HK1072083A1 - Method and electrode for defining and replicating structures in conducting materials - Google Patents
Method and electrode for defining and replicating structures in conducting materialsInfo
- Publication number
- HK1072083A1 HK1072083A1 HK05104929A HK05104929A HK1072083A1 HK 1072083 A1 HK1072083 A1 HK 1072083A1 HK 05104929 A HK05104929 A HK 05104929A HK 05104929 A HK05104929 A HK 05104929A HK 1072083 A1 HK1072083 A1 HK 1072083A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- defining
- electrode
- conducting materials
- replicating structures
- replicating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Micromachines (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Printing Methods (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0102144A SE523309E (sv) | 2001-06-15 | 2001-06-15 | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
PCT/SE2002/001179 WO2002103085A1 (en) | 2001-06-15 | 2002-06-17 | Method and electrode for defining and replicating structures in conducting materials |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1072083A1 true HK1072083A1 (en) | 2005-08-12 |
Family
ID=20284507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05104929A HK1072083A1 (en) | 2001-06-15 | 2005-06-13 | Method and electrode for defining and replicating structures in conducting materials |
Country Status (13)
Country | Link |
---|---|
US (4) | US7790009B2 (ja) |
EP (2) | EP2322694B1 (ja) |
JP (2) | JP4546078B2 (ja) |
KR (1) | KR101250685B1 (ja) |
CN (1) | CN1294296C (ja) |
CA (1) | CA2462098C (ja) |
DK (1) | DK1404899T3 (ja) |
ES (2) | ES2645700T3 (ja) |
HK (1) | HK1072083A1 (ja) |
PT (1) | PT1404899E (ja) |
RU (1) | RU2296820C2 (ja) |
SE (1) | SE523309E (ja) |
WO (1) | WO2002103085A1 (ja) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU6531600A (en) | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
WO2003080502A1 (en) * | 2002-03-25 | 2003-10-02 | Matvice Ehf. | A method and apparatus for processing nanoscopic structures |
US8294025B2 (en) | 2002-06-08 | 2012-10-23 | Solarity, Llc | Lateral collection photovoltaics |
JP4892684B2 (ja) * | 2004-01-12 | 2012-03-07 | ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・カリフォルニア | ナノスケール電気リソグラフィー法 |
GB0416600D0 (en) | 2004-07-24 | 2004-08-25 | Univ Newcastle | A process for manufacturing micro- and nano-devices |
GB0416952D0 (en) * | 2004-07-30 | 2004-09-01 | Renishaw Plc | Scale making method |
FR2885913B1 (fr) * | 2005-05-18 | 2007-08-10 | Centre Nat Rech Scient | Element composite comprenant un substrat conducteur et un revetement metallique nanostructure. |
KR101147087B1 (ko) * | 2005-06-28 | 2012-05-17 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 |
US20090229856A1 (en) * | 2005-11-18 | 2009-09-17 | Replisaurus Technologies Ab | Master Electrode and Method of Forming the Master Electrode |
WO2007062122A2 (en) | 2005-11-22 | 2007-05-31 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
FR2898138B1 (fr) * | 2006-03-03 | 2008-05-16 | Commissariat Energie Atomique | Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre. |
EP1835339B1 (fr) * | 2006-03-15 | 2012-05-16 | Rolex S.A. | Procédé de fabrication par technologie de type liga d'une structure métallique monocouche ou multicouche, et structure obtenue |
DE102006013362A1 (de) * | 2006-03-16 | 2007-09-27 | Siemens Ag | Verfahren zum Herstellen einer elektrischen Komponente mit einer Nanonadelstruktur |
US7968014B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
EP2084748A4 (en) | 2006-09-24 | 2011-09-28 | Shocking Technologies Inc | FORMULATIONS FOR A VOLTAGE-SWITCHABLE DIELECTRIC MATERIAL WITH A DEVICED VOLTAGE CONTACT BEHAVIOR AND METHOD OF MANUFACTURING THEREOF |
JP4694519B2 (ja) * | 2007-02-28 | 2011-06-08 | 富士通株式会社 | マイクロ構造体およびマイクロ構造体製造方法 |
CN100545648C (zh) * | 2007-05-15 | 2009-09-30 | 中国科学院长春应用化学研究所 | 一种微盘电极或微盘阵列电极的制备方法 |
US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US9157141B2 (en) * | 2007-08-24 | 2015-10-13 | Schlumberger Technology Corporation | Conditioning ferrous alloys into cracking susceptible and fragmentable elements for use in a well |
CH704572B1 (fr) * | 2007-12-31 | 2012-09-14 | Nivarox Sa | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé. |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
KR100894710B1 (ko) * | 2008-06-27 | 2009-04-24 | (주) 월드비젼 | 윈도우 일체형 터치스크린 및 이의 제조방법 |
EP2166125A1 (en) * | 2008-09-19 | 2010-03-24 | ALSTOM Technology Ltd | Method for the restoration of a metallic coating |
EP2342722A2 (en) | 2008-09-30 | 2011-07-13 | Shocking Technologies Inc | Voltage switchable dielectric material containing conductive core shelled particles |
US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
US8362871B2 (en) | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
DK2350357T3 (da) * | 2008-11-14 | 2019-11-25 | Luxembourg Institute Of Science And Tech | Substratholder til at holde et ledende substrat under plettering deraf |
US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
WO2010110909A1 (en) | 2009-03-26 | 2010-09-30 | Shocking Technologies, Inc. | Components having voltage switchable dielectric materials |
EP2263972A1 (fr) * | 2009-06-12 | 2010-12-22 | Nivarox-FAR S.A. | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé |
US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
JP4768848B2 (ja) * | 2009-12-07 | 2011-09-07 | 株式会社東芝 | 電鋳用原盤及びその製造方法 |
US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
EP2593588B1 (en) | 2010-07-15 | 2016-06-22 | Centre de Recherche Public - Gabriel Lippmann | A contact sheet for arrangement between a chuck and a master electrode in an ecpr process |
ES2634088T3 (es) | 2010-07-15 | 2017-09-26 | Luxembourg Institute Of Science And Technology (List) | Dispositivo sistema y procedimiento para su utilización en máquinas para la replicación electroquímica de patrones |
EP2593591B1 (en) | 2010-07-15 | 2016-06-08 | Luxembourg Institute of Science and Technology (LIST) | Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore |
EP2593592B1 (en) | 2010-07-15 | 2018-05-16 | Luxembourg Institute of Science and Technology (LIST) | Separation of master electrode and substrate in ecpr |
ES2650449T3 (es) | 2010-07-15 | 2018-01-18 | Luxembourg Institute Of Science And Technology (List) | Nivelación de un electrodo maestro y un sustrato en ECPR y un mandril adaptado para el mismo |
WO2012007520A1 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | A chuck, and a method for bringing a first and a second substrate together |
EP2593587B1 (en) | 2010-07-15 | 2016-09-07 | Luxembourg Institute of Science and Technology (LIST) | Filling of a printing chamber and a chuck therefore |
WO2012007191A1 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | System for automated handling of masters and substrate |
RU2463121C2 (ru) * | 2010-08-31 | 2012-10-10 | Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) | Способ изготовления электрически изолированной металлической ленты и линия для его осуществления |
AT510593B1 (de) * | 2010-12-15 | 2012-05-15 | Markus Dipl Ing Dr Hacksteiner | Vorrichtung zum metallisieren von wafern |
WO2012084047A1 (en) | 2010-12-23 | 2012-06-28 | Replisaurus Group Sas | An ecpr master electrode and a method for providing such ecpr master electrode |
WO2012084046A1 (en) | 2010-12-23 | 2012-06-28 | Replisaurus Group Sas | An ecpr master electrode, and a method for providing such master electrode |
EP2655701B1 (en) | 2010-12-23 | 2018-08-29 | Luxembourg Institute of Science and Technology (LIST) | A method for providing an ecpr master electrode and an ecpr master electrode |
EP2655698B1 (en) | 2010-12-23 | 2019-05-15 | Luxembourg Institute of Science and Technology | Master electrode for ecpr and manufacturing methods thereof |
RU2497747C2 (ru) * | 2011-04-05 | 2013-11-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) | Способ получения металлических реплик конической формы на основе полимерных шаблонов |
WO2012140262A1 (en) * | 2011-04-15 | 2012-10-18 | Cortec Gmbh | Neural electrode and method for fabricating the same |
EP2533271B1 (en) | 2011-06-07 | 2014-05-21 | Centre de Recherche Public - Gabriel Lippmann | An ecpr master electrode, and a method for providing such master electrode |
EP2533272B1 (en) | 2011-06-07 | 2014-03-12 | Centre de Recherche Public - Gabriel Lippmann | An ecpr master electrode, and a method for providing such master electrode |
ES2624739T3 (es) | 2011-06-07 | 2017-07-17 | Luxembourg Institute Of Science And Technology (List) | Electrodo maestro ECPR y un procedimiento para proporcionar dicho electrodo maestro |
RU2529592C2 (ru) * | 2012-11-19 | 2014-09-27 | Общество с Ограниченной Ответственностью "Фабрика новых материалов" | Способ электрохимической рентгеновской бесконтактной литографии |
JP6107799B2 (ja) * | 2014-12-03 | 2017-04-05 | トヨタ自動車株式会社 | 表面処理方法および表面処理装置 |
USD767146S1 (en) | 2015-02-09 | 2016-09-20 | Christopher John Farrell | Orthodontic appliance |
CA168308S (en) | 2015-11-09 | 2017-03-22 | Myosa Pty Ltd | Oral appliance |
EP3377679A4 (en) | 2015-11-19 | 2019-05-01 | Fabric8Labs, Inc. | THREE-DIMENSIONAL GENERATIVE MANUFACTURE OF METAL OBJECTS BY STEREOGALVANIZATION |
AU201710942S (en) | 2017-02-16 | 2017-10-06 | Orthodontic appliance | |
FR3072690B1 (fr) * | 2017-10-24 | 2021-07-30 | Centre Techn Ind Mecanique | Procede de traitement de surface d'une piece mecanique realisee dans un materiau conducteur |
LU100919B1 (en) | 2018-08-27 | 2020-02-27 | Luxembourg Inst Science & Tech List | Metal-CNT composite, production method and materials therefor |
KR102210785B1 (ko) * | 2019-02-07 | 2021-02-02 | 경북대학교 산학합력단 | 더블 패터닝을 이용한 나노 메쉬 기반의 일체형 금속 전도체 제조방법 및 이에 의해 제조된 일체형 금속 전도체 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2306082A (en) * | 1940-04-27 | 1942-12-22 | Clarence O Prest | Method for line or design reproduction by electrolysis |
US3190822A (en) * | 1961-01-09 | 1965-06-22 | Burnham John | Process for electrolytically etching valve metal surfaces |
US3240685A (en) * | 1962-02-23 | 1966-03-15 | Ibm | Method and device for selective anodization |
GB1098182A (en) | 1963-12-27 | 1968-01-10 | Ibm | Electrolyte or electroless plating process |
CA791112A (en) * | 1964-06-30 | 1968-07-30 | J. Kahan George | Catalytically active palladium coatings |
US3582477A (en) * | 1969-02-20 | 1971-06-01 | Paul Gelb | Selective electroplating method |
JPS5456619U (ja) * | 1977-09-28 | 1979-04-19 | ||
JPS5456619A (en) | 1977-10-13 | 1979-05-07 | Tokyo Yogyo Kk | Spray repairing material for blast furnace tapping spout |
GB1600667A (en) | 1978-05-26 | 1981-10-21 | Pryor Edward & Son | Electrolytic marking of metal articles |
US4279709A (en) * | 1979-05-08 | 1981-07-21 | The Dow Chemical Company | Preparation of porous electrodes |
US4734174A (en) * | 1986-12-17 | 1988-03-29 | Polaroid Corporation | Electrochemical formation of thin-film electrodes |
JPH01234590A (ja) * | 1988-03-16 | 1989-09-19 | Toshiba Eng Co Ltd | 部分メッキ装置 |
US4932518A (en) * | 1988-08-23 | 1990-06-12 | Shipley Company Inc. | Method and apparatus for determining throwing power of an electroplating solution |
US5294504A (en) * | 1988-08-30 | 1994-03-15 | Osaka Gas Company, Ltd. | Three-dimensional microstructure as a substrate for a battery electrode |
JPH04236800A (ja) * | 1991-01-16 | 1992-08-25 | Fujitsu Ltd | 電解エッチング方法 |
US5196109A (en) * | 1991-08-01 | 1993-03-23 | Geoffrey Scott | Trivalent chromium electrolytes and plating processes employing same |
JPH0593300A (ja) * | 1991-09-30 | 1993-04-16 | Riyouichi Aogaki | 電解エツチング方法 |
US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
JPH06299390A (ja) * | 1993-04-13 | 1994-10-25 | Seiko Instr Inc | 微細加工方法及び装置 |
DE4344387C2 (de) * | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
CA2192369A1 (en) | 1994-06-09 | 1995-12-14 | Michael Zhang | Electrical devices |
DK172937B1 (da) * | 1995-06-21 | 1999-10-11 | Peter Torben Tang | Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer |
KR0147996B1 (ko) * | 1995-06-30 | 1998-10-15 | 배순훈 | 박막 헤드의 패턴 평탄화 방법 |
CN1235271C (zh) * | 1995-10-17 | 2006-01-04 | 佳能株式会社 | 生产半导体器件的工艺 |
JPH103233A (ja) * | 1996-04-15 | 1998-01-06 | Fuji Xerox Co Ltd | 画像形成方法、画像形成媒体、被転写媒体及び画像形成装置 |
AU2591397A (en) | 1996-07-02 | 1998-01-21 | Wilson Greatbatch Ltd. | Preparation and use of thin flexible cathodes in alkali metal electrochemical cells |
JP3269827B2 (ja) * | 1997-04-04 | 2002-04-02 | ユニバーシティ・オブ・サザン・カリフォルニア | 電気化学製造のための物品、方法、および装置 |
FR2773652B1 (fr) * | 1998-01-14 | 2002-10-11 | Sgs Thomson Microelectronics | Circuit de generation d'un signal d'activation commande |
WO1999045179A1 (en) | 1998-03-05 | 1999-09-10 | Obducat Ab | Method of etching |
US5947027A (en) | 1998-09-08 | 1999-09-07 | Motorola, Inc. | Printing apparatus with inflatable means for advancing a substrate towards the stamping surface |
DE19935558B4 (de) * | 1999-07-30 | 2010-11-25 | Nawotec Gmbh | Verfahren zur Erzeugung von Strukturen in einem Substrat im Nanometerbereich |
JP3441058B2 (ja) * | 1999-12-03 | 2003-08-25 | 理化学研究所 | キャピラリーゲル電気泳動用マイクロチップおよびその製造方法 |
SE515607C2 (sv) | 1999-12-10 | 2001-09-10 | Obducat Ab | Anordning och metod vid tillverkning av strukturer |
KR100500684B1 (ko) * | 1999-12-29 | 2005-07-12 | 비오이 하이디스 테크놀로지 주식회사 | 4-마스크 공정을 이용한 액정 디스플레이의 제조 방법 |
KR20010105994A (ko) * | 2000-05-20 | 2001-11-29 | 구자홍 | 디스크 드라이버의 트레이 |
-
2001
- 2001-06-15 SE SE0102144A patent/SE523309E/xx not_active IP Right Cessation
-
2002
- 2002-06-17 JP JP2003505393A patent/JP4546078B2/ja not_active Expired - Fee Related
- 2002-06-17 DK DK02739042.6T patent/DK1404899T3/da active
- 2002-06-17 KR KR1020037016336A patent/KR101250685B1/ko active IP Right Grant
- 2002-06-17 ES ES10182946.3T patent/ES2645700T3/es not_active Expired - Lifetime
- 2002-06-17 RU RU2003136088/02A patent/RU2296820C2/ru not_active IP Right Cessation
- 2002-06-17 EP EP10182946.3A patent/EP2322694B1/en not_active Expired - Lifetime
- 2002-06-17 CA CA2462098A patent/CA2462098C/en not_active Expired - Lifetime
- 2002-06-17 EP EP02739042A patent/EP1404899B1/en not_active Expired - Lifetime
- 2002-06-17 WO PCT/SE2002/001179 patent/WO2002103085A1/en active Application Filing
- 2002-06-17 CN CNB028119266A patent/CN1294296C/zh not_active Expired - Fee Related
- 2002-06-17 ES ES02739042T patent/ES2397919T3/es not_active Expired - Lifetime
- 2002-06-17 PT PT2739042T patent/PT1404899E/pt unknown
-
2003
- 2003-12-15 US US10/734,223 patent/US7790009B2/en not_active Expired - Fee Related
-
2005
- 2005-06-13 HK HK05104929A patent/HK1072083A1/xx not_active IP Right Cessation
-
2007
- 2007-03-09 US US11/716,166 patent/US20070151858A1/en not_active Abandoned
-
2009
- 2009-06-15 JP JP2009142804A patent/JP2009235578A/ja active Pending
-
2010
- 2010-05-27 US US12/801,219 patent/US20110000784A1/en not_active Abandoned
-
2012
- 2012-03-12 US US13/417,808 patent/US8741113B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
SE523309E (sv) | 2010-03-02 |
CN1555428A (zh) | 2004-12-15 |
RU2003136088A (ru) | 2005-05-10 |
CA2462098A1 (en) | 2002-12-27 |
JP4546078B2 (ja) | 2010-09-15 |
EP1404899B1 (en) | 2012-10-31 |
WO2002103085A1 (en) | 2002-12-27 |
CA2462098C (en) | 2014-01-14 |
US20040154828A1 (en) | 2004-08-12 |
KR20040028781A (ko) | 2004-04-03 |
KR101250685B1 (ko) | 2013-04-03 |
DK1404899T3 (da) | 2013-02-04 |
SE523309C2 (sv) | 2004-04-13 |
EP1404899A1 (en) | 2004-04-07 |
EP2322694B1 (en) | 2017-08-02 |
JP2004530050A (ja) | 2004-09-30 |
ES2397919T3 (es) | 2013-03-12 |
EP2322694A1 (en) | 2011-05-18 |
SE0102144L (sv) | 2002-12-19 |
US8741113B2 (en) | 2014-06-03 |
PT1404899E (pt) | 2013-01-28 |
RU2296820C2 (ru) | 2007-04-10 |
ES2645700T3 (es) | 2017-12-07 |
US20110000784A1 (en) | 2011-01-06 |
US20120228128A1 (en) | 2012-09-13 |
SE0102144D0 (sv) | 2001-06-15 |
US7790009B2 (en) | 2010-09-07 |
CN1294296C (zh) | 2007-01-10 |
JP2009235578A (ja) | 2009-10-15 |
US20070151858A1 (en) | 2007-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1072083A1 (en) | Method and electrode for defining and replicating structures in conducting materials | |
EP1259596A4 (en) | METHOD AND DEVICE FOR DESTROYING DIVIDING CELLS | |
ZA200501479B (en) | Method and apparatus for operating mobile nodes in multiple states | |
EP1497483A4 (en) | PLATINUM ELECTRODE AND METHOD OF MANUFACTURE | |
IL183716A0 (en) | Low dielectric materials and methods for making same | |
EP1487535A4 (en) | ELECTRODE STRUCTURES AND METHOD FOR THEIR USE IN CARDIOVASCULAR REFLEX CONTROL | |
AU2003269041A8 (en) | Method and device for screening molecules in cells | |
HK1040323A1 (en) | Terminal electrode forming method in chip-style electronic component and apparatus therefor | |
EP1546361A4 (en) | AUTOSTIMULATING CELLS AND PROCESS FOR THEIR PRODUCTION AND USE | |
GB0121747D0 (en) | Improvements in and relating to data encryption\decryption apparatus | |
EP1120846A4 (en) | CELL AND INSPECTION METHOD | |
AU2003262986A1 (en) | Method for forming conductive material in opening and structure regarding same | |
EP1333910A4 (en) | ELECTROPHORESIS DEVICE AND METHOD | |
EP1560948A4 (en) | ELECTROLYSIS METHOD AND CELL USED THEREIN | |
SG96218A1 (en) | Sic-formed materials and method for manufacturing same | |
AU2003256647A8 (en) | Stencil and method of using the same | |
PL357421A1 (en) | Method for manufacturing an electrode and an electrode | |
GB0115118D0 (en) | Welding method and apparatus | |
AU2003218261A8 (en) | Improvements in pharmaceutical discovery and development | |
AU2000239097A8 (en) | Manufacturing apparatus and method | |
GB2359275B (en) | Laminating method and apparatus | |
AU2002311726A1 (en) | Method and electrode for defining and replicating structures in conducting materials | |
AU2003282477A8 (en) | Methods and compositions for reducing screening in oligonucleotide-directed nucleic acid sequence alteration | |
HK1159879A1 (en) | Field unit and method implemented in a field unit | |
TW533964U (en) | Pincer suitable for use in narrow space and multiple angles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120617 |