HK1202704A1 - 半導體器件的製造方法 - Google Patents

半導體器件的製造方法

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Publication number
HK1202704A1
HK1202704A1 HK15102922.2A HK15102922A HK1202704A1 HK 1202704 A1 HK1202704 A1 HK 1202704A1 HK 15102922 A HK15102922 A HK 15102922A HK 1202704 A1 HK1202704 A1 HK 1202704A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
HK15102922.2A
Other languages
English (en)
Inventor
安村文次
出口善宣
竹井文
長谷部昭男
槇平尚宏
久保光之
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1202704A1 publication Critical patent/HK1202704A1/zh

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    • H—ELECTRICITY
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    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
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    • H—ELECTRICITY
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    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
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    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
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    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
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    • H01L2924/0001—Technical content checked by a classifier
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    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
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JP2014187185A (ja) * 2013-03-22 2014-10-02 Renesas Electronics Corp 半導体装置の製造方法
JP6207190B2 (ja) * 2013-03-22 2017-10-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6489965B2 (ja) * 2015-07-14 2019-03-27 新光電気工業株式会社 電子部品装置及びその製造方法
US9799571B2 (en) * 2015-07-15 2017-10-24 Globalfoundries Singapore Pte. Ltd. Methods for producing integrated circuits with interposers and integrated circuits produced from such methods
JP6544160B2 (ja) * 2015-09-09 2019-07-17 三菱電機株式会社 半導体装置
JP6624973B2 (ja) * 2016-03-03 2019-12-25 ルネサスエレクトロニクス株式会社 半導体装置
US10056528B1 (en) * 2017-03-31 2018-08-21 Intel Corporation Interposer structures, semiconductor assembly and methods for forming interposer structures
US10636757B2 (en) * 2017-08-29 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit component package and method of fabricating the same
KR20200047930A (ko) * 2018-10-26 2020-05-08 삼성전자주식회사 테스트 패드를 포함하는 반도체 패키지
US11600590B2 (en) * 2019-03-22 2023-03-07 Advanced Semiconductor Engineering, Inc. Semiconductor device and semiconductor package
CN112378934B (zh) * 2021-01-15 2021-09-10 同源微（北京）半导体技术有限公司 光学芯片、探测器以及制作方法

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JP4467318B2 (ja) 2004-01-28 2010-05-26 Ｎｅｃエレクトロニクス株式会社 半導体装置、マルチチップ半導体装置用チップのアライメント方法およびマルチチップ半導体装置用チップの製造方法
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