Corporation Thioether sulfonates for use in electroplating baths
IT1046971B (it) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Begno per l elettrodeposizione di rame e metodo per prepararlo
US4292155A (en) * 1979-10-31 1981-09-29 Ppg Industries, Inc. Cationic electrodeposition employing novel mercapto chain extended products
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
GB8801736D0 (en) * 1988-01-27 1988-02-24 Ciba Geigy Ag Method of making patterns
US5219523A (en) * 1989-05-08 1993-06-15 Calgon Corporation Copper and copper alloy corrosion inhibitors
DE69110208T2 (de) * 1990-08-03 1995-10-19 Rohco Inc Mcgean Kupferplattieren von Tiefdruckzylindern.
US5236626A (en) * 1990-09-24 1993-08-17 Calgon Corporation Alkoxybenzotriazole compositions and the use thereof as copper and copper alloy corrosion inhibitors
GB9114098D0 (en) * 1991-06-29 1991-08-14 Ciba Geigy Ag Method of making patterns
US5200057A (en) * 1991-11-05 1993-04-06 Mcgean-Rohco, Inc. Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodedepositing zinc and zinc alloys
US5151170A (en) * 1991-12-19 1992-09-29 Mcgean-Rohco, Inc. Acid copper electroplating bath containing brightening additive
US5256275A (en) * 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
CA2155207C (fr) * 1993-04-19 2000-05-16 David P. Burgess Procede utilise pour fabriquer une poudre metallique de cuivre, des oxydes de cuivre et une feuille de cuivre
US5425873A (en) * 1994-04-11 1995-06-20 Shipley Company Llc Electroplating process

Also Published As

Publication number Publication date
AU3136597A (en) 1998-01-05
DE69714446T2 (de) 2002-11-14
WO1997045571A2 (fr) 1997-12-04
JP3306438B2 (ja) 2002-07-24
CN1220709A (zh) 1999-06-23
PE38598A1 (es) 1998-07-20
ATE221583T1 (de) 2002-08-15
TW432127B (en) 2001-05-01
BR9709899A (pt) 2000-01-25
DE69714446D1 (de) 2002-09-05
EP0912777B1 (fr) 2002-07-31
CO4780049A1 (es) 1999-05-26
JP2000511235A (ja) 2000-08-29
EP0912777A2 (fr) 1999-05-06
US5730854A (en) 1998-03-24
AU706220B2 (en) 1999-06-10
ES2181000T3 (es) 2003-02-16
WO1997045571A3 (fr) 1998-02-19

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