HK1089561A1 - Wafer carrier having improved processing characteristics - Google Patents

Wafer carrier having improved processing characteristics

Info

Publication number
HK1089561A1
HK1089561A1 HK06109939A HK06109939A HK1089561A1 HK 1089561 A1 HK1089561 A1 HK 1089561A1 HK 06109939 A HK06109939 A HK 06109939A HK 06109939 A HK06109939 A HK 06109939A HK 1089561 A1 HK1089561 A1 HK 1089561A1
Authority
HK
Hong Kong
Prior art keywords
wafer carrier
processing characteristics
improved processing
improved
wafer
Prior art date
Application number
HK06109939A
Other languages
English (en)
Inventor
Richard F Buckley
Andrew G Haerle
Han C Chang
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of HK1089561A1 publication Critical patent/HK1089561A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Chemical Vapour Deposition (AREA)
HK06109939A 2003-03-28 2006-09-07 Wafer carrier having improved processing characteristics HK1089561A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/402,915 US20040188319A1 (en) 2003-03-28 2003-03-28 Wafer carrier having improved processing characteristics
PCT/US2004/006847 WO2004095545A2 (en) 2003-03-28 2004-03-05 Wafer carrier having improved processing characteristics

Publications (1)

Publication Number Publication Date
HK1089561A1 true HK1089561A1 (en) 2006-12-01

Family

ID=32989844

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06109939A HK1089561A1 (en) 2003-03-28 2006-09-07 Wafer carrier having improved processing characteristics

Country Status (8)

Country Link
US (1) US20040188319A1 (zh)
EP (1) EP1609171A2 (zh)
JP (2) JP2006521689A (zh)
KR (1) KR100755196B1 (zh)
CN (1) CN100390927C (zh)
HK (1) HK1089561A1 (zh)
TW (1) TWI288454B (zh)
WO (1) WO2004095545A2 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112052A1 (ja) * 2005-03-30 2006-10-26 Ibiden Co., Ltd. 炭化珪素含有粒子、炭化珪素質焼結体を製造する方法、炭化珪素質焼結体、及びフィルター
CN101928934B (zh) * 2009-06-18 2012-11-28 中芯国际集成电路制造(上海)有限公司 提高晶圆的高温氧化物层均匀性的方法
CN103151289B (zh) * 2011-12-07 2015-11-25 无锡华润华晶微电子有限公司 晶舟、晶舟转移装置以及包括其的晶片转移系统
JP5991284B2 (ja) * 2013-08-23 2016-09-14 信越半導体株式会社 シリコンウェーハの熱処理方法
CN103681416A (zh) * 2013-11-29 2014-03-26 上海华力微电子有限公司 一种监控多晶硅炉管晶圆厚度的方法
CN104269351B (zh) * 2014-09-30 2017-02-22 上海华力微电子有限公司 改善hcd氮化硅沉积工艺的应力缺陷的方法
WO2016166125A1 (de) * 2015-04-13 2016-10-20 Kornmeyer Carbon-Group Gmbh Pecvd-boot
JP7251458B2 (ja) * 2019-12-05 2023-04-04 株式会社Sumco シリコンウェーハの製造方法

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US3634116A (en) * 1969-06-02 1972-01-11 Dow Corning Silicon-carbide-encased graphite articles and their production
NL7206014A (zh) * 1971-07-07 1973-01-09
US3923156A (en) * 1974-04-29 1975-12-02 Fluoroware Inc Wafer basket
JPS512161U (zh) * 1974-06-24 1976-01-09
JPS5285476A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Semiconductor wafer accommodating jig
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
JPS59191327A (ja) * 1983-04-15 1984-10-30 Hitachi Ltd 熱処理用治具
US4548159A (en) * 1984-07-06 1985-10-22 Anicon, Inc. Chemical vapor deposition wafer boat
JPS6142153A (ja) * 1984-08-03 1986-02-28 Fujitsu Ltd 耐熱治具
JPS61213374A (ja) 1985-03-18 1986-09-22 Hitachi Micro Comput Eng Ltd 治具
US4653636A (en) * 1985-05-14 1987-03-31 Microglass, Inc. Wafer carrier and method
JPH0622262B2 (ja) * 1985-07-01 1994-03-23 東芝セラミツクス株式会社 半導体ウェハ支持用ボートの製造方法
JP2573480B2 (ja) * 1985-11-22 1997-01-22 東芝セラミックス 株式会社 半導体熱処理用治具
JPH0824140B2 (ja) * 1986-12-26 1996-03-06 東芝セラミックス株式会社 シリコンウエ−ハ処理用治具
JP2548949B2 (ja) * 1987-09-01 1996-10-30 東芝セラミックス株式会社 半導体製造用構成部材
JPH0752720B2 (ja) * 1988-05-31 1995-06-05 信越半導体株式会社 半導体ウェーハ保持装置の保持溝形成方法
US4981222A (en) * 1988-08-24 1991-01-01 Asq Boats, Inc. Wafer boat
JPH04287915A (ja) * 1991-02-07 1992-10-13 Mitsubishi Electric Corp ウェハーボート
JPH065530A (ja) * 1992-06-17 1994-01-14 Toshiba Corp 熱処理炉ボート
JPH06302532A (ja) * 1993-04-13 1994-10-28 Japan Energy Corp 化合物半導体単結晶ウェハの熱処理方法及びそれに用いるウェハ支持具
US5417767A (en) * 1993-12-28 1995-05-23 Stinson; Mark G. Wafer carrier
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
JP3285723B2 (ja) * 1994-11-17 2002-05-27 信越半導体株式会社 半導体熱処理用治具及びその表面処理方法
US5443649A (en) * 1994-11-22 1995-08-22 Sibley; Thomas Silicon carbide carrier for wafer processing in vertical furnaces
US5702997A (en) * 1996-10-04 1997-12-30 Saint-Gobain/Norton Industrial Ceramics Corp. Process for making crack-free silicon carbide diffusion components
JPH10242254A (ja) * 1997-02-21 1998-09-11 Ado Matsupu:Kk 半導体製造用治具
JP3362113B2 (ja) * 1997-07-15 2003-01-07 日本碍子株式会社 耐蝕性部材、ウエハー設置部材および耐蝕性部材の製造方法
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
US6162543A (en) * 1998-12-11 2000-12-19 Saint-Gobain Industrial Ceramics, Inc. High purity siliconized silicon carbide having high thermal shock resistance
WO2001059826A1 (fr) * 2000-02-10 2001-08-16 Shin-Etsu Handotai Co., Ltd. Nacelle de silicium a film de protection, procede de fabrication, et plaquette en silicium traitee thermiquement utilisant ladite nacelle
US6699401B1 (en) * 2000-02-15 2004-03-02 Toshiba Ceramics Co., Ltd. Method for manufacturing Si-SiC member for semiconductor heat treatment
US7055702B1 (en) * 2000-06-06 2006-06-06 Saint-Gobain Ceramics & Plastics, Inc. Slip resistant horizontal semiconductor wafer boat
US6488497B1 (en) * 2001-07-12 2002-12-03 Saint-Gobain Ceramics & Plastics, Inc. Wafer boat with arcuate wafer support arms
JP3535853B2 (ja) * 2001-09-18 2004-06-07 エム・エフエスアイ株式会社 基板の支持固定具、及びこれを用いた基板表面の乾燥方法

Also Published As

Publication number Publication date
JP2010103554A (ja) 2010-05-06
TW200425384A (en) 2004-11-16
JP2006521689A (ja) 2006-09-21
CN100390927C (zh) 2008-05-28
US20040188319A1 (en) 2004-09-30
CN1765005A (zh) 2006-04-26
EP1609171A2 (en) 2005-12-28
WO2004095545A3 (en) 2005-05-12
WO2004095545A2 (en) 2004-11-04
KR20060002875A (ko) 2006-01-09
KR100755196B1 (ko) 2007-09-05
TWI288454B (en) 2007-10-11
WO2004095545A8 (en) 2005-12-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120305