HK1123627A1 - Substrate holding device, exposure device, exposure method, and device fabrication method - Google Patents

Substrate holding device, exposure device, exposure method, and device fabrication method

Info

Publication number
HK1123627A1
HK1123627A1 HK09100117.9A HK09100117A HK1123627A1 HK 1123627 A1 HK1123627 A1 HK 1123627A1 HK 09100117 A HK09100117 A HK 09100117A HK 1123627 A1 HK1123627 A1 HK 1123627A1
Authority
HK
Hong Kong
Prior art keywords
exposure
substrate holding
fabrication method
holding device
device fabrication
Prior art date
Application number
HK09100117.9A
Other languages
English (en)
Chinese (zh)
Inventor
Takeyuki Mizutani
Yuichi Shibazaki
Makoto Shibuta
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1123627A1 publication Critical patent/HK1123627A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK09100117.9A 2005-12-08 2009-01-07 Substrate holding device, exposure device, exposure method, and device fabrication method HK1123627A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005354463 2005-12-08
PCT/JP2006/324552 WO2007066758A1 (fr) 2005-12-08 2006-12-08 Dispositif de support de substrat, dispositif d’exposition, procédé d’exposition et procédé de fabrication du dispositif

Publications (1)

Publication Number Publication Date
HK1123627A1 true HK1123627A1 (en) 2009-06-19

Family

ID=38122903

Family Applications (2)

Application Number Title Priority Date Filing Date
HK09100117.9A HK1123627A1 (en) 2005-12-08 2009-01-07 Substrate holding device, exposure device, exposure method, and device fabrication method
HK15100027.0A HK1199771A1 (en) 2005-12-08 2015-01-02 Exposure apparatus and method

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK15100027.0A HK1199771A1 (en) 2005-12-08 2015-01-02 Exposure apparatus and method

Country Status (7)

Country Link
US (1) US8089615B2 (fr)
EP (3) EP3327759A1 (fr)
JP (1) JP4968076B2 (fr)
KR (3) KR101539517B1 (fr)
HK (2) HK1123627A1 (fr)
TW (2) TWI406321B (fr)
WO (1) WO2007066758A1 (fr)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1612849B1 (fr) 2003-04-09 2012-05-30 Nikon Corporation Procede et dispositif d'exposition et procede de production dudit dispositif
TWI573175B (zh) 2003-10-28 2017-03-01 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法
TW201809801A (zh) 2003-11-20 2018-03-16 日商尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
TWI366219B (en) 2004-02-06 2012-06-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
US20090046268A1 (en) 2005-05-12 2009-02-19 Yasuhiro Omura Projection optical system, exposure apparatus, and exposure method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
CN101681123B (zh) 2007-10-16 2013-06-12 株式会社尼康 照明光学系统、曝光装置以及元件制造方法
SG185313A1 (en) 2007-10-16 2012-11-29 Nikon Corp Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
WO2009145048A1 (fr) 2008-05-28 2009-12-03 株式会社ニコン Dispositif et procédé d'inspection pour modulateur spatial de lumière, système optique d'éclairage, procédé de réglage de ce système optique d'éclairage, dispositif d'exposition et procédé de fabrication de dispositif
US8336188B2 (en) * 2008-07-17 2012-12-25 Formfactor, Inc. Thin wafer chuck
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
KR101415386B1 (ko) * 2009-11-25 2014-07-04 엔에스케이 테쿠노로지 가부시키가이샤 노광 유닛 및 기판의 노광 방법
WO2011120174A1 (fr) * 2010-04-01 2011-10-06 Topcon 3D Inspection Laboratories, Inc. Appareil et procédé d'aplanissement de tranche
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
JP6244454B2 (ja) 2013-09-27 2017-12-06 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置のための支持テーブル、リソグラフィ装置、及び、デバイス製造方法
NL2015579A (en) * 2014-10-23 2016-08-30 Asml Netherlands Bv Support table for a lithographic apparatus, method of loading a substrate, lithographic apparatus and device manufacturing method.
CN107004574B (zh) * 2014-12-12 2020-06-30 佳能株式会社 基板保持装置、光刻设备以及物品制造方法
JP6496255B2 (ja) * 2016-01-29 2019-04-03 日本特殊陶業株式会社 基板保持装置
CN113376974A (zh) 2016-02-08 2021-09-10 Asml荷兰有限公司 光刻设备、用于卸载衬底的方法和用于装载衬底的方法
JP6650345B2 (ja) * 2016-05-26 2020-02-19 日本特殊陶業株式会社 基板保持装置及びその製造方法
NL2020011A (en) * 2017-01-26 2018-08-01 Asml Netherlands Bv A lithography apparatus and a method of manufacturing a device
JP6946134B2 (ja) * 2017-09-27 2021-10-06 日本特殊陶業株式会社 基板保持部材および基板保持方法
CN111213093A (zh) * 2017-10-12 2020-05-29 Asml荷兰有限公司 用于在光刻设备中使用的衬底支架
CN111418051B (zh) * 2017-11-10 2024-01-12 应用材料公司 用于双面处理的图案化夹盘
JP7303635B2 (ja) * 2019-01-07 2023-07-05 株式会社ディスコ ワークの保持方法及びワークの処理方法
CN113075865B (zh) * 2020-01-06 2022-11-08 夏泰鑫半导体(青岛)有限公司 一种用于处理半导体衬底的装置和方法
KR102405674B1 (ko) 2022-02-24 2022-06-08 주식회사 필라이즈 인공지능을 이용한 코호트 분석 기반 건강기능식품 정보 제공 방법, 장치 및 시스템
KR102405676B1 (ko) 2022-02-24 2022-06-08 주식회사 필라이즈 인공지능 기반의 맞춤형 건강기능식품 추천 정보를 제공하는 방법, 장치 및 시스템
KR102405677B1 (ko) 2022-02-24 2022-06-08 주식회사 필라이즈 인공지능을 이용한 이미지 인식 기반 맞춤형 건강기능식품 정보를 제공하는 방법, 장치 및 시스템
KR102405675B1 (ko) 2022-02-24 2022-06-08 주식회사 필라이즈 인공지능 기반의 맞춤형 건강기능식품 상태 및 복용 정보를 제공하는 방법, 장치 및 시스템
KR102405673B1 (ko) 2022-02-24 2022-06-08 주식회사 필라이즈 인공지능 기반의 개인화된 건강기능식품 정보를 제공하는 방법, 장치 및 시스템
KR102545551B1 (ko) 2022-11-16 2023-06-21 주식회사 바디버디 인공지능 기반 맞춤형 건강기능식품 큐레이션 서비스 제공 방법, 장치 및 시스템

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5850280A (en) * 1994-06-16 1998-12-15 Nikon Corporation Stage unit, drive table, and scanning exposure and apparatus using same
US6721034B1 (en) 1994-06-16 2004-04-13 Nikon Corporation Stage unit, drive table, and scanning exposure apparatus using the same
JP3484684B2 (ja) 1994-11-01 2004-01-06 株式会社ニコン ステージ装置及び走査型露光装置
JP3312164B2 (ja) * 1995-04-07 2002-08-05 日本電信電話株式会社 真空吸着装置
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
SG88824A1 (en) 1996-11-28 2002-05-21 Nikon Corp Projection exposure method
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
EP0890136B9 (fr) * 1996-12-24 2003-12-10 ASML Netherlands B.V. Dispositif de positionnement bidimensionnellement equilibre a deux porte-objets, et dispositif lithographique comportant ledit dispositif
JP3626504B2 (ja) 1997-03-10 2005-03-09 アーエスエム リソグラフィ ベスローテン フェンノートシャップ ２個の物品ホルダを有する位置決め装置
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
JP4264676B2 (ja) 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
KR20010045963A (ko) 1999-11-09 2001-06-05 박종섭 반도체 소자의 캐패시터 제조방법
WO2001035168A1 (fr) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Lithographie interferentielle utilisant des faisceaux de balayage a verrouillage de phase
JP4714403B2 (ja) 2001-02-27 2011-06-29 エーエスエムエル ユーエス，インコーポレイテッド デュアルレチクルイメージを露光する方法および装置
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
AU2003256081A1 (en) 2002-08-23 2004-03-11 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP4529433B2 (ja) 2002-12-10 2010-08-25 株式会社ニコン 露光装置及び露光方法、デバイス製造方法
SG158745A1 (en) * 2002-12-10 2010-02-26 Nikon Corp Exposure apparatus and method for producing device
JP2004310933A (ja) * 2003-04-09 2004-11-04 Sony Corp ディスクドライブ装置
CN1771463A (zh) 2003-04-10 2006-05-10 株式会社尼康 用于沉浸光刻装置收集液体的溢出通道
EP2937893B1 (fr) * 2003-06-13 2016-09-28 Nikon Corporation Procédé et appareil d'exposition, étape de substrat et procédé de fabrication de dispositif
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
KR101200654B1 (ko) 2003-12-15 2012-11-12 칼 짜이스 에스엠티 게엠베하 고 개구율 및 평평한 단부면을 가진 투사 대물렌즈
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
TW201816844A (zh) * 2004-03-25 2018-05-01 日商尼康股份有限公司 曝光裝置、曝光方法、及元件製造方法
US7227619B2 (en) * 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005310933A (ja) * 2004-04-20 2005-11-04 Nikon Corp 基板保持部材、露光装置及びデバイス製造方法
CN102290364B (zh) * 2004-06-09 2016-01-13 尼康股份有限公司 基板保持装置、具备其之曝光装置、元件制造方法
KR101378688B1 (ko) * 2004-06-21 2014-03-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
WO2006030908A1 (fr) * 2004-09-17 2006-03-23 Nikon Corporation Appareil de maintien de substrat, appareil d’exposition et procédé de fabrication de dispositif
WO2006077859A1 (fr) 2005-01-18 2006-07-27 Nikon Corporation Appareillage d'élimination de liquide, appareillage d'exposition et méthode de fabrication d'un dispositif
US20090135382A1 (en) * 2005-04-28 2009-05-28 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US7420194B2 (en) * 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
KR20090060270A (ko) * 2006-09-08 2009-06-11 가부시키가이샤 니콘 클리닝용 부재, 클리닝 방법, 그리고 디바이스 제조 방법

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TWI406321B (zh) 2013-08-21
EP1962329A1 (fr) 2008-08-27
KR20130105920A (ko) 2013-09-26
JP4968076B2 (ja) 2012-07-04
HK1199771A1 (en) 2015-07-17
KR101340138B1 (ko) 2013-12-10
TW200737298A (en) 2007-10-01
EP3327759A1 (fr) 2018-05-30
EP1962329B1 (fr) 2014-08-06
KR20150023915A (ko) 2015-03-05
KR101539517B1 (ko) 2015-07-24
WO2007066758A1 (fr) 2007-06-14
KR20080075906A (ko) 2008-08-19
US8089615B2 (en) 2012-01-03
TW201342427A (zh) 2013-10-16
TWI538014B (zh) 2016-06-11
EP2768016B1 (fr) 2017-10-25
KR101704310B1 (ko) 2017-02-07
JPWO2007066758A1 (ja) 2009-05-21
EP1962329A4 (fr) 2011-06-08
EP2768016A1 (fr) 2014-08-20
US20080239275A1 (en) 2008-10-02

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