HK1091942A1 - Superconducting wire and method of production thereof - Google Patents
Superconducting wire and method of production thereofInfo
- Publication number
- HK1091942A1 HK1091942A1 HK06112483.3A HK06112483A HK1091942A1 HK 1091942 A1 HK1091942 A1 HK 1091942A1 HK 06112483 A HK06112483 A HK 06112483A HK 1091942 A1 HK1091942 A1 HK 1091942A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- production
- superconducting wire
- superconducting
- wire
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003287971A JP2005056754A (ja) | 2003-08-06 | 2003-08-06 | 超電導線材およびその製造方法 |
PCT/JP2004/009951 WO2005015575A1 (ja) | 2003-08-06 | 2004-07-13 | 超電導線材およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1091942A1 true HK1091942A1 (en) | 2007-01-26 |
Family
ID=34131494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06112483.3A HK1091942A1 (en) | 2003-08-06 | 2006-11-13 | Superconducting wire and method of production thereof |
Country Status (11)
Country | Link |
---|---|
US (1) | US20060219322A1 (de) |
EP (1) | EP1653484B2 (de) |
JP (1) | JP2005056754A (de) |
KR (1) | KR101016868B1 (de) |
CN (1) | CN100477020C (de) |
AU (1) | AU2004264090A1 (de) |
CA (1) | CA2522078A1 (de) |
HK (1) | HK1091942A1 (de) |
RU (1) | RU2332737C2 (de) |
TW (1) | TW200518115A (de) |
WO (1) | WO2005015575A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4411265B2 (ja) * | 2005-10-21 | 2010-02-10 | 財団法人国際超電導産業技術研究センター | 希土類系テープ状酸化物超電導体及びその製造方法 |
JP2007200870A (ja) * | 2006-01-26 | 2007-08-09 | Ls Cable Ltd | 超伝導ケーブル用基板の製造方法 |
JP5049530B2 (ja) * | 2006-08-01 | 2012-10-17 | 日本ミクロコーティング株式会社 | 酸化物超伝導体用テープ基材の研磨方法並びに酸化物超伝導体及び酸化物超伝導体用基材 |
JP5252792B2 (ja) * | 2006-08-25 | 2013-07-31 | 日本ミクロコーティング株式会社 | 酸化物超伝導体用テープ基材の研磨方法並びに酸化物超伝導体及び酸化物超伝導体用基材 |
CN101221898B (zh) * | 2007-01-08 | 2011-05-11 | 晶能光电(江西)有限公司 | 用于制造具有高质量表面的金属衬底的方法 |
JP5049611B2 (ja) * | 2007-02-16 | 2012-10-17 | 日本ミクロコーティング株式会社 | 超電導体用テープ基材の製造方法及びテープ基材 |
US8316158B1 (en) | 2007-03-12 | 2012-11-20 | Cypress Semiconductor Corporation | Configuration of programmable device using a DMA controller |
JP2008311222A (ja) * | 2007-05-11 | 2008-12-25 | Furukawa Electric Co Ltd:The | 超電導線およびその製造方法 |
DE102007024166B4 (de) * | 2007-05-24 | 2011-01-05 | Zenergy Power Gmbh | Verfahren zum Bearbeiten eines Metallsubstrats und Verwendung dessen für einen Hochtemperatur-Supraleiter |
JP5113430B2 (ja) * | 2007-06-05 | 2013-01-09 | 九州電力株式会社 | 金属めっき複合基材 |
JP5173318B2 (ja) * | 2007-08-24 | 2013-04-03 | 日本ミクロコーティング株式会社 | テープ状基材の研磨方法及び酸化物超伝導体用ベース基材 |
JP5448425B2 (ja) | 2008-11-21 | 2014-03-19 | 公益財団法人国際超電導産業技術研究センター | 超電導膜成膜用基板、超電導線材及びそれらの製造方法 |
DE102008058768B4 (de) * | 2008-11-24 | 2011-12-15 | Zenergy Power Gmbh | Verfahren zur Herstellung von Metallsubstraten für HTS-Schichtanordnungen |
JP2010163679A (ja) * | 2008-12-18 | 2010-07-29 | Sumitomo Electric Ind Ltd | 酸化物薄膜の成膜装置および成膜方法 |
JP5435448B2 (ja) * | 2008-12-24 | 2014-03-05 | 古河電気工業株式会社 | 超電導線材用テープ状基材、その製造方法、及び超電導線材 |
AT12768U1 (de) * | 2010-03-29 | 2012-11-15 | Ctr Carinthian Tech Res Ag | Hochtemperaturbeständige, elektrisch leitfähige dünnschichten |
EP2381499B1 (de) * | 2010-04-26 | 2014-12-17 | Bruker HTS GmbH | Verfahren zum Einstellen von AC Verlusten in einem bandartigen Superleiter mit Anisotropie kritischer Ströme |
JP2012049086A (ja) * | 2010-08-30 | 2012-03-08 | Sumitomo Electric Ind Ltd | 酸化物超電導薄膜線材、酸化物超電導薄膜線材用金属基板およびその製造方法 |
JP5767896B2 (ja) * | 2011-08-09 | 2015-08-26 | 株式会社フジクラ | 基材接続部を有する酸化物超電導導体とその製造方法 |
US9378869B2 (en) * | 2011-11-15 | 2016-06-28 | Furukawa Electric Co., Ltd. | Superconductive wire material substrate, manufacturing method thereof and superconductive wire material |
US20150279519A1 (en) * | 2012-06-27 | 2015-10-01 | Furukawa Electric Co., Ltd. | Superconducting wire |
JP6056877B2 (ja) * | 2015-01-07 | 2017-01-11 | 三菱マテリアル株式会社 | 超伝導線、及び、超伝導コイル |
WO2017105029A1 (ko) * | 2015-12-14 | 2017-06-22 | 한국전기연구원 | 금속기판 결함에 의해 자기 정렬된 초전도 스트립을 구비하는 초전도 선재의 제조 방법 |
JP6299802B2 (ja) | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | 超伝導安定化材、超伝導線及び超伝導コイル |
JP6788152B1 (ja) * | 2018-12-28 | 2020-11-18 | 株式会社フジクラ | 酸化物超電導線材及びその製造方法 |
KR20210138858A (ko) | 2020-05-13 | 2021-11-22 | 한국전기연구원 | 유리기판을 이용한 고온초전도선재 및 이의 제조방법 |
JP2024519440A (ja) * | 2021-03-30 | 2024-05-14 | アヴェラテック・コーポレイション | 表皮深さ損失を軽減する高抵抗および低抵抗導体層のための方法およびデバイス |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2008310C (en) * | 1989-02-04 | 1997-03-04 | Satoshi Takano | Superconducting wire |
JP2803123B2 (ja) * | 1989-02-04 | 1998-09-24 | 住友電気工業株式会社 | 超電導線 |
JPH02248304A (ja) * | 1989-03-20 | 1990-10-04 | Mitsubishi Metal Corp | 超伝導体薄膜の製造方法 |
JP2877367B2 (ja) * | 1989-09-05 | 1999-03-31 | 株式会社東芝 | 超電導線材 |
DE4006094A1 (de) * | 1990-02-27 | 1991-08-29 | Kabelmetal Electro Gmbh | Hochtemperatursupraleiter aus einem gewellten metallrohr |
DE69119022T2 (de) * | 1990-10-08 | 1996-10-31 | Sumitomo Electric Industries | Supraleitende Einrichtung mit ultradünnem Kanal aus oxydisch supraleitendem Material und Verfahren zu deren Herstellung |
JP3278461B2 (ja) * | 1992-08-19 | 2002-04-30 | 住友電気工業株式会社 | 超電導線の製造方法 |
US5389194A (en) * | 1993-02-05 | 1995-02-14 | Lsi Logic Corporation | Methods of cleaning semiconductor substrates after polishing |
JP2994183B2 (ja) * | 1993-09-21 | 1999-12-27 | 財団法人国際超電導産業技術研究センター | 超電導素子およびその作製方法 |
JP2813287B2 (ja) * | 1993-10-08 | 1998-10-22 | 株式会社東芝 | 超電導線材 |
US6451450B1 (en) * | 1995-04-10 | 2002-09-17 | Ut-Battelle, Llc | Method of depositing a protective layer over a biaxially textured alloy substrate and composition therefrom |
JP4033945B2 (ja) * | 1997-08-01 | 2008-01-16 | 株式会社フジクラ | 酸化物超電導導体およびその製造方法 |
US6458223B1 (en) | 1997-10-01 | 2002-10-01 | American Superconductor Corporation | Alloy materials |
GB2336849B (en) † | 1998-04-27 | 2003-02-26 | Telcon Ltd | Substrate materials |
US6296701B1 (en) * | 1998-09-30 | 2001-10-02 | Ut-Battelle, Llc | Method of depositing an electrically conductive oxide film on a textured metallic substrate and articles formed therefrom |
US6827634B2 (en) | 2000-05-22 | 2004-12-07 | Agency Of Industrial Science And Technology | Ultra fine particle film forming method and apparatus |
JP4316070B2 (ja) * | 1999-10-07 | 2009-08-19 | 古河電気工業株式会社 | 高強度配向多結晶金属基板および酸化物超電導線材 |
US6455166B1 (en) * | 2000-05-11 | 2002-09-24 | The University Of Chicago | Metallic substrates for high temperature superconductors |
US6617283B2 (en) * | 2001-06-22 | 2003-09-09 | Ut-Battelle, Llc | Method of depositing an electrically conductive oxide buffer layer on a textured substrate and articles formed therefrom |
US6569745B2 (en) * | 2001-06-28 | 2003-05-27 | Sharp Laboratories Of America, Inc. | Shared bit line cross point memory array |
JP2003055095A (ja) * | 2001-08-07 | 2003-02-26 | Sumitomo Electric Ind Ltd | 薄膜形成方法 |
US7129196B2 (en) * | 2003-07-21 | 2006-10-31 | Los Alamos National Security, Llc | Buffer layer for thin film structures |
-
2003
- 2003-08-06 JP JP2003287971A patent/JP2005056754A/ja active Pending
-
2004
- 2004-07-13 RU RU2006106705/09A patent/RU2332737C2/ru not_active IP Right Cessation
- 2004-07-13 CN CNB2004800225796A patent/CN100477020C/zh not_active Expired - Fee Related
- 2004-07-13 CA CA002522078A patent/CA2522078A1/en not_active Abandoned
- 2004-07-13 KR KR1020067002410A patent/KR101016868B1/ko not_active IP Right Cessation
- 2004-07-13 AU AU2004264090A patent/AU2004264090A1/en not_active Abandoned
- 2004-07-13 US US10/552,728 patent/US20060219322A1/en not_active Abandoned
- 2004-07-13 EP EP04747417.6A patent/EP1653484B2/de not_active Expired - Lifetime
- 2004-07-13 WO PCT/JP2004/009951 patent/WO2005015575A1/ja active Application Filing
- 2004-08-02 TW TW093123083A patent/TW200518115A/zh unknown
-
2006
- 2006-11-13 HK HK06112483.3A patent/HK1091942A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101016868B1 (ko) | 2011-02-22 |
AU2004264090A1 (en) | 2005-02-17 |
CN1833295A (zh) | 2006-09-13 |
CN100477020C (zh) | 2009-04-08 |
US20060219322A1 (en) | 2006-10-05 |
WO2005015575A1 (ja) | 2005-02-17 |
RU2006106705A (ru) | 2006-07-27 |
EP1653484A4 (de) | 2009-12-02 |
RU2332737C2 (ru) | 2008-08-27 |
TW200518115A (en) | 2005-06-01 |
KR20060055535A (ko) | 2006-05-23 |
EP1653484B1 (de) | 2012-08-08 |
EP1653484B2 (de) | 2015-12-02 |
JP2005056754A (ja) | 2005-03-03 |
CA2522078A1 (en) | 2005-02-17 |
EP1653484A1 (de) | 2006-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120713 |