DK2350357T3 - Substratholder til at holde et ledende substrat under plettering deraf - Google Patents

Substratholder til at holde et ledende substrat under plettering deraf Download PDF

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Publication number
DK2350357T3
DK2350357T3 DK08875022T DK08875022T DK2350357T3 DK 2350357 T3 DK2350357 T3 DK 2350357T3 DK 08875022 T DK08875022 T DK 08875022T DK 08875022 T DK08875022 T DK 08875022T DK 2350357 T3 DK2350357 T3 DK 2350357T3
Authority
DK
Denmark
Prior art keywords
substrate
keep
leading
during plating
holds
Prior art date
Application number
DK08875022T
Other languages
English (en)
Inventor
Mikael Fredenberg
Patrik Möller
Original Assignee
Luxembourg Institute Of Science And Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luxembourg Institute Of Science And Tech filed Critical Luxembourg Institute Of Science And Tech
Application granted granted Critical
Publication of DK2350357T3 publication Critical patent/DK2350357T3/da

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DK08875022T 2008-11-14 2008-11-14 Substratholder til at holde et ledende substrat under plettering deraf DK2350357T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2008/009658 WO2010054677A1 (en) 2008-11-14 2008-11-14 A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof

Publications (1)

Publication Number Publication Date
DK2350357T3 true DK2350357T3 (da) 2019-11-25

Family

ID=40810546

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08875022T DK2350357T3 (da) 2008-11-14 2008-11-14 Substratholder til at holde et ledende substrat under plettering deraf

Country Status (8)

Country Link
US (1) US20110278162A1 (da)
EP (1) EP2350357B1 (da)
JP (1) JP5469178B2 (da)
KR (1) KR20110088571A (da)
CN (1) CN102257186B (da)
DK (1) DK2350357T3 (da)
TW (1) TWI468552B (da)
WO (1) WO2010054677A1 (da)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009021561A1 (de) * 2009-05-15 2010-11-18 Rolls-Royce Deutschland Ltd & Co Kg Verfahren und Vorrichtung zum Oberflächenätzen von integral beschaufelten Rotoren
US9653339B2 (en) 2010-02-16 2017-05-16 Deca Technologies Inc. Integrated shielding for wafer plating
WO2012007521A1 (en) * 2010-07-15 2012-01-19 Replisaurus Group Sas A contact sheet for arrangement between a chuck and a master electrode in an ecpr process
KR101181983B1 (ko) 2010-08-04 2012-09-11 삼성전기주식회사 인쇄회로기판 도금용 지그 및 이를 이용한 도금방법
US8317987B2 (en) * 2010-09-23 2012-11-27 Sunpower Corporation Non-permeable substrate carrier for electroplating
JP5750327B2 (ja) * 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
TWI580814B (zh) 2010-10-21 2017-05-01 荏原製作所股份有限公司 基板處理裝置，以及鍍覆裝置及鍍覆方法
JP2014080645A (ja) * 2012-10-15 2014-05-08 I Plant:Kk 基板保持装置
US10373839B2 (en) * 2013-09-11 2019-08-06 Infineon Technologies Ag Wafer contacting device, and arrangement and method for electrochemical etching of a wafer
US20150147883A1 (en) * 2013-11-22 2015-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP Cleaning and Apparatus for Performing the Same
CN104975338B (zh) * 2014-04-02 2018-09-07 盛美半导体设备（上海）有限公司 电化学抛光的金属阳极及其密封结构
CN105316739B (zh) * 2014-06-11 2017-10-20 上海梅山钢铁股份有限公司 一种模拟带钢不同线速度的连续电镀试验装置
EP3034657B1 (en) * 2014-12-19 2019-02-27 ATOTECH Deutschland GmbH Substrate holder for vertical galvanic metal deposition
TWI570280B (zh) * 2015-12-16 2017-02-11 茂迪股份有限公司 太陽能電池電鍍陰極治具及應用其之電鍍裝置
JP6596372B2 (ja) * 2016-03-22 2019-10-23 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6713863B2 (ja) 2016-07-13 2020-06-24 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
JP6621721B2 (ja) * 2016-08-31 2019-12-18 株式会社多加良製作所 平板治具、樹脂成形装置および樹脂成形方法
JP6963524B2 (ja) 2018-03-20 2021-11-10 キオクシア株式会社 電解メッキ装置
CN111663161B (zh) * 2020-07-16 2024-03-12 合肥微睿科技股份有限公司 一种大尺寸上部电极板阳极氧化用挂具
CN113882004B (zh) * 2021-10-28 2023-04-21 京东方科技集团股份有限公司 基板载具和电化学沉积设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2737416B2 (ja) * 1991-01-31 1998-04-08 日本電気株式会社 めっき処理装置
JPH05166815A (ja) * 1991-12-16 1993-07-02 Matsushita Electron Corp メッキバンプ形成方法及びそれに用いるウエーハメッキ用治具
US6322678B1 (en) * 1998-07-11 2001-11-27 Semitool, Inc. Electroplating reactor including back-side electrical contact apparatus
US6106680A (en) * 1999-01-26 2000-08-22 Amd Apparatus for forming a copper interconnect
JP2001316870A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
SE523309E (sv) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
JP2003268594A (ja) * 2002-03-12 2003-09-25 Hitachi Kyowa Engineering Co Ltd 基板上への電解めっき方法および装置並びに基板
US7067045B2 (en) * 2002-10-18 2006-06-27 Applied Materials, Inc. Method and apparatus for sealing electrical contacts during an electrochemical deposition process
JP2005133113A (ja) * 2003-10-28 2005-05-26 Fujitsu Ltd めっき装置
JP4937655B2 (ja) * 2006-07-18 2012-05-23 株式会社東設 電気めっき装置

Also Published As

Publication number Publication date
TW201020344A (en) 2010-06-01
EP2350357A1 (en) 2011-08-03
US20110278162A1 (en) 2011-11-17
CN102257186B (zh) 2014-10-15
TWI468552B (zh) 2015-01-11
JP2012508814A (ja) 2012-04-12
WO2010054677A1 (en) 2010-05-20
JP5469178B2 (ja) 2014-04-09
KR20110088571A (ko) 2011-08-03
CN102257186A (zh) 2011-11-23
EP2350357B1 (en) 2019-08-21

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