HK1084159A1 - Copper electrolytic solution and electrolytic copper foil produced therewith - Google Patents

Copper electrolytic solution and electrolytic copper foil produced therewith

Info

Publication number
HK1084159A1
HK1084159A1 HK06104253.8A HK06104253A HK1084159A1 HK 1084159 A1 HK1084159 A1 HK 1084159A1 HK 06104253 A HK06104253 A HK 06104253A HK 1084159 A1 HK1084159 A1 HK 1084159A1
Authority
HK
Hong Kong
Prior art keywords
electrolytic
copper
produced therewith
foil produced
copper foil
Prior art date
Application number
HK06104253.8A
Other languages
English (en)
Inventor
Masashi Magai
Mikio Hanafusa
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1084159A1 publication Critical patent/HK1084159A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electrolytic Production Of Metals (AREA)
HK06104253.8A 2002-12-18 2006-04-07 Copper electrolytic solution and electrolytic copper foil produced therewith HK1084159A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002366353 2002-12-18
PCT/JP2003/013044 WO2004055246A1 (ja) 2002-12-18 2003-10-10 銅電解液およびそれにより製造された電解銅箔

Publications (1)

Publication Number Publication Date
HK1084159A1 true HK1084159A1 (en) 2006-07-21

Family

ID=32588305

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06104253.8A HK1084159A1 (en) 2002-12-18 2006-04-07 Copper electrolytic solution and electrolytic copper foil produced therewith

Country Status (10)

Country Link
US (2) US7777078B2 (de)
EP (1) EP1574599B1 (de)
JP (1) JP4294593B2 (de)
KR (1) KR100682224B1 (de)
CN (1) CN100526515C (de)
DE (1) DE60333308D1 (de)
ES (1) ES2348207T3 (de)
HK (1) HK1084159A1 (de)
TW (1) TWI241358B (de)
WO (1) WO2004055246A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100823769B1 (ko) * 2005-01-25 2008-04-21 닛코킨조쿠 가부시키가이샤 특정 골격을 가진 화합물을 첨가제로서 포함하는구리전해액 및 이것에 의해 제조되는 전해구리박
US7824534B2 (en) 2005-01-25 2010-11-02 Nippon Mining & Metals Co., Ltd. Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
JP2007107074A (ja) * 2005-10-17 2007-04-26 Okuno Chem Ind Co Ltd 酸性電気銅めっき液及び電気銅めっき方法
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
CN101426959B (zh) 2006-04-28 2010-11-17 三井金属矿业株式会社 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
US20100084275A1 (en) * 2007-03-15 2010-04-08 Mikio Hanafusa Copper electrolytic solution and two-layer flexible substrate obtained using the same
JP5352542B2 (ja) 2010-07-15 2013-11-27 エル エス エムトロン リミテッド リチウム二次電池の集電体用銅箔
EP2641999A1 (de) 2010-11-15 2013-09-25 JX Nippon Mining & Metals Corporation Elektrolytische kupferfolie
JP5595320B2 (ja) * 2011-03-31 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
KR102377286B1 (ko) 2017-03-23 2022-03-21 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
KR102378297B1 (ko) 2017-03-29 2022-03-23 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
CN108998815B (zh) * 2018-10-09 2019-09-17 广东嘉元科技股份有限公司 一种铜箔的制备方法及该铜箔生产用改性添加剂
LU500134B1 (en) 2021-05-07 2022-11-08 Circuit Foil Luxembourg Method for producing an electrodeposited copper foil and copper foil obtained therewith

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE934508C (de) * 1954-04-23 1955-10-27 Dehydag Gmbh Verfahren zur Herstellung galvanischer Metallueberzuege
US4336114A (en) 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
GB2155919B (en) * 1984-03-20 1987-12-02 Dearborn Chemicals Ltd A method of inhibiting corrosion in aqueous systems
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
JPS6152387A (ja) 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法
US5607570A (en) 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US6183622B1 (en) * 1998-07-13 2001-02-06 Enthone-Omi, Inc. Ductility additives for electrorefining and electrowinning
JP2000297395A (ja) * 1999-04-15 2000-10-24 Japan Energy Corp 電気銅めっき液
JP3291482B2 (ja) * 1999-08-31 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法および用途
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
TW200403358A (en) * 2002-08-01 2004-03-01 Furukawa Circuit Foil Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector

Also Published As

Publication number Publication date
EP1574599A4 (de) 2006-08-02
TW200411080A (en) 2004-07-01
CN100526515C (zh) 2009-08-12
WO2004055246A1 (ja) 2004-07-01
ES2348207T3 (es) 2010-12-01
US20100270163A1 (en) 2010-10-28
JP4294593B2 (ja) 2009-07-15
US20060166032A1 (en) 2006-07-27
TWI241358B (en) 2005-10-11
DE60333308D1 (de) 2010-08-19
WO2004055246A8 (ja) 2004-08-19
EP1574599B1 (de) 2010-07-07
CN1726309A (zh) 2006-01-25
JPWO2004055246A1 (ja) 2006-04-20
EP1574599A1 (de) 2005-09-14
KR100682224B1 (ko) 2007-02-12
KR20050084369A (ko) 2005-08-26
US7777078B2 (en) 2010-08-17

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20231009