ES2133857T3 - Placa de circuitos asi como procedimiento para la fabricacion de una placa de circuitos. - Google Patents

Placa de circuitos asi como procedimiento para la fabricacion de una placa de circuitos.

Info

Publication number
ES2133857T3
ES2133857T3 ES96104392T ES96104392T ES2133857T3 ES 2133857 T3 ES2133857 T3 ES 2133857T3 ES 96104392 T ES96104392 T ES 96104392T ES 96104392 T ES96104392 T ES 96104392T ES 2133857 T3 ES2133857 T3 ES 2133857T3
Authority
ES
Spain
Prior art keywords
circuit board
deck
procedure
well
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96104392T
Other languages
English (en)
Inventor
Peter Dr Dipl-Ing Baur
Harald Dipl-Phys Kazmierczak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of ES2133857T3 publication Critical patent/ES2133857T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

LA INVENCION SE REFIERE A UNA PLETINA DE CIRCUITO ASI COMO UN PROCEDIMIENTO PARA LA ELABORACION DE UNA PLETINA DE CIRCUITO, EN PARTICULAR PARA LA APLICACION ELECTRICA CENTRAL DE UN AUTOMOVIL, CON UNA PLETINA (12) SOPORTE, QUE MUESTRA UNA ESTRUCTURA (20) DE BANDA CONDUCTORA PARA LA UNION DE LOS ELEMENTOS (24) COMPONENTES ELECTRONICOS, QUE SON OPERADOS CON BAJA CORRIENTE, Y MUESTRA ROTURAS PARA LA RECEPCION DE CONTACTOS ELECTRICOS. SE HA PREVISTO, QUE AL MENOS UNA PLETINA (14,16) DE CONDUCTOR SE APLIQUE PARA ALTA CORRIENTE DIRECTAMENTE SOBRE LA PLETINA SOPORTE Y QUE SE UNA ELECTRICAMENTE POR MEDIO DE CONTACTOS (38) ENCHUFABLES Y/O DE PRESIONADO CON LA PLETINA (12) SOPORTE. LA ESTRUCTURA (30) DE BANDA CONDUCTORA DE LA PLETINA (14,16) DE CONDUCTORES DE ALTA CORRIENTE SE AJUSTA CON PREFERENCIA A TRAVES DE ESTAMPACION A PARTIR DE LA CHAPA O DE LA LAMINA.
ES96104392T 1995-09-23 1996-03-20 Placa de circuitos asi como procedimiento para la fabricacion de una placa de circuitos. Expired - Lifetime ES2133857T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19535490A DE19535490A1 (de) 1995-09-23 1995-09-23 Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine

Publications (1)

Publication Number Publication Date
ES2133857T3 true ES2133857T3 (es) 1999-09-16

Family

ID=7773034

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96104392T Expired - Lifetime ES2133857T3 (es) 1995-09-23 1996-03-20 Placa de circuitos asi como procedimiento para la fabricacion de una placa de circuitos.

Country Status (3)

Country Link
EP (1) EP0765110B1 (es)
DE (2) DE19535490A1 (es)
ES (1) ES2133857T3 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19825724A1 (de) * 1998-06-09 1999-12-16 Mannesmann Vdo Ag Elektrische Schaltungsanordnung und Verfahren zu ihrer Herstellung
DE19949141A1 (de) * 1999-10-12 2001-06-13 Bosch Gmbh Robert Multilayer-Anordnung
DE10120692B4 (de) * 2001-04-27 2004-02-12 Siemens Ag Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte
US7167377B2 (en) * 2001-11-26 2007-01-23 Sumitoo Wiring Systems, Ltd. Circuit-constituting unit and method of producing the same
DE10202095A1 (de) * 2002-01-21 2003-07-24 Siemens Ag Elektrisches Gerät
DE102004006575A1 (de) * 2004-02-11 2005-09-01 Leopold Kostal Gmbh & Co Kg Leistungsverteiler für ein Kraftfahrzeug
DE502004003942D1 (de) * 2004-03-11 2007-07-12 Siemens Ag Steuergerät
DE102004013477A1 (de) * 2004-03-18 2005-10-06 Epcos Ag Trägerplattform für Leistungselektronik-Bauelemente und Modul mit der Trägerplattform
DE102008030367B4 (de) * 2008-06-26 2011-02-17 Continental Automotive Gmbh Leiterplattenanordnung
DE102012211759B4 (de) * 2012-07-05 2024-05-16 Kiekert Aktiengesellschaft Elektrokomponententräger mit selbstdichtender Kontaktierung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE478666C (de) * 1929-07-01 Walter Zwick Dr Ing Schaltverfahren
US4076356A (en) * 1976-10-18 1978-02-28 Bell Telephone Laboratories, Incorporated Interconnection pin for multilayer printed circuit boards
AT374331B (de) * 1979-05-31 1984-04-10 Siemens Ag Oesterreich Einpolige mehrstufige umschalteinrichtung fuer auf printplatten gedruckte schaltungen
JPH0412714Y2 (es) * 1984-10-09 1992-03-26
CA1291274C (en) * 1987-10-05 1991-10-22 Cray Research, Inc. Wire/disk board-to-board interconnect device
JPH0562743A (ja) * 1991-08-30 1993-03-12 Fujitsu Ltd 電子装置におけるモジユール用コネクタ構造

Also Published As

Publication number Publication date
EP0765110B1 (de) 1999-06-02
EP0765110A1 (de) 1997-03-26
DE19535490A1 (de) 1997-03-27
DE59602071D1 (de) 1999-07-08

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