HK1072083A1 - Method and electrode for defining and replicating structures in conducting materials - Google Patents
Method and electrode for defining and replicating structures in conducting materialsInfo
- Publication number
- HK1072083A1 HK1072083A1 HK05104929A HK05104929A HK1072083A1 HK 1072083 A1 HK1072083 A1 HK 1072083A1 HK 05104929 A HK05104929 A HK 05104929A HK 05104929 A HK05104929 A HK 05104929A HK 1072083 A1 HK1072083 A1 HK 1072083A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- defining
- electrode
- conducting materials
- replicating structures
- replicating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Micromachines (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0102144A SE523309E (sv) | 2001-06-15 | 2001-06-15 | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
PCT/SE2002/001179 WO2002103085A1 (en) | 2001-06-15 | 2002-06-17 | Method and electrode for defining and replicating structures in conducting materials |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1072083A1 true HK1072083A1 (en) | 2005-08-12 |
Family
ID=20284507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05104929A HK1072083A1 (en) | 2001-06-15 | 2005-06-13 | Method and electrode for defining and replicating structures in conducting materials |
Country Status (13)
Country | Link |
---|---|
US (4) | US7790009B2 (sv) |
EP (2) | EP1404899B1 (sv) |
JP (2) | JP4546078B2 (sv) |
KR (1) | KR101250685B1 (sv) |
CN (1) | CN1294296C (sv) |
CA (1) | CA2462098C (sv) |
DK (1) | DK1404899T3 (sv) |
ES (2) | ES2645700T3 (sv) |
HK (1) | HK1072083A1 (sv) |
PT (1) | PT1404899E (sv) |
RU (1) | RU2296820C2 (sv) |
SE (1) | SE523309E (sv) |
WO (1) | WO2002103085A1 (sv) |
Families Citing this family (69)
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US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
AU6531600A (en) | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
EP1487739A1 (en) | 2002-03-25 | 2004-12-22 | Matvice Ehf. | A method and apparatus for processing nanoscopic structures |
US8294025B2 (en) | 2002-06-08 | 2012-10-23 | Solarity, Llc | Lateral collection photovoltaics |
JP4892684B2 (ja) * | 2004-01-12 | 2012-03-07 | ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・カリフォルニア | ナノスケール電気リソグラフィー法 |
GB0416600D0 (en) | 2004-07-24 | 2004-08-25 | Univ Newcastle | A process for manufacturing micro- and nano-devices |
GB0416952D0 (en) * | 2004-07-30 | 2004-09-01 | Renishaw Plc | Scale making method |
FR2885913B1 (fr) * | 2005-05-18 | 2007-08-10 | Centre Nat Rech Scient | Element composite comprenant un substrat conducteur et un revetement metallique nanostructure. |
KR101147087B1 (ko) * | 2005-06-28 | 2012-05-17 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 |
JP2009516388A (ja) | 2005-11-18 | 2009-04-16 | レプリソールス テクノロジーズ アーベー | 多層構造の形成方法 |
KR20080084812A (ko) | 2005-11-22 | 2008-09-19 | 쇼킹 테크놀로지스 인코포레이티드 | 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스 |
FR2898138B1 (fr) * | 2006-03-03 | 2008-05-16 | Commissariat Energie Atomique | Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre. |
EP1835339B1 (fr) * | 2006-03-15 | 2012-05-16 | Rolex S.A. | Procédé de fabrication par technologie de type liga d'une structure métallique monocouche ou multicouche, et structure obtenue |
DE102006013362A1 (de) * | 2006-03-16 | 2007-09-27 | Siemens Ag | Verfahren zum Herstellen einer elektrischen Komponente mit einer Nanonadelstruktur |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
US7968014B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
WO2008036423A2 (en) | 2006-09-24 | 2008-03-27 | Shocking Technologies, Inc. | Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same |
JP4694519B2 (ja) * | 2007-02-28 | 2011-06-08 | 富士通株式会社 | マイクロ構造体およびマイクロ構造体製造方法 |
CN100545648C (zh) * | 2007-05-15 | 2009-09-30 | 中国科学院长春应用化学研究所 | 一种微盘电极或微盘阵列电极的制备方法 |
US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US9157141B2 (en) | 2007-08-24 | 2015-10-13 | Schlumberger Technology Corporation | Conditioning ferrous alloys into cracking susceptible and fragmentable elements for use in a well |
CH704572B1 (fr) * | 2007-12-31 | 2012-09-14 | Nivarox Sa | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé. |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
KR100894710B1 (ko) * | 2008-06-27 | 2009-04-24 | (주) 월드비젼 | 윈도우 일체형 터치스크린 및 이의 제조방법 |
EP2166125A1 (en) * | 2008-09-19 | 2010-03-24 | ALSTOM Technology Ltd | Method for the restoration of a metallic coating |
US9208930B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductive core shelled particles |
US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
US8362871B2 (en) | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
US20110278162A1 (en) * | 2008-11-14 | 2011-11-17 | Mikael Fredenberg | system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
CN102550132A (zh) | 2009-03-26 | 2012-07-04 | 肖克科技有限公司 | 具有电压可切换电介质材料的元件 |
EP2263972A1 (fr) * | 2009-06-12 | 2010-12-22 | Nivarox-FAR S.A. | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé |
US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
JP4768848B2 (ja) * | 2009-12-07 | 2011-09-07 | 株式会社東芝 | 電鋳用原盤及びその製造方法 |
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US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
ES2654943T3 (es) | 2010-07-15 | 2018-02-15 | Luxembourg Institute Of Science And Technology (List) | Sistema de manipulación automatizada de elementos maestros y sustrato |
EP2593585B1 (en) | 2010-07-15 | 2017-08-30 | Luxembourg Institute of Science and Technology (LIST) | Leveling of master electrode and substrate in ecpr, and a chuck therefor |
EP2593592B1 (en) | 2010-07-15 | 2018-05-16 | Luxembourg Institute of Science and Technology (LIST) | Separation of master electrode and substrate in ecpr |
WO2012007524A1 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | Filling of a printing chamber and a chuck therefore |
EP3269846B1 (en) | 2010-07-15 | 2019-11-06 | Luxembourg Institute of Science and Technology (LIST) | A chuck, and a method for bringing a first and a second substrate together |
WO2012007521A1 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | A contact sheet for arrangement between a chuck and a master electrode in an ecpr process |
WO2012007526A2 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | Device, system and method for use in machines for electrochemical pattern replication |
EP2593591B1 (en) | 2010-07-15 | 2016-06-08 | Luxembourg Institute of Science and Technology (LIST) | Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore |
RU2463121C2 (ru) * | 2010-08-31 | 2012-10-10 | Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) | Способ изготовления электрически изолированной металлической ленты и линия для его осуществления |
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DK2655698T3 (da) | 2010-12-23 | 2019-08-12 | Luxembourg Institute Of Science And Tech | Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne |
WO2012084046A1 (en) | 2010-12-23 | 2012-06-28 | Replisaurus Group Sas | An ecpr master electrode, and a method for providing such master electrode |
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EP2655701B1 (en) | 2010-12-23 | 2018-08-29 | Luxembourg Institute of Science and Technology (LIST) | A method for providing an ecpr master electrode and an ecpr master electrode |
RU2497747C2 (ru) * | 2011-04-05 | 2013-11-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) | Способ получения металлических реплик конической формы на основе полимерных шаблонов |
EP2696934B1 (en) * | 2011-04-15 | 2017-08-09 | CorTec GmbH | Neural electrode and method for fabricating the same |
EP2533272B1 (en) | 2011-06-07 | 2014-03-12 | Centre de Recherche Public - Gabriel Lippmann | An ecpr master electrode, and a method for providing such master electrode |
EP2533273B1 (en) | 2011-06-07 | 2017-02-08 | Luxembourg Institute of Science and Technology (LIST) | An ECPR master electrode, and a method for providing such master electrode |
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RU2529592C2 (ru) * | 2012-11-19 | 2014-09-27 | Общество с Ограниченной Ответственностью "Фабрика новых материалов" | Способ электрохимической рентгеновской бесконтактной литографии |
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FR3072690B1 (fr) * | 2017-10-24 | 2021-07-30 | Centre Techn Ind Mecanique | Procede de traitement de surface d'une piece mecanique realisee dans un materiau conducteur |
LU100919B1 (en) | 2018-08-27 | 2020-02-27 | Luxembourg Inst Science & Tech List | Metal-CNT composite, production method and materials therefor |
KR102210785B1 (ko) * | 2019-02-07 | 2021-02-02 | 경북대학교 산학합력단 | 더블 패터닝을 이용한 나노 메쉬 기반의 일체형 금속 전도체 제조방법 및 이에 의해 제조된 일체형 금속 전도체 |
US20210388521A1 (en) * | 2020-06-15 | 2021-12-16 | Arizona Board Of Regents On Behalf Of Arizona State University | Localized electrochemical deposition |
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-
2001
- 2001-06-15 SE SE0102144A patent/SE523309E/sv not_active IP Right Cessation
-
2002
- 2002-06-17 CA CA2462098A patent/CA2462098C/en not_active Expired - Lifetime
- 2002-06-17 DK DK02739042.6T patent/DK1404899T3/da active
- 2002-06-17 CN CNB028119266A patent/CN1294296C/zh not_active Expired - Fee Related
- 2002-06-17 PT PT2739042T patent/PT1404899E/pt unknown
- 2002-06-17 RU RU2003136088/02A patent/RU2296820C2/ru not_active IP Right Cessation
- 2002-06-17 ES ES10182946.3T patent/ES2645700T3/es not_active Expired - Lifetime
- 2002-06-17 KR KR1020037016336A patent/KR101250685B1/ko active IP Right Grant
- 2002-06-17 EP EP02739042A patent/EP1404899B1/en not_active Expired - Lifetime
- 2002-06-17 WO PCT/SE2002/001179 patent/WO2002103085A1/en active Application Filing
- 2002-06-17 EP EP10182946.3A patent/EP2322694B1/en not_active Expired - Lifetime
- 2002-06-17 JP JP2003505393A patent/JP4546078B2/ja not_active Expired - Fee Related
- 2002-06-17 ES ES02739042T patent/ES2397919T3/es not_active Expired - Lifetime
-
2003
- 2003-12-15 US US10/734,223 patent/US7790009B2/en not_active Expired - Fee Related
-
2005
- 2005-06-13 HK HK05104929A patent/HK1072083A1/xx not_active IP Right Cessation
-
2007
- 2007-03-09 US US11/716,166 patent/US20070151858A1/en not_active Abandoned
-
2009
- 2009-06-15 JP JP2009142804A patent/JP2009235578A/ja active Pending
-
2010
- 2010-05-27 US US12/801,219 patent/US20110000784A1/en not_active Abandoned
-
2012
- 2012-03-12 US US13/417,808 patent/US8741113B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20040028781A (ko) | 2004-04-03 |
US7790009B2 (en) | 2010-09-07 |
PT1404899E (pt) | 2013-01-28 |
US20120228128A1 (en) | 2012-09-13 |
CA2462098A1 (en) | 2002-12-27 |
EP1404899B1 (en) | 2012-10-31 |
DK1404899T3 (da) | 2013-02-04 |
RU2003136088A (ru) | 2005-05-10 |
SE523309C2 (sv) | 2004-04-13 |
CN1555428A (zh) | 2004-12-15 |
SE0102144D0 (sv) | 2001-06-15 |
JP4546078B2 (ja) | 2010-09-15 |
JP2004530050A (ja) | 2004-09-30 |
RU2296820C2 (ru) | 2007-04-10 |
SE0102144L (sv) | 2002-12-19 |
CN1294296C (zh) | 2007-01-10 |
EP2322694A1 (en) | 2011-05-18 |
WO2002103085A1 (en) | 2002-12-27 |
JP2009235578A (ja) | 2009-10-15 |
EP2322694B1 (en) | 2017-08-02 |
US20110000784A1 (en) | 2011-01-06 |
US20040154828A1 (en) | 2004-08-12 |
SE523309E (sv) | 2010-03-02 |
US8741113B2 (en) | 2014-06-03 |
KR101250685B1 (ko) | 2013-04-03 |
CA2462098C (en) | 2014-01-14 |
ES2645700T3 (es) | 2017-12-07 |
ES2397919T3 (es) | 2013-03-12 |
US20070151858A1 (en) | 2007-07-05 |
EP1404899A1 (en) | 2004-04-07 |
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Legal Events
Date | Code | Title | Description |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120617 |