HK1096473A1 - Semiconductor device and processing method for starting the same - Google Patents

Semiconductor device and processing method for starting the same

Info

Publication number
HK1096473A1
HK1096473A1 HK07103566.1A HK07103566A HK1096473A1 HK 1096473 A1 HK1096473 A1 HK 1096473A1 HK 07103566 A HK07103566 A HK 07103566A HK 1096473 A1 HK1096473 A1 HK 1096473A1
Authority
HK
Hong Kong
Prior art keywords
starting
same
semiconductor device
processing method
semiconductor
Prior art date
Application number
HK07103566.1A
Other languages
English (en)
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of HK1096473A1 publication Critical patent/HK1096473A1/xx

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/14Error detection or correction of the data by redundancy in operation
    • G06F11/1402Saving, restoring, recovering or retrying
    • G06F11/1415Saving, restoring, recovering or retrying at system level
    • G06F11/1417Boot up procedures
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F8/00Arrangements for software engineering
    • G06F8/40Transformation of program code
    • G06F8/54Link editing before load time
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/16Protection against loss of memory contents
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/22Microcontrol or microprogram arrangements
    • G06F9/24Loading of the microprogram
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/16Error detection or correction of the data by redundancy in hardware
    • G06F11/1666Error detection or correction of the data by redundancy in hardware where the redundant component is memory or memory area
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/16Error detection or correction of the data by redundancy in hardware
    • G06F11/20Error detection or correction of the data by redundancy in hardware using active fault-masking, e.g. by switching out faulty elements or by switching in spare elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Quality & Reliability (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Stored Programmes (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Detection And Correction Of Errors (AREA)
  • Retry When Errors Occur (AREA)
  • Read Only Memory (AREA)
HK07103566.1A 2004-01-28 2007-04-03 Semiconductor device and processing method for starting the same HK1096473A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004019278A JP4534498B2 (ja) 2004-01-28 2004-01-28 半導体装置およびその起動処理方法
PCT/JP2005/001105 WO2005073850A1 (ja) 2004-01-28 2005-01-27 半導体装置及びその起動処理方法

Publications (1)

Publication Number Publication Date
HK1096473A1 true HK1096473A1 (en) 2007-06-01

Family

ID=34823709

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07103566.1A HK1096473A1 (en) 2004-01-28 2007-04-03 Semiconductor device and processing method for starting the same

Country Status (9)

Country Link
US (1) US8135991B2 (ja)
EP (1) EP1710696B8 (ja)
JP (1) JP4534498B2 (ja)
KR (1) KR101106351B1 (ja)
CN (1) CN1914598B (ja)
HK (1) HK1096473A1 (ja)
MY (1) MY149790A (ja)
TW (1) TWI279727B (ja)
WO (1) WO2005073850A1 (ja)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4598711B2 (ja) 2006-03-30 2010-12-15 富士通株式会社 誤り訂正装置
JP4840859B2 (ja) 2006-05-10 2011-12-21 ルネサスエレクトロニクス株式会社 半導体装置、及び起動方法
JP5066894B2 (ja) * 2006-11-07 2012-11-07 富士ゼロックス株式会社 記憶媒体制御装置
JP5125099B2 (ja) * 2006-12-28 2013-01-23 日本電気株式会社 情報記憶装置、情報記憶方法及びプログラム
JP5021404B2 (ja) * 2007-09-14 2012-09-05 株式会社リコー 電子機器、電子機器の起動制御方法及び画像形成装置
US8683213B2 (en) * 2007-10-26 2014-03-25 Qualcomm Incorporated Progressive boot for a wireless device
JP2009157632A (ja) * 2007-12-26 2009-07-16 Toshiba Corp 情報処理装置
CN101526907B (zh) * 2008-03-04 2012-06-20 深圳市爱国者嵌入式系统科技有限公司 避免电子产品开机错误的闪存管理方法
CN101329632B (zh) * 2008-04-30 2014-02-19 中兴通讯股份有限公司 一种使用boot启动cpu的方法与装置
US7996736B2 (en) * 2008-10-26 2011-08-09 Sandisk 3D Llc Bad page marking strategy for fast readout in memory
CN101520735B (zh) * 2008-12-18 2013-09-18 康佳集团股份有限公司 一种启动闪存内引导程序的方法及其网络电视和机顶盒
US8175012B2 (en) * 2009-03-26 2012-05-08 Mediatek Inc. Decoding/encoding method for booting from a NAND flash and system thereof
WO2011001486A1 (ja) * 2009-06-30 2011-01-06 パナソニック株式会社 データ処理方法、半導体集積回路
CN102135891B (zh) * 2010-01-21 2013-06-26 杭州华三通信技术有限公司 可实现引导启动的系统及引导启动控制装置和方法
US8726087B2 (en) 2011-03-18 2014-05-13 Denso International America, Inc. System and method for curing a read inability state in a memory device
WO2012140710A1 (ja) * 2011-04-14 2012-10-18 パナソニック株式会社 ブート制御装置、ブートシステム及びブート制御方法
CN102135927B (zh) * 2011-04-29 2013-02-13 杭州华三通信技术有限公司 一种基于nand flash的系统引导方法和装置
JP5077726B1 (ja) * 2011-05-23 2012-11-21 Necインフロンティア株式会社 コンピュータ、その制御方法及びプログラム
JP2012252557A (ja) * 2011-06-03 2012-12-20 Mega Chips Corp メモリコントローラ
JP2011210277A (ja) * 2011-06-20 2011-10-20 Toshiba Corp 情報処理装置および情報処理方法
CN102317920A (zh) * 2011-07-18 2012-01-11 华为技术有限公司 数据处理方法及设备
CN103279399A (zh) * 2013-06-27 2013-09-04 北京汉邦高科数字技术股份有限公司 一种嵌入式CPU在NAND Flash上启动的方法
JP2015046088A (ja) * 2013-08-29 2015-03-12 京セラドキュメントソリューションズ株式会社 半導体装置
CN103473098A (zh) * 2013-09-10 2013-12-25 华为技术有限公司 一种boot程序的启动方法和相关装置
TWI544492B (zh) * 2013-12-31 2016-08-01 慧榮科技股份有限公司 電子裝置及其資料維護方法
KR20160006482A (ko) * 2014-07-09 2016-01-19 에스케이하이닉스 주식회사 반도체 장치
KR102189780B1 (ko) 2014-08-11 2020-12-11 삼성전자주식회사 반도체 메모리 장치 및 이를 포함하는 메모리 시스템
CN105700901B (zh) 2014-11-28 2020-05-08 华为技术有限公司 一种启动方法、装置和计算机系统
JP2017045405A (ja) * 2015-08-28 2017-03-02 株式会社東芝 メモリシステム
TWI634561B (zh) * 2017-03-24 2018-09-01 群聯電子股份有限公司 資料保護方法、記憶體儲存裝置及記憶體控制電路單元
JP2020087293A (ja) * 2018-11-30 2020-06-04 キヤノン株式会社 情報処理装置および情報処理装置の制御方法
CN109634674B (zh) * 2018-12-06 2022-03-29 深圳忆联信息系统有限公司 芯片boot启动方法、装置、计算机设备和存储介质

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5771508A (en) 1980-10-20 1982-05-04 Nec Corp Magnetic storage control device
IT1254937B (it) * 1991-05-06 1995-10-11 Aggiornamento dinamico di memoria non volatile in un sistema informatico
JPH05151093A (ja) * 1991-11-27 1993-06-18 Nec Corp マイクロコントローラのプログラミング方式
JPH05265767A (ja) 1992-03-17 1993-10-15 Nec Corp プログラム起動方法
JP3296520B2 (ja) 1993-09-29 2002-07-02 東芝テック株式会社 ダウンロード・ブートストラップ方法
JPH0877066A (ja) * 1994-08-31 1996-03-22 Tdk Corp フラッシュメモリコントローラ
US6018806A (en) * 1995-10-16 2000-01-25 Packard Bell Nec Method and system for rebooting a computer having corrupted memory using an external jumper
JPH1011293A (ja) 1996-06-27 1998-01-16 Nec Corp 情報処理装置
US5793943A (en) 1996-07-29 1998-08-11 Micron Electronics, Inc. System for a primary BIOS ROM recovery in a dual BIOS ROM computer system
JPH10333913A (ja) 1997-06-02 1998-12-18 Hitachi Telecom Technol Ltd ソフトウェアブート制御方式
JP2914360B2 (ja) * 1997-09-30 1999-06-28 ソニー株式会社 外部記憶装置及びデータ処理方法
TW436675B (en) * 1998-01-07 2001-05-28 Hitachi Ltd Memory reproduction device, error correciton method, and portable information terminal and digital camera using the same
US6032248A (en) * 1998-04-29 2000-02-29 Atmel Corporation Microcontroller including a single memory module having a data memory sector and a code memory sector and supporting simultaneous read/write access to both sectors
US6311213B2 (en) * 1998-10-27 2001-10-30 International Business Machines Corporation System and method for server-to-server data storage in a network environment
US6892323B2 (en) * 1999-05-05 2005-05-10 Giga-Byte Technology Co., Ltd. Dual basic input/output system for a computer
TW446864B (en) * 1999-05-11 2001-07-21 Micro Star Int Co Ltd Automatic BIOS backup method
KR20000073693A (ko) * 1999-05-13 2000-12-05 윤종용 마이크로프로세서 응용시스템에서 부트-롬 구조 및 부트-롬 교체방법
JP2001027953A (ja) * 1999-07-15 2001-01-30 Mitsubishi Electric Corp 半導体記憶装置
US6415348B1 (en) * 1999-08-23 2002-07-02 Advanced Micro Devices, Inc. Flexible microcontroller architecture
KR100577380B1 (ko) * 1999-09-29 2006-05-09 삼성전자주식회사 플래시 메모리와 그 제어 방법
JP2002074983A (ja) * 2000-08-25 2002-03-15 Nec Microsystems Ltd 半導体集積回路
JP4095767B2 (ja) * 2000-11-13 2008-06-04 株式会社ルネサステクノロジ ディスクドライブ装置
US6694451B2 (en) * 2000-12-07 2004-02-17 Hewlett-Packard Development Company, L.P. Method for redundant suspend to RAM
US6591352B2 (en) * 2001-05-31 2003-07-08 Intel Corporation Method and apparatus for executing firmware from a valid startup block
US6651188B2 (en) 2001-06-29 2003-11-18 Intel Corporation Automatic replacement of corrupted BIOS image
EP1300762A1 (de) 2001-08-21 2003-04-09 Alcatel Integrierte Schaltung mit externem Speicher
JP3822081B2 (ja) * 2001-09-28 2006-09-13 東京エレクトロンデバイス株式会社 データ書込装置、データ書込制御方法及びプログラム
JP4162401B2 (ja) 2001-12-18 2008-10-08 富士通株式会社 携帯端末装置および間欠受信方法
US7533214B2 (en) * 2002-02-27 2009-05-12 Microsoft Corporation Open architecture flash driver
TWI228220B (en) 2002-03-08 2005-02-21 Samsung Electronics Co Ltd System boot using NAND flash memory and method thereof
US7143275B2 (en) * 2002-08-01 2006-11-28 Hewlett-Packard Development Company, L.P. System firmware back-up using a BIOS-accessible pre-boot partition
JP2004110086A (ja) 2002-09-13 2004-04-08 Seiko Epson Corp 半導体装置
US20040139307A1 (en) 2003-01-09 2004-07-15 Barnett Philip C. Method and apparatus for initializing a semiconductor circuit from an external interface
JP2004318330A (ja) 2003-04-14 2004-11-11 Renesas Technology Corp 半導体集積回路装置およびデータ処理システム

Also Published As

Publication number Publication date
US20080046637A1 (en) 2008-02-21
CN1914598A (zh) 2007-02-14
KR20060127093A (ko) 2006-12-11
US8135991B2 (en) 2012-03-13
WO2005073850A1 (ja) 2005-08-11
EP1710696A4 (en) 2012-07-04
JP2005215824A (ja) 2005-08-11
JP4534498B2 (ja) 2010-09-01
TWI279727B (en) 2007-04-21
EP1710696B8 (en) 2014-03-05
CN1914598B (zh) 2011-02-02
EP1710696A1 (en) 2006-10-11
EP1710696B1 (en) 2013-11-27
TW200537565A (en) 2005-11-16
MY149790A (en) 2013-10-14
KR101106351B1 (ko) 2012-01-18

Similar Documents

Publication Publication Date Title
HK1096473A1 (en) Semiconductor device and processing method for starting the same
TWI346995B (en) Semiconductor device and method for producing the same
EP1775059A4 (en) LASER PROCESSING METHOD AND SEMICONDUCTOR DEVICE
SG119329A1 (en) Semiconductor device and method for manufacturing the same
TWI316293B (en) Semiconductor device and method for manufacturing the same
EP1756949A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
TWI367528B (en) Semiconductor processing apparatus and method
EP1686629A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP1921674A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
TWI372445B (en) Semiconductor device and method for making the same
EP1617483A4 (en) SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
EP1887624A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
SG114787A1 (en) Semiconductor device and manufacturing method of the same
EP1935027A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP1946374A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP1966740A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP1710833A4 (en) SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME
EP1598938A4 (en) SEMICONDUCTOR DEVICE AND ITS OPERATING MODE
EP1817796A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
IL172852A0 (en) Substrate processing method and substrate processing device
TWI348216B (en) Manufacturing method for semiconductor device and semiconductor device
TWI372439B (en) Semiconductor wafer positioning method, and apparatus using the same
EP1966826A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THEIR FORMING
EP1965435A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP1933390A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

Legal Events

Date Code Title Description
CORR Corrigendum

Free format text: CORRECTED DATA OF SECTION 20 TO JOURNAL OF 20111025: [72]