HK1123627A1 - 基板保持裝置,曝光裝置,曝光方法和裝置加工方法 - Google Patents
基板保持裝置,曝光裝置,曝光方法和裝置加工方法Info
- Publication number
- HK1123627A1 HK1123627A1 HK09100117.9A HK09100117A HK1123627A1 HK 1123627 A1 HK1123627 A1 HK 1123627A1 HK 09100117 A HK09100117 A HK 09100117A HK 1123627 A1 HK1123627 A1 HK 1123627A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- substrate holding
- fabrication method
- holding device
- device fabrication
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005354463 | 2005-12-08 | ||
PCT/JP2006/324552 WO2007066758A1 (ja) | 2005-12-08 | 2006-12-08 | 基板保持装置、露光装置、露光方法、及びデバイス製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1123627A1 true HK1123627A1 (zh) | 2009-06-19 |
Family
ID=38122903
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09100117.9A HK1123627A1 (zh) | 2005-12-08 | 2009-01-07 | 基板保持裝置,曝光裝置,曝光方法和裝置加工方法 |
HK15100027.0A HK1199771A1 (zh) | 2005-12-08 | 2015-01-02 | 曝光裝置和方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15100027.0A HK1199771A1 (zh) | 2005-12-08 | 2015-01-02 | 曝光裝置和方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8089615B2 (zh) |
EP (3) | EP1962329B1 (zh) |
JP (1) | JP4968076B2 (zh) |
KR (3) | KR101704310B1 (zh) |
HK (2) | HK1123627A1 (zh) |
TW (2) | TWI406321B (zh) |
WO (1) | WO2007066758A1 (zh) |
Families Citing this family (35)
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EP1857880B1 (en) | 2003-04-09 | 2015-09-16 | Nikon Corporation | Exposure method and apparatus and device manufacturing method |
TWI360158B (en) | 2003-10-28 | 2012-03-11 | Nikon Corp | Projection exposure device,exposure method and dev |
TW201809801A (zh) | 2003-11-20 | 2018-03-16 | 日商尼康股份有限公司 | 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法 |
TWI505329B (zh) | 2004-02-06 | 2015-10-21 | 尼康股份有限公司 | 光學照明裝置、曝光裝置、曝光方法以及元件製造方法 |
KR101455551B1 (ko) | 2005-05-12 | 2014-10-27 | 가부시키가이샤 니콘 | 투영 광학계, 노광 장치 및 노광 방법 |
US8451427B2 (en) | 2007-09-14 | 2013-05-28 | Nikon Corporation | Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method |
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KR101562073B1 (ko) | 2007-10-16 | 2015-10-21 | 가부시키가이샤 니콘 | 조명 광학 시스템, 노광 장치 및 디바이스 제조 방법 |
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JP5517171B2 (ja) * | 2009-11-25 | 2014-06-11 | Nskテクノロジー株式会社 | 露光ユニット及び基板の露光方法 |
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JP6400120B2 (ja) * | 2014-12-12 | 2018-10-03 | キヤノン株式会社 | 基板保持装置、リソグラフィ装置、及び物品の製造方法 |
JP6496255B2 (ja) * | 2016-01-29 | 2019-04-03 | 日本特殊陶業株式会社 | 基板保持装置 |
CN113376974A (zh) | 2016-02-08 | 2021-09-10 | Asml荷兰有限公司 | 光刻设备、用于卸载衬底的方法和用于装载衬底的方法 |
JP6650345B2 (ja) * | 2016-05-26 | 2020-02-19 | 日本特殊陶業株式会社 | 基板保持装置及びその製造方法 |
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CN113075865B (zh) * | 2020-01-06 | 2022-11-08 | 夏泰鑫半导体(青岛)有限公司 | 一种用于处理半导体衬底的装置和方法 |
KR102405677B1 (ko) | 2022-02-24 | 2022-06-08 | 주식회사 필라이즈 | 인공지능을 이용한 이미지 인식 기반 맞춤형 건강기능식품 정보를 제공하는 방법, 장치 및 시스템 |
KR102405673B1 (ko) | 2022-02-24 | 2022-06-08 | 주식회사 필라이즈 | 인공지능 기반의 개인화된 건강기능식품 정보를 제공하는 방법, 장치 및 시스템 |
KR102405676B1 (ko) | 2022-02-24 | 2022-06-08 | 주식회사 필라이즈 | 인공지능 기반의 맞춤형 건강기능식품 추천 정보를 제공하는 방법, 장치 및 시스템 |
KR102405675B1 (ko) | 2022-02-24 | 2022-06-08 | 주식회사 필라이즈 | 인공지능 기반의 맞춤형 건강기능식품 상태 및 복용 정보를 제공하는 방법, 장치 및 시스템 |
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KR102545551B1 (ko) | 2022-11-16 | 2023-06-21 | 주식회사 바디버디 | 인공지능 기반 맞춤형 건강기능식품 큐레이션 서비스 제공 방법, 장치 및 시스템 |
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JP2005310933A (ja) * | 2004-04-20 | 2005-11-04 | Nikon Corp | 基板保持部材、露光装置及びデバイス製造方法 |
EP3318928A1 (en) * | 2004-06-09 | 2018-05-09 | Nikon Corporation | Exposure apparatus and method for producing a device |
WO2005124835A1 (ja) * | 2004-06-21 | 2005-12-29 | Nikon Corporation | 露光装置及びデバイス製造方法 |
EP1801850B1 (en) * | 2004-09-17 | 2014-11-26 | Nikon Corporation | Substrate holding apparatus, exposure apparatus and device manufacturing method |
WO2006077859A1 (ja) * | 2005-01-18 | 2006-07-27 | Nikon Corporation | 液体除去装置、露光装置、及びデバイス製造方法 |
US20090135382A1 (en) * | 2005-04-28 | 2009-05-28 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US7420194B2 (en) * | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
WO2008029884A1 (fr) * | 2006-09-08 | 2008-03-13 | Nikon Corporation | Dispositif et procédé de nettoyage, et procédé de fabrication du dispositif |
-
2006
- 2006-12-08 EP EP06834307.8A patent/EP1962329B1/en not_active Not-in-force
- 2006-12-08 KR KR1020157002535A patent/KR101704310B1/ko active IP Right Grant
- 2006-12-08 EP EP17195426.6A patent/EP3327759A1/en not_active Withdrawn
- 2006-12-08 TW TW095146184A patent/TWI406321B/zh not_active IP Right Cessation
- 2006-12-08 JP JP2007549191A patent/JP4968076B2/ja active Active
- 2006-12-08 TW TW102119096A patent/TWI538014B/zh not_active IP Right Cessation
- 2006-12-08 WO PCT/JP2006/324552 patent/WO2007066758A1/ja active Application Filing
- 2006-12-08 EP EP14166620.6A patent/EP2768016B1/en not_active Not-in-force
- 2006-12-08 KR KR1020087016430A patent/KR101340138B1/ko active IP Right Grant
- 2006-12-08 KR KR1020137021783A patent/KR101539517B1/ko active IP Right Grant
-
2008
- 2008-06-05 US US12/155,514 patent/US8089615B2/en not_active Expired - Fee Related
-
2009
- 2009-01-07 HK HK09100117.9A patent/HK1123627A1/zh not_active IP Right Cessation
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2015
- 2015-01-02 HK HK15100027.0A patent/HK1199771A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101340138B1 (ko) | 2013-12-10 |
KR101539517B1 (ko) | 2015-07-24 |
TWI538014B (zh) | 2016-06-11 |
EP1962329B1 (en) | 2014-08-06 |
EP2768016A1 (en) | 2014-08-20 |
TWI406321B (zh) | 2013-08-21 |
EP1962329A4 (en) | 2011-06-08 |
KR20150023915A (ko) | 2015-03-05 |
KR20080075906A (ko) | 2008-08-19 |
JP4968076B2 (ja) | 2012-07-04 |
JPWO2007066758A1 (ja) | 2009-05-21 |
HK1199771A1 (zh) | 2015-07-17 |
KR101704310B1 (ko) | 2017-02-07 |
US8089615B2 (en) | 2012-01-03 |
TW201342427A (zh) | 2013-10-16 |
US20080239275A1 (en) | 2008-10-02 |
EP3327759A1 (en) | 2018-05-30 |
TW200737298A (en) | 2007-10-01 |
EP2768016B1 (en) | 2017-10-25 |
KR20130105920A (ko) | 2013-09-26 |
WO2007066758A1 (ja) | 2007-06-14 |
EP1962329A1 (en) | 2008-08-27 |
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