ES2181000T3 - Dimercaptanos alcoxilados como aditivos de cobre. - Google Patents
Dimercaptanos alcoxilados como aditivos de cobre.Info
- Publication number
- ES2181000T3 ES2181000T3 ES97926652T ES97926652T ES2181000T3 ES 2181000 T3 ES2181000 T3 ES 2181000T3 ES 97926652 T ES97926652 T ES 97926652T ES 97926652 T ES97926652 T ES 97926652T ES 2181000 T3 ES2181000 T3 ES 2181000T3
- Authority
- ES
- Spain
- Prior art keywords
- dimercaptanos
- alcoxilados
- additives
- copper additives
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000654 additive Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Electrolytic Production Of Metals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Organic Insulating Materials (AREA)
- Fodder In General (AREA)
- Push-Button Switches (AREA)
Abstract
UN PROCEDIMIENTO DE ELECTROCOBREADO EN EL QUE SE UTILIZAN ETERES DE DIMERCAPTANO ALCOXILADO COMO ADITIVOS. LOS ADITIVOS EVITAN LAS FORMACIONES DENDRITICAS QUE ELIMINAN ELECTRODOS POR CORTOCIRCUITO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/656,410 US5730854A (en) | 1996-05-30 | 1996-05-30 | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2181000T3 true ES2181000T3 (es) | 2003-02-16 |
Family
ID=24632921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97926652T Expired - Lifetime ES2181000T3 (es) | 1996-05-30 | 1997-05-15 | Dimercaptanos alcoxilados como aditivos de cobre. |
Country Status (14)
Country | Link |
---|---|
US (1) | US5730854A (es) |
EP (1) | EP0912777B1 (es) |
JP (1) | JP3306438B2 (es) |
CN (1) | CN1220709A (es) |
AT (1) | ATE221583T1 (es) |
AU (1) | AU706220B2 (es) |
BR (1) | BR9709899A (es) |
CO (1) | CO4780049A1 (es) |
DE (1) | DE69714446T2 (es) |
ES (1) | ES2181000T3 (es) |
ID (1) | ID17398A (es) |
PE (1) | PE38598A1 (es) |
TW (1) | TW432127B (es) |
WO (1) | WO1997045571A2 (es) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7244677B2 (en) * | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
US6197181B1 (en) * | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
US6605204B1 (en) | 1999-10-14 | 2003-08-12 | Atofina Chemicals, Inc. | Electroplating of copper from alkanesulfonate electrolytes |
KR100366631B1 (ko) | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
US6776893B1 (en) | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
US20030030800A1 (en) * | 2001-07-15 | 2003-02-13 | Golden Josh H. | Method and system for the determination of arsenic in aqueous media |
US20040046121A1 (en) * | 2001-07-15 | 2004-03-11 | Golden Josh H. | Method and system for analyte determination in metal plating baths |
US20030049858A1 (en) * | 2001-07-15 | 2003-03-13 | Golden Josh H. | Method and system for analyte determination in metal plating baths |
WO2003023395A1 (en) * | 2001-09-12 | 2003-03-20 | Microbar Systems, Inc. | Enhanced detection of metal plating additives |
US7025866B2 (en) * | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US7182849B2 (en) * | 2004-02-27 | 2007-02-27 | Taiwan Semiconducotr Manufacturing Co., Ltd. | ECP polymer additives and method for reducing overburden and defects |
CN101302635B (zh) * | 2008-01-18 | 2010-12-08 | 梁国柱 | 钢铁件酸性预镀铜电镀添加剂及预镀工艺 |
DE102011008836B4 (de) * | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten |
JP5363523B2 (ja) * | 2011-03-28 | 2013-12-11 | 上村工業株式会社 | 電気銅めっき用添加剤及び電気銅めっき浴 |
JP6318719B2 (ja) * | 2014-03-10 | 2018-05-09 | 住友金属鉱山株式会社 | 硫酸系銅電解液、及びこの電解液を用いたデンドライト状銅粉の製造方法 |
JP6318718B2 (ja) * | 2014-03-10 | 2018-05-09 | 住友金属鉱山株式会社 | 硫酸系銅電解液、及びこの電解液を用いた粒状銅粉の製造方法 |
CN114214677A (zh) * | 2021-12-30 | 2022-03-22 | 佛山亚特表面技术材料有限公司 | 一种酸性镀铜深孔剂及其制备方法与电镀方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
SE322956B (es) * | 1966-08-20 | 1970-04-20 | Schering Ag | |
GB1235101A (en) * | 1967-05-01 | 1971-06-09 | Albright & Wilson Mfg Ltd | Improvements relating to electrodeposition of copper |
FR2085243A1 (es) * | 1970-04-01 | 1971-12-24 | Peugeot & Renault | |
DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
US3987246A (en) * | 1970-07-21 | 1976-10-19 | Electromitor, Inc. | Apparatus for automatically sending data over a telephone system from a remote station to a central station |
US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
US3985784A (en) * | 1972-07-10 | 1976-10-12 | Oxy Metal Industries Corporation | Thioether sulfonates for use in electroplating baths |
GB1526076A (en) * | 1975-03-11 | 1978-09-27 | Oxy Metal Industries Corp | Electrodeposition of copper |
US4292155A (en) * | 1979-10-31 | 1981-09-29 | Ppg Industries, Inc. | Cationic electrodeposition employing novel mercapto chain extended products |
US4272335A (en) * | 1980-02-19 | 1981-06-09 | Oxy Metal Industries Corporation | Composition and method for electrodeposition of copper |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
US4347108A (en) * | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
GB8801736D0 (en) * | 1988-01-27 | 1988-02-24 | Ciba Geigy Ag | Method of making patterns |
US5219523A (en) * | 1989-05-08 | 1993-06-15 | Calgon Corporation | Copper and copper alloy corrosion inhibitors |
EP0469724B1 (en) * | 1990-08-03 | 1995-06-07 | Mcgean-Rohco, Inc. | Copper plating of gravure rolls |
US5236626A (en) * | 1990-09-24 | 1993-08-17 | Calgon Corporation | Alkoxybenzotriazole compositions and the use thereof as copper and copper alloy corrosion inhibitors |
GB9114098D0 (en) * | 1991-06-29 | 1991-08-14 | Ciba Geigy Ag | Method of making patterns |
US5200057A (en) * | 1991-11-05 | 1993-04-06 | Mcgean-Rohco, Inc. | Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodedepositing zinc and zinc alloys |
US5151170A (en) * | 1991-12-19 | 1992-09-29 | Mcgean-Rohco, Inc. | Acid copper electroplating bath containing brightening additive |
US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
EP0695377B1 (en) * | 1993-04-19 | 2001-06-27 | GA-TEK Inc. | Process for making copper metal powder, copper oxides and copper foil |
US5425873A (en) * | 1994-04-11 | 1995-06-20 | Shipley Company Llc | Electroplating process |
-
1996
- 1996-05-30 US US08/656,410 patent/US5730854A/en not_active Expired - Lifetime
-
1997
- 1997-05-15 CN CN97195088.1A patent/CN1220709A/zh active Pending
- 1997-05-15 AU AU31365/97A patent/AU706220B2/en not_active Ceased
- 1997-05-15 BR BR9709899-0A patent/BR9709899A/pt not_active Application Discontinuation
- 1997-05-15 JP JP54269597A patent/JP3306438B2/ja not_active Expired - Fee Related
- 1997-05-15 ES ES97926652T patent/ES2181000T3/es not_active Expired - Lifetime
- 1997-05-15 AT AT97926652T patent/ATE221583T1/de not_active IP Right Cessation
- 1997-05-15 EP EP97926652A patent/EP0912777B1/en not_active Expired - Lifetime
- 1997-05-15 DE DE69714446T patent/DE69714446T2/de not_active Expired - Fee Related
- 1997-05-15 WO PCT/US1997/008632 patent/WO1997045571A2/en active IP Right Grant
- 1997-05-16 PE PE1997000380A patent/PE38598A1/es not_active Application Discontinuation
- 1997-05-23 CO CO97028493A patent/CO4780049A1/es unknown
- 1997-05-24 TW TW086107050A patent/TW432127B/zh not_active IP Right Cessation
- 1997-05-30 ID IDP971835A patent/ID17398A/id unknown
Also Published As
Publication number | Publication date |
---|---|
ID17398A (id) | 1997-12-24 |
EP0912777A2 (en) | 1999-05-06 |
AU706220B2 (en) | 1999-06-10 |
WO1997045571A3 (en) | 1998-02-19 |
BR9709899A (pt) | 2000-01-25 |
DE69714446D1 (de) | 2002-09-05 |
ATE221583T1 (de) | 2002-08-15 |
CO4780049A1 (es) | 1999-05-26 |
JP2000511235A (ja) | 2000-08-29 |
CN1220709A (zh) | 1999-06-23 |
WO1997045571A2 (en) | 1997-12-04 |
TW432127B (en) | 2001-05-01 |
PE38598A1 (es) | 1998-07-20 |
DE69714446T2 (de) | 2002-11-14 |
JP3306438B2 (ja) | 2002-07-24 |
AU3136597A (en) | 1998-01-05 |
US5730854A (en) | 1998-03-24 |
EP0912777B1 (en) | 2002-07-31 |
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