HK1086666A1 - Protection element - Google Patents

Protection element

Info

Publication number
HK1086666A1
HK1086666A1 HK06106382A HK06106382A HK1086666A1 HK 1086666 A1 HK1086666 A1 HK 1086666A1 HK 06106382 A HK06106382 A HK 06106382A HK 06106382 A HK06106382 A HK 06106382A HK 1086666 A1 HK1086666 A1 HK 1086666A1
Authority
HK
Hong Kong
Prior art keywords
protection element
protection
Prior art date
Application number
HK06106382A
Other languages
English (en)
Inventor
Furuuchi Yuji
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1086666A1 publication Critical patent/HK1086666A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)
HK06106382A 2002-12-27 2006-06-02 Protection element HK1086666A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002382569A JP2004214033A (ja) 2002-12-27 2002-12-27 保護素子
PCT/JP2003/015604 WO2004061886A1 (ja) 2002-12-27 2003-12-05 保護素子

Publications (1)

Publication Number Publication Date
HK1086666A1 true HK1086666A1 (en) 2006-09-22

Family

ID=32708605

Family Applications (2)

Application Number Title Priority Date Filing Date
HK06106382A HK1086666A1 (en) 2002-12-27 2006-06-02 Protection element
HK08104692.5A HK1114943A1 (en) 2002-12-27 2008-04-28 Protection element

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK08104692.5A HK1114943A1 (en) 2002-12-27 2008-04-28 Protection element

Country Status (7)

Country Link
US (1) US7286037B2 (xx)
JP (1) JP2004214033A (xx)
KR (1) KR100783997B1 (xx)
CN (2) CN100361250C (xx)
HK (2) HK1086666A1 (xx)
TW (1) TWI255481B (xx)
WO (1) WO2004061886A1 (xx)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
DE102007014334A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Schmelzlegierungselement, Thermosicherung mit einem Schmelzlegierungselement sowie Verfahren zum Herstellen einer Thermosicherung
JP2008311161A (ja) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp 保護素子
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
US7969275B2 (en) * 2007-11-14 2011-06-28 Enerdel, Inc. Fuse assembly with integrated current sensing
WO2009090995A1 (ja) * 2008-01-17 2009-07-23 Murata Manufacturing Co., Ltd. アンテナ
JP5130232B2 (ja) * 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
WO2010132856A2 (en) * 2009-05-14 2010-11-18 Brand.Net System and method for optimizing delivery of inventory for online display advertising
WO2010132855A2 (en) * 2009-05-14 2010-11-18 Brand.Net System and method for optimizing purchase of inventory for online display advertising
US9025295B2 (en) 2009-09-04 2015-05-05 Cyntec Co., Ltd. Protective device and protective module
JP5351860B2 (ja) 2009-09-04 2013-11-27 乾坤科技股▲ふん▼有限公司 保護装置
JP5192524B2 (ja) * 2009-09-04 2013-05-08 乾坤科技股▲ふん▼有限公司 保護装置
US8531263B2 (en) * 2009-11-24 2013-09-10 Littelfuse, Inc. Circuit protection device
JP5627291B2 (ja) * 2010-05-21 2014-11-19 京セラ株式会社 電流ヒューズ装置および回路基板
CN102263396B (zh) * 2010-05-24 2014-05-07 乾坤科技股份有限公司 保护元件及电子装置
ES2563170T3 (es) * 2010-07-16 2016-03-11 Schurter Ag Elemento de fusible
US8976001B2 (en) * 2010-11-08 2015-03-10 Cyntec Co., Ltd. Protective device
TWI488208B (zh) 2011-08-18 2015-06-11 Ind Tech Res Inst 保護元件及應用此保護元件之保護裝置
EP2797098A4 (en) * 2011-12-19 2015-12-09 Dexerials Corp PROTECTIVE ELEMENT, METHOD FOR MANUFACTURING PROTECTIVE ELEMENT, AND BATTERY MODULE IN WHICH THE PROTECTIVE ELEMENT IS INTEGRATED
CN103988277B (zh) * 2011-12-19 2016-10-26 迪睿合电子材料有限公司 保护元件、保护元件的制造方法及装入有保护元件的电池模块
JP6249600B2 (ja) 2012-03-29 2017-12-20 デクセリアルズ株式会社 保護素子
JP5987485B2 (ja) * 2012-06-12 2016-09-07 株式会社村田製作所 ヒューズ
KR101401141B1 (ko) * 2012-11-26 2014-05-30 스마트전자 주식회사 비정상상태의 전류 및 전압을 차단하는 복합보호소자
KR101388354B1 (ko) * 2012-11-26 2014-04-24 스마트전자 주식회사 비정상상태의 전류 및 전압을 차단하는 복합보호소자
KR20150106416A (ko) * 2013-01-11 2015-09-21 타이코 일렉트로닉스 저팬 지.케이. 보호 소자
TWI588857B (zh) * 2014-02-10 2017-06-21 陳莎莉 複合式保護元件與保護電路
KR101434135B1 (ko) * 2014-03-17 2014-08-26 스마트전자 주식회사 퓨즈 저항기
DE102015108758A1 (de) * 2014-06-13 2015-12-17 Smart Electronics Inc. Komplexe Schutzvorrichtung
KR101533996B1 (ko) * 2014-10-23 2015-07-06 주식회사 에스엠하이테크 온도 퓨즈 기능을 가진 smd형 마이크로 복합 퓨즈 및 그 제조방법
JP6621255B2 (ja) * 2015-07-10 2019-12-18 デクセリアルズ株式会社 保護素子、ヒューズ素子
TW201740605A (zh) * 2017-01-23 2017-11-16 Pao-Hsuan Chen 保護元件與二次電池包
TWI653651B (zh) * 2017-10-27 2019-03-11 致伸科技股份有限公司 鍵盤
DE102017125208B4 (de) * 2017-10-27 2021-08-12 Auto-Kabel Management Gmbh Elektrisches Sicherungselement sowie Verfahren zum Betreiben eines elektrischen Sicherungselementes
JP7231527B2 (ja) * 2018-12-28 2023-03-01 ショット日本株式会社 保護素子用ヒューズ素子およびそれを利用した保護素子
JP7349954B2 (ja) * 2020-04-13 2023-09-25 ショット日本株式会社 保護素子

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097247A (en) * 1991-06-03 1992-03-17 North American Philips Corporation Heat actuated fuse apparatus with solder link
DE4222278C1 (de) * 1992-07-07 1994-03-31 Roederstein Kondensatoren Verfahren zur Herstellung elektrischer Dickschichtsicherungen
JP2790433B2 (ja) 1993-08-31 1998-08-27 ソニー株式会社 保護素子及び回路基板
JP3067011B2 (ja) 1994-11-30 2000-07-17 ソニーケミカル株式会社 保護素子及びその製造方法
US5712610C1 (en) * 1994-08-19 2002-06-25 Sony Chemicals Corp Protective device
JP3322808B2 (ja) 1996-10-03 2002-09-09 矢崎総業株式会社 ヒューズ及びその取付方法
JP3768621B2 (ja) 1996-10-12 2006-04-19 内橋エステック株式会社 保護素子の使用方法
JP3782176B2 (ja) 1996-10-12 2006-06-07 内橋エステック株式会社 保護素子の使用方法及び保護装置
JPH10162714A (ja) * 1996-11-28 1998-06-19 Kyocera Corp チップヒューズ素子
DE19704097A1 (de) * 1997-02-04 1998-08-06 Wickmann Werke Gmbh Elektrisches Sicherungselement
US6373371B1 (en) * 1997-08-29 2002-04-16 Microelectronic Modules Corp. Preformed thermal fuse
US5939969A (en) * 1997-08-29 1999-08-17 Microelectronic Modules Corporation Preformed thermal fuse
JP3257521B2 (ja) * 1997-10-07 2002-02-18 ソニーケミカル株式会社 Ｐｔｃ素子、保護装置および回路基板
JP4112078B2 (ja) * 1998-05-27 2008-07-02 内橋エステック株式会社 基板型抵抗・温度ヒュ−ズ
JP4396787B2 (ja) * 1998-06-11 2010-01-13 内橋エステック株式会社 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法
JP2000306477A (ja) 1999-04-16 2000-11-02 Sony Chem Corp 保護素子
JP2001006518A (ja) * 1999-04-23 2001-01-12 Sony Chem Corp 過電流保護装置
JP2001325869A (ja) 2000-05-17 2001-11-22 Sony Chem Corp 保護素子
JP2001325868A (ja) * 2000-05-17 2001-11-22 Sony Chem Corp 保護素子
JP2003217416A (ja) * 2002-01-25 2003-07-31 Nec Schott Components Corp 温度ヒュ−ズおよびこれを装着した保護装置

Also Published As

Publication number Publication date
CN100361250C (zh) 2008-01-09
HK1114943A1 (en) 2008-11-14
WO2004061886A1 (ja) 2004-07-22
CN101090046B (zh) 2010-06-23
TW200414254A (en) 2004-08-01
US7286037B2 (en) 2007-10-23
US20060028314A1 (en) 2006-02-09
CN1732546A (zh) 2006-02-08
CN101090046A (zh) 2007-12-19
KR20050088326A (ko) 2005-09-05
TWI255481B (en) 2006-05-21
KR100783997B1 (ko) 2007-12-07
JP2004214033A (ja) 2004-07-29

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20231204