HK1169366A1 - Surface modified hexagonal boron nitride particles - Google Patents
Surface modified hexagonal boron nitride particlesInfo
- Publication number
- HK1169366A1 HK1169366A1 HK12110100.2A HK12110100A HK1169366A1 HK 1169366 A1 HK1169366 A1 HK 1169366A1 HK 12110100 A HK12110100 A HK 12110100A HK 1169366 A1 HK1169366 A1 HK 1169366A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- boron nitride
- surface modified
- hexagonal boron
- nitride particles
- modified hexagonal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/43—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
- C07C211/44—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton having amino groups bound to only one six-membered aromatic ring
- C07C211/45—Monoamines
- C07C211/46—Aniline
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
- C07B2200/00—Indexing scheme relating to specific properties of organic compounds
- C07B2200/11—Compounds covalently bound to a solid support
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/465,042 US8258346B2 (en) | 2009-05-13 | 2009-05-13 | Surface modified hexagonal boron nitride particles |
PCT/US2010/034462 WO2010132512A2 (en) | 2009-05-13 | 2010-05-12 | Surface modified hexagonal boron nitride particles |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1169366A1 true HK1169366A1 (en) | 2013-01-25 |
Family
ID=43069051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12110100.2A HK1169366A1 (en) | 2009-05-13 | 2012-10-12 | Surface modified hexagonal boron nitride particles |
Country Status (7)
Country | Link |
---|---|
US (1) | US8258346B2 (ko) |
EP (1) | EP2429943A4 (ko) |
JP (1) | JP5619149B2 (ko) |
KR (1) | KR20120024756A (ko) |
CN (1) | CN102421701B (ko) |
HK (1) | HK1169366A1 (ko) |
WO (1) | WO2010132512A2 (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
US8288466B2 (en) * | 2009-05-13 | 2012-10-16 | E I Du Pont De Nemours And Company | Composite of a polymer and surface modified hexagonal boron nitride particles |
US8258346B2 (en) | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
US8796392B2 (en) | 2011-12-16 | 2014-08-05 | Ticona Llc | Low temperature injection molding of polyarylene sulfide compositions |
WO2013090168A1 (en) | 2011-12-16 | 2013-06-20 | Ticona Llc | Injection molding of polyarylene sulfide compositions |
KR20140102217A (ko) | 2011-12-16 | 2014-08-21 | 티코나 엘엘씨 | 폴리아릴렌 설파이드 조성물용 핵 형성 시스템 |
KR102064024B1 (ko) | 2011-12-16 | 2020-01-08 | 티코나 엘엘씨 | 폴리페닐렌 설파이드용 붕소-함유 핵 형성제 |
US10693137B2 (en) * | 2013-07-10 | 2020-06-23 | Boron Nitride Power, Llc | Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices |
US9745499B2 (en) * | 2013-09-06 | 2017-08-29 | Korea Advanced Institute Of Science And Technology | Hexagonal boron nitride nanosheet/ceramic nanocomposite powder and producing method of the same, and hexagonal boron nitride nanosheet/ceramic nanocomposite materials and producing method of the same |
US9583358B2 (en) | 2014-05-30 | 2017-02-28 | Samsung Electronics Co., Ltd. | Hardmask composition and method of forming pattern by using the hardmask composition |
KR102287343B1 (ko) | 2014-07-04 | 2021-08-06 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴의 형성방법 |
KR102287344B1 (ko) | 2014-07-25 | 2021-08-06 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴의 형성방법 |
KR102235501B1 (ko) * | 2014-09-12 | 2021-04-05 | 엘지이노텍 주식회사 | 무기충전재 및 이를 포함하는 에폭시 수지 조성물 |
KR102384226B1 (ko) | 2015-03-24 | 2022-04-07 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴 형성방법 |
KR102463893B1 (ko) | 2015-04-03 | 2022-11-04 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴의 형성방법 |
TWI708805B (zh) | 2015-12-30 | 2020-11-01 | 美商聖高拜陶器塑膠公司 | 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法 |
KR102148585B1 (ko) * | 2016-01-26 | 2020-08-26 | 후지필름 가부시키가이샤 | 표면 수식 무기물 및 그 제조 방법, 수지 조성물, 열전도 재료, 디바이스, 및 윤활제 |
WO2017158919A1 (ja) * | 2016-03-14 | 2017-09-21 | ナミックス株式会社 | 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法 |
CN109134271A (zh) * | 2017-06-15 | 2019-01-04 | 中国科学院化学研究所 | 一种对六方氮化硼进行表面改性的方法 |
JP6847219B2 (ja) * | 2017-07-14 | 2021-03-24 | 富士フイルム株式会社 | 表面修飾無機窒化物、組成物、熱伝導材料、熱伝導層付きデバイス |
US11034847B2 (en) | 2017-07-14 | 2021-06-15 | Samsung Electronics Co., Ltd. | Hardmask composition, method of forming pattern using hardmask composition, and hardmask formed from hardmask composition |
KR102433666B1 (ko) | 2017-07-27 | 2022-08-18 | 삼성전자주식회사 | 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크 |
KR102486388B1 (ko) | 2017-07-28 | 2023-01-09 | 삼성전자주식회사 | 그래핀 양자점의 제조방법, 상기 제조방법에 따라 얻어진 그래핀 양자점을 포함한 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크 |
CN109401360B (zh) * | 2017-08-18 | 2020-08-21 | 中国科学院化学研究所 | 一种对高温结构陶瓷材料进行表面改性的方法 |
CN107827770A (zh) * | 2017-11-14 | 2018-03-23 | 西北工业大学 | 一种脂肪链接枝的六方氮化硼纳米复合材料及其制备方法 |
KR102122019B1 (ko) | 2019-04-26 | 2020-06-11 | 서울대학교산학협력단 | 질화붕소를 포함하는 폴리올레핀 나노복합재료 및 그 제조방법 |
KR102291752B1 (ko) * | 2020-12-18 | 2021-08-24 | 한국기초과학지원연구원 | 산기 치환 표면 개질 질화붕소, 이의 제조방법 및 이를 함유한 방열성 조성물 |
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DE2555515C2 (de) | 1975-12-10 | 1990-04-19 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen |
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EP0474054B1 (en) * | 1990-08-27 | 1995-12-06 | E.I. Du Pont De Nemours And Company | Flexible multi-layer polyimide film laminates and preparation thereof |
JPH07215705A (ja) | 1994-02-07 | 1995-08-15 | Shin Etsu Chem Co Ltd | シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品 |
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CA2292369A1 (en) * | 1998-10-01 | 2001-06-16 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
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JP4070345B2 (ja) * | 1999-02-15 | 2008-04-02 | 信越化学工業株式会社 | 熱伝導性窒化ほう素微粉末、該微粉末を含有する熱伝導性シリコーン組成物、及び絶縁放熱シート |
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US7445797B2 (en) * | 2005-03-14 | 2008-11-04 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and polymer-based compositions made therewith |
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JP2001192500A (ja) * | 2000-01-12 | 2001-07-17 | Edison Polymer Innovation Corp | 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法 |
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US6652822B2 (en) * | 2001-05-17 | 2003-11-25 | The Regents Of The University Of California | Spherical boron nitride particles and method for preparing them |
US7026436B2 (en) * | 2002-11-26 | 2006-04-11 | E.I. Du Pont De Nemours And Company | Low temperature polyimide adhesive compositions and methods relating thereto |
US7470990B2 (en) * | 2004-03-31 | 2008-12-30 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US20060127686A1 (en) * | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device |
US7524560B2 (en) * | 2005-08-19 | 2009-04-28 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
US20070205706A1 (en) * | 2006-03-01 | 2007-09-06 | General Electric Company | Optical Substrate Comprising Boron Nitride Particles |
US7658988B2 (en) * | 2006-04-03 | 2010-02-09 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from filled epoxy compositions |
US7829188B2 (en) * | 2006-04-03 | 2010-11-09 | E.I. Du Pont De Nemours And Company | Filled epoxy compositions |
US20070259211A1 (en) * | 2006-05-06 | 2007-11-08 | Ning Wang | Heat spread sheet with anisotropic thermal conductivity |
US7527859B2 (en) * | 2006-10-08 | 2009-05-05 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
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JP2010510168A (ja) | 2006-11-22 | 2010-04-02 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 官能化窒化ホウ素ナノチューブ |
JP4858470B2 (ja) * | 2008-03-14 | 2012-01-18 | 新神戸電機株式会社 | 無機窒化物粒子およびこれを混合した樹脂組成物 |
WO2009149445A1 (en) * | 2008-06-06 | 2009-12-10 | E. I. Du Pont De Nemours And Company | Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing same |
US20090305043A1 (en) * | 2008-06-06 | 2009-12-10 | E. I. Du Point De Nemours And Company | Boron nitride encapsulated in turbostratic carbon and process for making same |
US8277936B2 (en) * | 2008-12-22 | 2012-10-02 | E I Du Pont De Nemours And Company | Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers |
US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
US8258346B2 (en) | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
US8288466B2 (en) * | 2009-05-13 | 2012-10-16 | E I Du Pont De Nemours And Company | Composite of a polymer and surface modified hexagonal boron nitride particles |
-
2009
- 2009-05-13 US US12/465,042 patent/US8258346B2/en not_active Expired - Fee Related
-
2010
- 2010-05-12 KR KR1020117029685A patent/KR20120024756A/ko not_active Application Discontinuation
- 2010-05-12 WO PCT/US2010/034462 patent/WO2010132512A2/en active Application Filing
- 2010-05-12 EP EP10775444.2A patent/EP2429943A4/en not_active Withdrawn
- 2010-05-12 CN CN201080020672.9A patent/CN102421701B/zh not_active Expired - Fee Related
- 2010-05-12 JP JP2012510961A patent/JP5619149B2/ja not_active Expired - Fee Related
-
2012
- 2012-10-12 HK HK12110100.2A patent/HK1169366A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US8258346B2 (en) | 2012-09-04 |
WO2010132512A2 (en) | 2010-11-18 |
CN102421701A (zh) | 2012-04-18 |
KR20120024756A (ko) | 2012-03-14 |
CN102421701B (zh) | 2014-07-16 |
US20100292508A1 (en) | 2010-11-18 |
EP2429943A4 (en) | 2015-03-11 |
JP5619149B2 (ja) | 2014-11-05 |
JP2012526830A (ja) | 2012-11-01 |
WO2010132512A3 (en) | 2011-03-03 |
EP2429943A2 (en) | 2012-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20190510 |