HK1125139A1 - High speed tin plating process - Google Patents

High speed tin plating process

Info

Publication number
HK1125139A1
HK1125139A1 HK09102274.4A HK09102274A HK1125139A1 HK 1125139 A1 HK1125139 A1 HK 1125139A1 HK 09102274 A HK09102274 A HK 09102274A HK 1125139 A1 HK1125139 A1 HK 1125139A1
Authority
HK
Hong Kong
Prior art keywords
high speed
plating process
tin plating
speed tin
tin
Prior art date
Application number
HK09102274.4A
Other languages
English (en)
Inventor
Gary S Smith
Nicholas M Martyak
Gary E Stringer
Original Assignee
Arkema Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkema Inc filed Critical Arkema Inc
Publication of HK1125139A1 publication Critical patent/HK1125139A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/68—Temporary coatings or embedding materials applied before or during heat treatment
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/68—Temporary coatings or embedding materials applied before or during heat treatment
    • C21D1/70—Temporary coatings or embedding materials applied before or during heat treatment while heating or quenching
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/68—Temporary coatings or embedding materials applied before or during heat treatment
    • C21D1/72—Temporary coatings or embedding materials applied before or during heat treatment during chemical change of surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK09102274.4A 2005-12-30 2009-03-10 High speed tin plating process HK1125139A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75558405P 2005-12-30 2005-12-30
PCT/US2006/047166 WO2007078655A2 (en) 2005-12-30 2006-12-08 High speed tin plating process

Publications (1)

Publication Number Publication Date
HK1125139A1 true HK1125139A1 (en) 2009-07-31

Family

ID=38228719

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09102274.4A HK1125139A1 (en) 2005-12-30 2009-03-10 High speed tin plating process

Country Status (9)

Country Link
US (2) US8197663B2 (xx)
EP (1) EP1969161A4 (xx)
JP (2) JP5066531B2 (xx)
KR (1) KR20080088593A (xx)
CN (1) CN101351577B (xx)
CA (1) CA2633662A1 (xx)
HK (1) HK1125139A1 (xx)
TW (1) TW200738914A (xx)
WO (1) WO2007078655A2 (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5319101B2 (ja) * 2007-10-31 2013-10-16 Ｊｘ日鉱日石金属株式会社 電子部品用Ｓｎめっき材
RU2586377C2 (ru) * 2010-10-06 2016-06-10 Тата Стил Эймейден Бв Способ получения слоя сплава железо-олово на тароупаковочной стальной подложке
CN102031544B (zh) * 2010-12-08 2012-05-09 北京机械工业自动化研究所 带钢连续电镀锡生产方法及设备
JP6099256B2 (ja) 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ スズおよびスズ合金のための改良されたフラックス方法
CN103451697B (zh) * 2012-05-31 2016-03-16 黄家军 一种金属镀层热处理工艺
CN105088295A (zh) * 2015-08-13 2015-11-25 安徽优合铝业科技有限公司 一种车轮轮毂的制造工艺
CN107099825B (zh) * 2017-05-04 2018-09-28 蓬莱联泰电子材料有限公司 电子元器件用引线镀锡工艺的镀液配方及引线镀锡工艺
CN110318081B (zh) * 2019-08-05 2023-10-17 昆山培雷特成套机电设备有限公司 一种电镀生产线用加工装置
CN112481671B (zh) * 2019-09-12 2024-05-10 上海梅山钢铁股份有限公司 一种低锡层电镀锡钢板的软熔前处理装置及处理方法
CN115948775A (zh) * 2022-11-22 2023-04-11 广州三孚新材料科技股份有限公司 一种用于高速镀锡的甲磺酸高速镀锡液及其制备方法

Family Cites Families (28)

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US2266330A (en) 1935-12-23 1941-12-16 John S Nachtman Process for electroplating strip steel
US2313371A (en) * 1940-06-28 1943-03-09 Carnegie Illinois Steel Corp Electrodeposition of tin and its alloys
GB643928A (en) 1948-05-12 1950-09-27 William Warren Triggs Electrodeposition of tin
US2719820A (en) 1951-01-26 1955-10-04 United States Steel Corp Method for coating steel strip
GB1089479A (en) 1965-11-09 1967-11-01 Monsanto Chemicals Improvements relating to electrodeposition of tin
US4052234A (en) * 1973-11-05 1977-10-04 Nippon Kokan Kabushiki Kaisha Method for continuously quenching electrolytic tin-plated steel strip
US4181580A (en) 1973-11-28 1980-01-01 Nippon Steel Corporation Process for electro-tin plating
JPS602396B2 (ja) * 1978-11-27 1985-01-21 東洋鋼鈑株式会社 酸性錫めつき浴
JPS63266094A (ja) * 1987-04-24 1988-11-02 Nippon Steel Corp 塗料密着性に優れた溶接容器用鋼板とその製造法
US4936965A (en) 1988-10-17 1990-06-26 Nkk Corporation Method for continuously electro-tinplating metallic material
US5039576A (en) * 1989-05-22 1991-08-13 Atochem North America, Inc. Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
US5176813A (en) * 1989-11-06 1993-01-05 Elf Atochem North America, Inc. Protection of lead-containing anodes during chromium electroplating
US5312539A (en) 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
US5427677A (en) * 1994-02-18 1995-06-27 Learonal, Inc. Flux for reflowing tinplate
US6280596B1 (en) * 1995-05-23 2001-08-28 Weirton Steel Corporation Electrolytic tinplating of steel substrate and apparatus
GB9620357D0 (en) * 1996-09-27 1996-11-13 Yorkshire Chemicals Plc Fluxing agents for the reflowing of electro-deposited tinplate
EP0863229A1 (en) * 1996-12-02 1998-09-09 LeaRonal GmbH Method for removing ferrous ions from acidic tinning electrolytes and tinning electrolyte recovery plant using the same
US6251255B1 (en) 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
IT1306811B1 (it) 1999-07-30 2001-10-02 Ct Sviluppo Materiali Spa Procedimento per la dissoluzione di metalli in una soluzione perrealizzare una deposizione elettrolitica ed impianto di dissoluzione
US6174426B1 (en) * 1999-08-12 2001-01-16 Usx Corporation Tin-plated steel with adhesion promoter
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP4177543B2 (ja) * 2000-08-09 2008-11-05 新日本製鐵株式会社 耐酸化性の優れた錫めっき鋼板およびその製造方法
JP2002339095A (ja) * 2001-05-16 2002-11-27 Dr Ing Max Schloetter Gmbh & Co Kg スズ−ビスマス−銅合金の析出方法
JP2002356785A (ja) 2001-05-28 2002-12-13 Nippon Steel Corp 耐酸化性の優れた錫めっき鋼板およびその製造方法
JP4864254B2 (ja) * 2001-09-13 2012-02-01 新日本製鐵株式会社 錫めっき鋼板およびその製造方法
US6562221B2 (en) * 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
CA2525064C (en) * 2003-05-12 2013-01-08 Arkema Inc. High purity electrolytic sulfonic acid solutions
ES2354045T3 (es) 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.

Also Published As

Publication number Publication date
TW200738914A (en) 2007-10-16
JP2009522449A (ja) 2009-06-11
US8197663B2 (en) 2012-06-12
JP5066531B2 (ja) 2012-11-07
KR20080088593A (ko) 2008-10-02
JP2012229492A (ja) 2012-11-22
CN101351577B (zh) 2011-08-31
EP1969161A2 (en) 2008-09-17
US20080283407A1 (en) 2008-11-20
WO2007078655A3 (en) 2007-11-29
EP1969161A4 (en) 2012-01-25
US20120217168A1 (en) 2012-08-30
CA2633662A1 (en) 2007-07-12
CN101351577A (zh) 2009-01-21
WO2007078655A2 (en) 2007-07-12

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20151208