PE38598A1 - Dimercaptanos alcoxilados como aditivos de cobre - Google Patents
Dimercaptanos alcoxilados como aditivos de cobreInfo
- Publication number
- PE38598A1 PE38598A1 PE1997000380A PE00038097A PE38598A1 PE 38598 A1 PE38598 A1 PE 38598A1 PE 1997000380 A PE1997000380 A PE 1997000380A PE 00038097 A PE00038097 A PE 00038097A PE 38598 A1 PE38598 A1 PE 38598A1
- Authority
- PE
- Peru
- Prior art keywords
- copper
- additive
- mixtures
- bath
- sulfur
- Prior art date
Links
- 239000000654 additive Substances 0.000 title abstract 5
- 230000000996 additive effect Effects 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- 230000002999 depolarising effect Effects 0.000 abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 210000001787 dendrite Anatomy 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 abstract 1
- 229910052698 phosphorus Chemical group 0.000 abstract 1
- 239000011574 phosphorus Chemical group 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Electrolytic Production Of Metals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Organic Insulating Materials (AREA)
- Fodder In General (AREA)
- Push-Button Switches (AREA)
Abstract
SE REFIERE A UN ADITIVO PARA PRODUCIR DEPOSITOS DE COBRE ABRILLANTADO SUSTANCIALMENTE LIBRES DE DENDRITAS, NODULOS Y AZUFRE COMO IMPUREZA QUE COMPRENDE UN ETER DE DIMERCAPTANO ALCOXILADO DE FORMULA (I) DONDE: R ES UNA PORCION DE ALQUIL SELECCIONADO DE ETIL, PROPIL, BUTIL Y MEZCLAS DE ESTOS; Z ES SELECCIONADO DE R1-O-R1, R1-O-Y, Y-O-Y, e Y-Y; R1 ES SELECCIONADO DE ETIL, PROPIL, e Y, O MEZCLAS DE ESTOS; Y ES SELECCIONADO DE R-OH y -R(OH)2- O MEZCLAS DE ESTOS; X ES SELECCIONADO DEL GRUPO CONFORMADO POR (O-R1)p DONDE p=0 a 3 Y m+n ESTA ENTRE 8 Y 100; DICHO ADITIVO ESTA PRESENTE EN CANTIDADES ENTRE 5 mg/l Y 1000 mg/l EN UN BANO DE ELECTROPLAQUEADO O ELECTROREFINADO CON IONES DE COBRE DEPOSITABLE. SE REFIERE ADEMAS A UN ADITIVO DESPOLARIZANTE DE FORMULA (II) DONDE: R1 Y R2 SON GRUPOS ALQUIL CON 1 A 6 ATOMOS DE CARBONO; A SE SELECCIONA DE H, SULFONATO, FOSFONATO ENTRE OTROS; B SE SELECCIONA DE H, UN ION METALICO DEL GRUPO I o II, UN ION AMONIO Y MEZCLAS DE LOS MISMOS; Q SE SELECCIONA DE AZUFRE O FOSFORO; DICHO ADITIVO DESPOLARIZANTE ES USADO EN CANTIDADES QUE FLUCTUAN ENTRE 0.01 mg/l Y 25 mg/l EN UN BANO DE ELECTROREFINAMIENTO DE COBRE Y ENTRE 0.5 mg/l Y 60 mg/l EN UN BANO DE ELECTROPLAQUEADO DE COBRE
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/656,410 US5730854A (en) | 1996-05-30 | 1996-05-30 | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
Publications (1)
Publication Number | Publication Date |
---|---|
PE38598A1 true PE38598A1 (es) | 1998-07-20 |
Family
ID=24632921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PE1997000380A PE38598A1 (es) | 1996-05-30 | 1997-05-16 | Dimercaptanos alcoxilados como aditivos de cobre |
Country Status (14)
Country | Link |
---|---|
US (1) | US5730854A (es) |
EP (1) | EP0912777B1 (es) |
JP (1) | JP3306438B2 (es) |
CN (1) | CN1220709A (es) |
AT (1) | ATE221583T1 (es) |
AU (1) | AU706220B2 (es) |
BR (1) | BR9709899A (es) |
CO (1) | CO4780049A1 (es) |
DE (1) | DE69714446T2 (es) |
ES (1) | ES2181000T3 (es) |
ID (1) | ID17398A (es) |
PE (1) | PE38598A1 (es) |
TW (1) | TW432127B (es) |
WO (1) | WO1997045571A2 (es) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
US6605204B1 (en) | 1999-10-14 | 2003-08-12 | Atofina Chemicals, Inc. | Electroplating of copper from alkanesulfonate electrolytes |
KR100366631B1 (ko) | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
US6776893B1 (en) | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
US20030030800A1 (en) * | 2001-07-15 | 2003-02-13 | Golden Josh H. | Method and system for the determination of arsenic in aqueous media |
US20040046121A1 (en) * | 2001-07-15 | 2004-03-11 | Golden Josh H. | Method and system for analyte determination in metal plating baths |
US20030049858A1 (en) * | 2001-07-15 | 2003-03-13 | Golden Josh H. | Method and system for analyte determination in metal plating baths |
US20030049850A1 (en) * | 2001-09-12 | 2003-03-13 | Golden Josh H. | Enhanced detection of metal plating additives |
US7025866B2 (en) * | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US7182849B2 (en) * | 2004-02-27 | 2007-02-27 | Taiwan Semiconducotr Manufacturing Co., Ltd. | ECP polymer additives and method for reducing overburden and defects |
CN101302635B (zh) * | 2008-01-18 | 2010-12-08 | 梁国柱 | 钢铁件酸性预镀铜电镀添加剂及预镀工艺 |
DE102011008836B4 (de) * | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten |
JP5363523B2 (ja) * | 2011-03-28 | 2013-12-11 | 上村工業株式会社 | 電気銅めっき用添加剤及び電気銅めっき浴 |
JP6318718B2 (ja) * | 2014-03-10 | 2018-05-09 | 住友金属鉱山株式会社 | 硫酸系銅電解液、及びこの電解液を用いた粒状銅粉の製造方法 |
JP6318719B2 (ja) * | 2014-03-10 | 2018-05-09 | 住友金属鉱山株式会社 | 硫酸系銅電解液、及びこの電解液を用いたデンドライト状銅粉の製造方法 |
CN114214677A (zh) * | 2021-12-30 | 2022-03-22 | 佛山亚特表面技术材料有限公司 | 一种酸性镀铜深孔剂及其制备方法与电镀方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
SE322956B (es) * | 1966-08-20 | 1970-04-20 | Schering Ag | |
GB1235101A (en) * | 1967-05-01 | 1971-06-09 | Albright & Wilson Mfg Ltd | Improvements relating to electrodeposition of copper |
FR2085243A1 (es) * | 1970-04-01 | 1971-12-24 | Peugeot & Renault | |
DE2039831C3 (de) * | 1970-06-06 | 1979-09-06 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge |
US3987246A (en) * | 1970-07-21 | 1976-10-19 | Electromitor, Inc. | Apparatus for automatically sending data over a telephone system from a remote station to a central station |
US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
US3985784A (en) * | 1972-07-10 | 1976-10-12 | Oxy Metal Industries Corporation | Thioether sulfonates for use in electroplating baths |
SE444822B (sv) * | 1975-03-11 | 1986-05-12 | Oxy Metal Industries Corp | Bad och medel for elektrolytisk utfellning av koppar |
US4292155A (en) * | 1979-10-31 | 1981-09-29 | Ppg Industries, Inc. | Cationic electrodeposition employing novel mercapto chain extended products |
US4272335A (en) * | 1980-02-19 | 1981-06-09 | Oxy Metal Industries Corporation | Composition and method for electrodeposition of copper |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
US4347108A (en) * | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
GB8801736D0 (en) * | 1988-01-27 | 1988-02-24 | Ciba Geigy Ag | Method of making patterns |
US5219523A (en) * | 1989-05-08 | 1993-06-15 | Calgon Corporation | Copper and copper alloy corrosion inhibitors |
DE69110208T2 (de) * | 1990-08-03 | 1995-10-19 | Rohco Inc Mcgean | Kupferplattieren von Tiefdruckzylindern. |
US5236626A (en) * | 1990-09-24 | 1993-08-17 | Calgon Corporation | Alkoxybenzotriazole compositions and the use thereof as copper and copper alloy corrosion inhibitors |
GB9114098D0 (en) * | 1991-06-29 | 1991-08-14 | Ciba Geigy Ag | Method of making patterns |
US5200057A (en) * | 1991-11-05 | 1993-04-06 | Mcgean-Rohco, Inc. | Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodedepositing zinc and zinc alloys |
US5151170A (en) * | 1991-12-19 | 1992-09-29 | Mcgean-Rohco, Inc. | Acid copper electroplating bath containing brightening additive |
US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
RU2126312C1 (ru) * | 1993-04-19 | 1999-02-20 | ЭлектроКуппер Продактс Лимитед | Способ получения металлического порошка, оксидов меди и медной фольги |
US5425873A (en) * | 1994-04-11 | 1995-06-20 | Shipley Company Llc | Electroplating process |
-
1996
- 1996-05-30 US US08/656,410 patent/US5730854A/en not_active Expired - Lifetime
-
1997
- 1997-05-15 JP JP54269597A patent/JP3306438B2/ja not_active Expired - Fee Related
- 1997-05-15 ES ES97926652T patent/ES2181000T3/es not_active Expired - Lifetime
- 1997-05-15 DE DE69714446T patent/DE69714446T2/de not_active Expired - Fee Related
- 1997-05-15 AU AU31365/97A patent/AU706220B2/en not_active Ceased
- 1997-05-15 WO PCT/US1997/008632 patent/WO1997045571A2/en active IP Right Grant
- 1997-05-15 BR BR9709899-0A patent/BR9709899A/pt not_active Application Discontinuation
- 1997-05-15 EP EP97926652A patent/EP0912777B1/en not_active Expired - Lifetime
- 1997-05-15 CN CN97195088.1A patent/CN1220709A/zh active Pending
- 1997-05-15 AT AT97926652T patent/ATE221583T1/de not_active IP Right Cessation
- 1997-05-16 PE PE1997000380A patent/PE38598A1/es not_active Application Discontinuation
- 1997-05-23 CO CO97028493A patent/CO4780049A1/es unknown
- 1997-05-24 TW TW086107050A patent/TW432127B/zh not_active IP Right Cessation
- 1997-05-30 ID IDP971835A patent/ID17398A/id unknown
Also Published As
Publication number | Publication date |
---|---|
US5730854A (en) | 1998-03-24 |
EP0912777A2 (en) | 1999-05-06 |
DE69714446D1 (de) | 2002-09-05 |
TW432127B (en) | 2001-05-01 |
AU3136597A (en) | 1998-01-05 |
ES2181000T3 (es) | 2003-02-16 |
DE69714446T2 (de) | 2002-11-14 |
WO1997045571A3 (en) | 1998-02-19 |
JP3306438B2 (ja) | 2002-07-24 |
AU706220B2 (en) | 1999-06-10 |
WO1997045571A2 (en) | 1997-12-04 |
BR9709899A (pt) | 2000-01-25 |
CN1220709A (zh) | 1999-06-23 |
CO4780049A1 (es) | 1999-05-26 |
ATE221583T1 (de) | 2002-08-15 |
JP2000511235A (ja) | 2000-08-29 |
EP0912777B1 (en) | 2002-07-31 |
ID17398A (id) | 1997-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant, registration | ||
FD | Application declared void or lapsed |