HK1167740A1 - 半導體封裝件以及該半導體封裝件的安裝構造 - Google Patents

半導體封裝件以及該半導體封裝件的安裝構造

Info

Publication number
HK1167740A1
HK1167740A1 HK12108347.9A HK12108347A HK1167740A1 HK 1167740 A1 HK1167740 A1 HK 1167740A1 HK 12108347 A HK12108347 A HK 12108347A HK 1167740 A1 HK1167740 A1 HK 1167740A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor package
mounting structure
package mounting
semiconductor
package
Prior art date
Application number
HK12108347.9A
Other languages
English (en)
Inventor
滨口恒夫
杉浦勢
坂本博夫
岩田政樹
白瀨隆史
岡室貴士
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of HK1167740A1 publication Critical patent/HK1167740A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15162—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK12108347.9A 2009-06-22 2012-08-27 半導體封裝件以及該半導體封裝件的安裝構造 HK1167740A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/002813 WO2010150297A1 (ja) 2009-06-22 2009-06-22 半導体パッケージおよび当該半導体パッケージの実装構造

Publications (1)

Publication Number Publication Date
HK1167740A1 true HK1167740A1 (zh) 2012-12-07

Family

ID=43386098

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12108347.9A HK1167740A1 (zh) 2009-06-22 2012-08-27 半導體封裝件以及該半導體封裝件的安裝構造

Country Status (7)

Country Link
US (1) US20120091572A1 (zh)
EP (1) EP2447989B1 (zh)
JP (1) JP4823396B2 (zh)
KR (1) KR101341273B1 (zh)
CN (1) CN102460685B (zh)
HK (1) HK1167740A1 (zh)
WO (1) WO2010150297A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6224473B2 (ja) * 2014-02-03 2017-11-01 京セラ株式会社 配線基板、電子装置および電子モジュール
JP6166194B2 (ja) * 2014-02-21 2017-07-19 京セラ株式会社 配線基板、電子装置および電子モジュール
CN108811320A (zh) * 2017-05-05 2018-11-13 乾坤科技股份有限公司 电子模块与电路板
KR102185706B1 (ko) * 2017-11-08 2020-12-02 삼성전자주식회사 팬-아웃 반도체 패키지
US10643919B2 (en) 2017-11-08 2020-05-05 Samsung Electronics Co., Ltd. Fan-out semiconductor package
JP7049141B2 (ja) * 2018-03-07 2022-04-06 新光電気工業株式会社 電子部品用パッケージとその製造方法
JP7267767B2 (ja) * 2019-02-20 2023-05-02 ローム株式会社 半導体装置および半導体装置の製造方法
JP7254930B2 (ja) 2019-03-12 2023-04-10 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
KR102537005B1 (ko) 2019-03-12 2023-05-26 앱솔릭스 인코포레이티드 유리를 포함하는 기판의 적재 카세트 및 이를 적용한 기판의 적재방법
KR102396184B1 (ko) 2019-03-12 2022-05-10 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치
EP3910667A4 (en) 2019-03-29 2022-10-26 Absolics Inc. PACKAGING GLASS SUBSTRATE FOR SEMICONDUCTORS, PACKAGING SUBSTRATE FOR SEMICONDUCTORS AND SEMICONDUCTOR DEVICES
KR102413117B1 (ko) * 2019-08-23 2022-06-24 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치
US20220344253A1 (en) * 2019-10-24 2022-10-27 Rohm Co., Ltd. Semiconductor device
EP4213197A1 (en) * 2022-01-12 2023-07-19 Nexperia B.V. A semiconductor package substrate made from non-metallic material and a method of manufacturing thereof

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954247A (ja) * 1982-09-21 1984-03-29 Nec Corp 電子部品
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
US5677045A (en) * 1993-09-14 1997-10-14 Hitachi, Ltd. Laminate and multilayer printed circuit board
JP3597913B2 (ja) * 1995-07-20 2004-12-08 松下電器産業株式会社 半導体装置とその実装方法
JPH11150211A (ja) * 1997-11-18 1999-06-02 Hitachi Cable Ltd ハイブリッドｉｃモジュール及びその製造方法
JP2000228451A (ja) * 1999-02-05 2000-08-15 Matsushita Electric Ind Co Ltd 電子部品
JP3795248B2 (ja) * 1999-03-19 2006-07-12 ローム株式会社 チップ型発光装置
JP3286917B2 (ja) * 1999-05-06 2002-05-27 株式会社村田製作所 電子部品用パッケージおよび電子部品
EP1139703B1 (en) * 1999-09-06 2007-08-08 SUZUKI SOGYO Co., Ltd. Substrate of circuit board
TWI248384B (en) * 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
CN100587962C (zh) * 2003-07-03 2010-02-03 泰塞拉技术匈牙利公司 用于封装集成电路器件的方法和设备
JP2004140385A (ja) * 2003-11-17 2004-05-13 Kyocera Corp 多層配線基板
JP2005158770A (ja) * 2003-11-20 2005-06-16 Matsushita Electric Ind Co Ltd 積層基板とその製造方法及び前記積層基板を用いたモジュールの製造方法とその製造装置
JP4698259B2 (ja) * 2005-03-16 2011-06-08 三洋電機株式会社 電子部品搭載用パッケージ及びパッケージ集合基板
KR101210800B1 (ko) * 2005-04-19 2012-12-10 가부시키가이샤 가네카 섬유-수지 복합체, 적층체 및 프린트 배선판, 및 프린트배선판의 제조 방법
JP2006303335A (ja) * 2005-04-25 2006-11-02 Sony Corp 電子部品搭載用基板及びそれを用いた電子装置
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
JP2007200997A (ja) * 2006-01-24 2007-08-09 Epson Toyocom Corp 半田ペースト及び半田付け方法
EP2000833A4 (en) * 2006-03-24 2010-03-31 Ibiden Co Ltd PHOTOELECTRIC WIRING PANEL, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING OPTICAL COMMUNICATION DEVICE
EP2080223B8 (en) * 2006-10-31 2018-08-22 Lumileds Holding B.V. Lighting device package
JP5048307B2 (ja) * 2006-11-13 2012-10-17 信越石英株式会社 複合織物及びプリント配線基板
US20090014746A1 (en) * 2007-07-11 2009-01-15 Ainissa Gweneth Ramirez Solder alloys
JP5345363B2 (ja) * 2008-06-24 2013-11-20 シャープ株式会社 発光装置
TWI381510B (zh) * 2008-10-07 2013-01-01 Advanced Semiconductor Eng 具有屏蔽蓋體之晶片封裝結構

Also Published As

Publication number Publication date
JPWO2010150297A1 (ja) 2012-12-06
CN102460685B (zh) 2014-08-06
EP2447989A1 (en) 2012-05-02
JP4823396B2 (ja) 2011-11-24
KR20120023120A (ko) 2012-03-12
EP2447989B1 (en) 2016-05-04
EP2447989A4 (en) 2013-01-23
KR101341273B1 (ko) 2013-12-12
US20120091572A1 (en) 2012-04-19
WO2010150297A1 (ja) 2010-12-29
CN102460685A (zh) 2012-05-16

Similar Documents

Publication Publication Date Title
HK1167740A1 (zh) 半導體封裝件以及該半導體封裝件的安裝構造
TWI562330B (en) Semiconductor device
TWI562381B (en) Semiconductor device
HK1219572A1 (zh) 基於量子阱的半導體器件
EP2519969A4 (en) SEMICONDUCTOR COMPONENT
EP2517245A4 (en) SEMICONDUCTOR COMPONENT
EP2513966A4 (en) SEMICONDUCTOR DEVICE
EP2494599A4 (en) SEMICONDUCTOR DEVICE
SG10201503877UA (en) Semiconductor device
EP2491586A4 (en) SEMICONDUCTOR COMPONENT
EP2494597A4 (en) SEMICONDUCTOR COMPONENT
SG10201406934WA (en) Semiconductor device
EP2491585A4 (en) SEMICONDUCTOR DEVICE
EP2445011A4 (en) SEMICONDUCTOR DEVICE
EP2432014A4 (en) SEMICONDUCTOR COMPONENT
EP2432020A4 (en) SEMICONDUCTOR DEVICE
EP2494595A4 (en) SEMICONDUCTOR DEVICE
EP2469600A4 (en) SEMICONDUCTOR DEVICE
EP2237327A4 (en) SEMICONDUCTOR DEVICE HOUSING
EP2442355A4 (en) SEMICONDUCTOR DEVICE
EP2497114A4 (en) SEMICONDUCTOR DEVICE
EP2485253A4 (en) PACKAGING FOR A STORAGE ELEMENT AND MOUNTED STRUCTURE THEREFOR
EP2444972A4 (en) SEMICONDUCTOR COMPONENT
EP2487720A4 (en) SEMICONDUCTOR COMPONENT
EP2442358A4 (en) SEMICONDUCTOR COMPONENT

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180622