HK1082970A1 - Pattern exposure method and pattern exposure apparatus - Google Patents

Pattern exposure method and pattern exposure apparatus

Info

Publication number
HK1082970A1
HK1082970A1 HK06102763.5A HK06102763A HK1082970A1 HK 1082970 A1 HK1082970 A1 HK 1082970A1 HK 06102763 A HK06102763 A HK 06102763A HK 1082970 A1 HK1082970 A1 HK 1082970A1
Authority
HK
Hong Kong
Prior art keywords
pattern exposure
exposure apparatus
exposure method
pattern
exposure
Prior art date
Application number
HK06102763.5A
Other languages
English (en)
Inventor
Yoshitada Oshida
Yoshitatsu Naito
Mitsuhiro Suzuki
Bunji Uchiyama
Tsuyoshi Yamaguchi
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of HK1082970A1 publication Critical patent/HK1082970A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23N—REGULATING OR CONTROLLING COMBUSTION
    • F23N5/00—Systems for controlling combustion
    • F23N5/24—Preventing development of abnormal or undesired conditions, i.e. safety arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/123—Multibeam scanners, e.g. using multiple light sources or beam splitters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Optical Scanning Systems (AREA)
HK06102763.5A 2004-03-31 2006-03-02 Pattern exposure method and pattern exposure apparatus HK1082970A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004107662 2004-03-31
JP2004189017A JP4508743B2 (ja) 2004-03-31 2004-06-25 パターン露光方法およびパターン露光装置

Publications (1)

Publication Number Publication Date
HK1082970A1 true HK1082970A1 (en) 2006-06-23

Family

ID=34525538

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06102763.5A HK1082970A1 (en) 2004-03-31 2006-03-02 Pattern exposure method and pattern exposure apparatus

Country Status (9)

Country Link
US (2) US7372478B2 (xx)
JP (1) JP4508743B2 (xx)
KR (1) KR101191843B1 (xx)
CN (1) CN1677237B (xx)
DE (1) DE102005011339A1 (xx)
GB (2) GB2445282B (xx)
HK (1) HK1082970A1 (xx)
NL (1) NL1028549C2 (xx)
TW (1) TW200532392A (xx)

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JP2007275962A (ja) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置
JP4302716B2 (ja) 2006-05-30 2009-07-29 日立ビアメカニクス株式会社 光ビームの軸間ピッチ変換装置および基板露光装置
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JP5223292B2 (ja) * 2007-10-24 2013-06-26 パナソニック株式会社 画像記録装置
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CN106707692B (zh) * 2015-07-27 2018-03-27 中国科学院理化技术研究所 一种跨尺度结构协同工作的无掩模光刻系统
CN109478024B (zh) 2016-07-19 2021-03-26 Asml荷兰有限公司 用于直接写入无掩模光刻的设备
JP6829993B2 (ja) * 2016-12-28 2021-02-17 株式会社キーエンス 光走査高さ測定装置
TWI625604B (zh) * 2016-12-29 2018-06-01 旭東機械工業股份有限公司 穿透式雷射直接成像系統
CN108255021A (zh) * 2016-12-29 2018-07-06 旭东机械工业股份有限公司 无光罩激光直写曝光机
TWI666526B (zh) * 2017-10-31 2019-07-21 旭東機械工業股份有限公司 無光罩雷射直寫曝光機
TWI620038B (zh) 2017-01-11 2018-04-01 財團法人工業技術研究院 曝光方法和系統以及雷射直接成像系統
JP6972609B2 (ja) * 2017-03-28 2021-11-24 セイコーエプソン株式会社 光射出装置および画像表示システム
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Also Published As

Publication number Publication date
JP2005316349A (ja) 2005-11-10
US7372478B2 (en) 2008-05-13
CN1677237B (zh) 2011-03-30
US20050219496A1 (en) 2005-10-06
NL1028549A1 (nl) 2005-10-03
TW200532392A (en) 2005-10-01
NL1028549C2 (nl) 2007-12-11
JP4508743B2 (ja) 2010-07-21
GB2413393B (en) 2008-05-14
GB2445282A (en) 2008-07-02
US20080213705A1 (en) 2008-09-04
KR101191843B1 (ko) 2012-10-16
GB2445282B (en) 2008-11-05
CN1677237A (zh) 2005-10-05
KR20060043024A (ko) 2006-05-15
GB0504957D0 (en) 2005-04-20
DE102005011339A1 (de) 2005-10-20
GB0725243D0 (en) 2008-02-06
GB2413393A (en) 2005-10-26

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Effective date: 20150224