HK1214463A1 - 屏蔽印刷线路板的制造方法、屏蔽膜及屏蔽印刷线路板 - Google Patents

屏蔽印刷线路板的制造方法、屏蔽膜及屏蔽印刷线路板 Download PDF

Info

Publication number
HK1214463A1
HK1214463A1 HK16102067.6A HK16102067A HK1214463A1 HK 1214463 A1 HK1214463 A1 HK 1214463A1 HK 16102067 A HK16102067 A HK 16102067A HK 1214463 A1 HK1214463 A1 HK 1214463A1
Authority
HK
Hong Kong
Prior art keywords
insulating layer
shielding film
layer
film
resin
Prior art date
Application number
HK16102067.6A
Other languages
English (en)
Chinese (zh)
Inventor
田島宏
田岛宏
岩崎匡譽
岩崎匡誉
上農憲治
上农宪治
春名裕介
Original Assignee
大自达电线股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大自达电线股份有限公司 filed Critical 大自达电线股份有限公司
Publication of HK1214463A1 publication Critical patent/HK1214463A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
HK16102067.6A 2012-12-20 2013-12-10 屏蔽印刷线路板的制造方法、屏蔽膜及屏蔽印刷线路板 HK1214463A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012278551A JP2014123630A (ja) 2012-12-20 2012-12-20 シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板
JP2012-278551 2012-12-20
PCT/JP2013/083119 WO2014097933A1 (ja) 2012-12-20 2013-12-10 シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板

Publications (1)

Publication Number Publication Date
HK1214463A1 true HK1214463A1 (zh) 2016-07-22

Family

ID=50978268

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16102067.6A HK1214463A1 (zh) 2012-12-20 2013-12-10 屏蔽印刷线路板的制造方法、屏蔽膜及屏蔽印刷线路板

Country Status (7)

Country Link
US (2) US20150373835A1 (enExample)
JP (1) JP2014123630A (enExample)
KR (1) KR20150096679A (enExample)
CN (1) CN104871651A (enExample)
HK (1) HK1214463A1 (enExample)
TW (1) TWI627883B (enExample)
WO (1) WO2014097933A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058565A (ja) * 2014-09-10 2016-04-21 住友ベークライト株式会社 電磁波シールド用フィルム
JP6402584B2 (ja) * 2014-10-23 2018-10-10 住友ベークライト株式会社 電磁波シールド用フィルムの製造方法
CN105139922A (zh) * 2015-09-21 2015-12-09 杨天纬 一种用于线缆的屏蔽膜及制造方法及线材的制造方法
JP6709669B2 (ja) * 2016-04-20 2020-06-17 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP6554618B2 (ja) * 2017-02-13 2019-07-31 タツタ電線株式会社 シールドプリント配線板及びシールドプリント配線板の製造方法
JP7282802B2 (ja) * 2018-12-03 2023-05-29 タツタ電線株式会社 グランド部材及びシールドプリント配線板
JP7307095B2 (ja) * 2018-12-12 2023-07-11 タツタ電線株式会社 シールドプリント配線板及びシールドプリント配線板の製造方法
TWI741648B (zh) * 2020-06-12 2021-10-01 亞洲電材股份有限公司 覆蓋膜及其製備方法
CN113613482B (zh) * 2021-08-06 2024-03-19 航天智造科技股份有限公司 适用于极小接地孔接地的电磁波屏蔽膜、制备方法及应用
WO2025197408A1 (ja) * 2024-03-21 2025-09-25 ソニーグループ株式会社 電子機器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498386B2 (ja) * 1994-10-19 2004-02-16 住友電気工業株式会社 シールド付きフレキシブル配線板及びその製造方法
JP4170781B2 (ja) * 2003-01-17 2008-10-22 松下電器産業株式会社 基板の製造方法
JP2005056906A (ja) * 2003-08-05 2005-03-03 Reiko Co Ltd 電磁波遮蔽性転写フイルム
JP4319167B2 (ja) * 2005-05-13 2009-08-26 タツタ システム・エレクトロニクス株式会社 シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法
JP4974803B2 (ja) * 2007-08-03 2012-07-11 タツタ電線株式会社 プリント配線板用シールドフィルム及びプリント配線板
JP2009246121A (ja) * 2008-03-31 2009-10-22 Nippon Steel Chem Co Ltd 電磁波シールド材及びその製造方法
KR101457528B1 (ko) * 2008-05-15 2014-11-04 삼성디스플레이 주식회사 임프린트 기판의 제조방법 및 임프린팅 방법
JP5521227B2 (ja) * 2009-01-26 2014-06-11 タツタ電線株式会社 導電性粘着シート及びそれを備えた電磁波シールド材、プリント配線板
JP2010238870A (ja) * 2009-03-31 2010-10-21 Toyo Ink Mfg Co Ltd 電磁波シールド性カバーレイフィルム、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント配線板。
JP2011171522A (ja) * 2010-02-19 2011-09-01 Toyo Ink Sc Holdings Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP5533354B2 (ja) * 2010-06-30 2014-06-25 デクセリアルズ株式会社 シールドフィルム及びシールド配線板
JP5602045B2 (ja) * 2011-02-14 2014-10-08 新日鉄住金化学株式会社 回路基板

Also Published As

Publication number Publication date
WO2014097933A1 (ja) 2014-06-26
KR20150096679A (ko) 2015-08-25
CN104871651A (zh) 2015-08-26
US20150373835A1 (en) 2015-12-24
TWI627883B (zh) 2018-06-21
TW201440589A (zh) 2014-10-16
US20160249446A1 (en) 2016-08-25
JP2014123630A (ja) 2014-07-03

Similar Documents

Publication Publication Date Title
TWI627883B (zh) 屏蔽印刷配線板之製造方法，屏蔽膜，及屏蔽印刷配線板
CN111726936B (zh) 电磁波遮蔽性配线电路基板及电子机器
TWI734930B (zh) 電磁波屏蔽膜
TWI627881B (zh) 屏蔽膜及屏蔽印刷電路板
KR20190030669A (ko) 쉴드 필름, 쉴드 프린트 배선판 및 쉴드 프린트 배선판의 제조 방법
JP7256618B2 (ja) 転写フィルム付電磁波シールドフィルム、転写フィルム付電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法
CN108541204B (zh) 复合式高遮蔽性薄型化电磁干扰屏蔽膜及其制备方法
CN104797420B (zh) 层叠膜和屏蔽印刷布线板
CN105684566A (zh) 屏蔽壳体、印刷线路板、电子设备及屏蔽壳体的制作方法
CN101772996A (zh) 印刷布线板用屏蔽膜以及印刷布线板
WO2013108849A1 (ja) 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法
WO2013099172A1 (ja) カバーレイフィルム、フレキシブル配線板およびその製造方法
US11653439B2 (en) Ground member and shielded printed wiring board
JP7856599B2 (ja) シールドプリント配線板
CN107405878B (zh) 柔性印刷电路基板用电磁波屏蔽膜的制造方法
CN103181247A (zh) 高频电路基板
JP2016029748A (ja) シールドプリント配線板の製造方法
KR102724516B1 (ko) 전자파 차폐 필름
KR102669973B1 (ko) 전자파 차폐 필름
CN108702863B (zh) 电磁波屏蔽膜
JP2016040852A (ja) シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
KR102790802B1 (ko) 전자파 차폐 필름
TWI444132B (zh) 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
KR20170022893A (ko) 지지체 부착 수지 시트
TWI829973B (zh) 電磁波屏蔽膜