WO2011120174A1 - Appareil et procédé d'aplanissement de tranche - Google Patents

Appareil et procédé d'aplanissement de tranche Download PDF

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Publication number
WO2011120174A1
WO2011120174A1 PCT/CA2011/050183 CA2011050183W WO2011120174A1 WO 2011120174 A1 WO2011120174 A1 WO 2011120174A1 CA 2011050183 W CA2011050183 W CA 2011050183W WO 2011120174 A1 WO2011120174 A1 WO 2011120174A1
Authority
WO
WIPO (PCT)
Prior art keywords
chuck
wafer
centre
grooves
radius
Prior art date
Application number
PCT/CA2011/050183
Other languages
English (en)
Inventor
Bojko Vodanovic
Jakov Kogan
Marc Levesque
Alexandr Filenkov
Original Assignee
Topcon 3D Inspection Laboratories, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topcon 3D Inspection Laboratories, Inc. filed Critical Topcon 3D Inspection Laboratories, Inc.
Publication of WO2011120174A1 publication Critical patent/WO2011120174A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte sur un appareil et sur un procédé pour fixer une tranche sensiblement circulaire, lesquels comprennent un mandrin comprenant une pluralité de rainures de tension comprenant chacune au moins une courbure en forme d'arc ayant un rayon de courbure sensiblement inférieur à un rayon de région externe, et une source de vide interconnectée à chacune des rainures. Lorsque la tranche est disposée sur la surface de façon concentrique au centre du mandrin et que la source de vide est appliquée aux rainures, la tranche est maintenue fermement sur la surface. L'invention porte de plus sur un appareil pour fixer une tranche, lequel appareil comporte un mandrin et un collier comprenant un support rigide et un joint torique, le joint torique ayant un diamètre légèrement inférieur à celui de la périphérie externe. Lorsque la tranche est abaissée sur la surface dans une position concentrique au centre du mandrin, le collier est disposé contre la surface supérieure de façon concentrique à la périphérie, et la source de vide est appliquée, fixant la tranche à la surface.
PCT/CA2011/050183 2010-04-01 2011-04-01 Appareil et procédé d'aplanissement de tranche WO2011120174A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32000110P 2010-04-01 2010-04-01
US61/320,001 2010-04-01

Publications (1)

Publication Number Publication Date
WO2011120174A1 true WO2011120174A1 (fr) 2011-10-06

Family

ID=44708720

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2011/050183 WO2011120174A1 (fr) 2010-04-01 2011-04-01 Appareil et procédé d'aplanissement de tranche

Country Status (2)

Country Link
US (1) US8695990B2 (fr)
WO (1) WO2011120174A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2891173A4 (fr) * 2012-08-31 2016-03-30 Semiconductor Tech & Instr Inc Système multifonction de manipulation de plaquettes et de cadres de film

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111496379B (zh) * 2014-08-19 2022-08-26 亮锐控股有限公司 用于减少在管芯级激光剥离期间所受机械损伤的蓝宝石收集器
TWI581904B (zh) * 2014-11-18 2017-05-11 漢民科技股份有限公司 工件處理裝置與方法
EP3295479B1 (fr) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Collecteur de saphir destiné à réduire les dommages mécaniques lors du décollement laser au niveau d'une puce
US10468290B2 (en) * 2016-11-02 2019-11-05 Ultratech, Inc. Wafer chuck apparatus with micro-channel regions
JP7194552B2 (ja) * 2017-11-21 2022-12-22 日本特殊陶業株式会社 真空吸引装置
EP3864690A1 (fr) * 2018-10-10 2021-08-18 Nordson Corporation Appareil et procédé de serrage sous vide
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US20070267145A1 (en) * 2006-05-19 2007-11-22 Hiroho Kitada Sample table and plasma processing apparatus provided with the same
US20090093192A1 (en) * 2005-04-19 2009-04-09 Ebara Corporation Device for and method of polishing peripheral edge of semiconductor wafer
US20100013169A1 (en) * 2008-07-17 2010-01-21 Bjorn Monteen Thin wafer chuck

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
EP2768016B1 (fr) * 2005-12-08 2017-10-25 Nikon Corporation Dispositif d'exposition et procédé d'exposition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US20090093192A1 (en) * 2005-04-19 2009-04-09 Ebara Corporation Device for and method of polishing peripheral edge of semiconductor wafer
US20070267145A1 (en) * 2006-05-19 2007-11-22 Hiroho Kitada Sample table and plasma processing apparatus provided with the same
US20100013169A1 (en) * 2008-07-17 2010-01-21 Bjorn Monteen Thin wafer chuck

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2891173A4 (fr) * 2012-08-31 2016-03-30 Semiconductor Tech & Instr Inc Système multifonction de manipulation de plaquettes et de cadres de film
TWI601193B (zh) * 2012-08-31 2017-10-01 聯逹科技設備私人有限公司 多功能晶圓及膜片架操作系統
US10262885B2 (en) 2012-08-31 2019-04-16 Semiconductor Technologies & Instruments Pte Ltd Multifunction wafer and film frame handling system

Also Published As

Publication number Publication date
US8695990B2 (en) 2014-04-15
US20110241298A1 (en) 2011-10-06

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